REVISIONS
LTR
D
DESCRIPTION
Table I; Changed the max limit for I
CC
for device types 06 through 09
from 150 mA to 180 mA. Changed the max limit for I
CCDR
for device
types 06 through 09 from 6.4 mA to 7.0 mA. -sld
Added cage code 0EU86 fro device types 05 through 08. Figure 1;
case outline Y, changed dimension C (min) from 0.009 to 0.008
inches, dimension D (min) from 1.654 to 1.584 inches, dimension E
(max) from 0.604 to 0.605 inches and dimension Q (max) from 0.047
to 0.060 inches. Added a monolithic block diagram to figure 6. -sld
Added note to paragraph 1.2.2 and table I to regarding the 4
transistor design. Added thermal resistance ratings for all case
outlines to paragraph 1.3. Editorial changes throughout. -sld
Table I; Change the min limit for t
OH
as follows: For device types 01-
03 change from 15 ns to 3 ns. For device type 04 change from 5 ns to
3 ns. For device types 05-09 change from 3 ns to 0 ns. -gjc
DATE (YR-MO-DA)
98-06-22
APPROVED
K. A. Cottongim
E
99-11-01
Raymond Monnin
F
00-07-11
Raymond Monnin
G
02-04-02
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
G
15
G
16
G
17
G
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
G
19
G
20
G
1
G
2
G
3
G
4
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
COLUMBUS, OHIO 43216-5000
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, MEMORY, HYBRID AND
MONOLITHIC, DIGITAL, STATIC RANDOM
ACCESS MEMORY, CMOS, 256K x 8-BIT
DRAWING APPROVAL DATE
93-04-01
REVISION LEVEL
G
SIZE
A
SHEET
CAGE CODE
67268
1 OF
19
5962-93157
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E291-02
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type 1/
01
02
03
04
05
06
07
08
09
Generic number
Circuit function
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
SRAM, 256K x 8-bit
Access time
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
93157
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
WS256K8-120CQ
WS256K8-100CQ
WS256K8-85CQ
WS256K8-70CQ
WS256K8-55CQ, AS5C2008CW-55/HQ
WS256K8-45CQ, AS5C2008CW-45/HQ
W2568K8-35CQ, AS5C2008CW-35/HQ
WS256K8-25CQ, AS5C2008CW-25/HQ
WS256K8-20CQ
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
1/ Due to the nature of the 4 transistor design of the die in these device types, topologically pure testing is important,
particularly for high reliability applications. The device manufacturer should be consulted concerning their testing
methods and algorithms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
G
5962-93157
SHEET
2
DSCC FORM 2234
APR 97
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
E
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
32
32
Package style
Dual-in-line, dual cavity
Dual-in-line, single cavity
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
)........................................................
Signal voltage range (any pin)...................................................
Power dissipation (P
D
)...............................................................
Thermal resistance, junction- to case (θ
JC
):
Case outline X........................................................................
Case outline Y........................................................................
Storage temperature range .......................................................
Lead temperature (soldering, 10 seconds)................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)........................................................
Input low voltage range (V
IL
)......................................................
Input high voltage range (V
IH
)....................................................
Output low voltage, maximum (V
OL
) ..........................................
Output high voltage, minimum (V
OH
) .........................................
Case operating temperature range (T
C
) ....................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.2 V dc to V
CC
+0.3 V dc
+0.4 V dc
+2.4 V dc
-55°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
1W
6.40°C/W
7.57°C/W
-65°C to +150°C
+300°C
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
G
5962-93157
SHEET
3
DSCC FORM 2234
APR 97
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.
3.2.5 Block diagram. The block diagram shall be as specified on figure 6.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 7.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
A
REVISION LEVEL
G
5962-93157
SHEET
4
DSCC FORM 2234
APR 97
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
G
5962-93157
SHEET
5
DSCC FORM 2234
APR 97
stm32/stm8
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