S4041-1B1
8 GB / 16 GB, 3.0 V e.MMC Flash
Features
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Key Supported Features
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e.MMC 4.51 Specification compatible
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Backward compatible with previous e.MMC specifications
Storage temperature
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40 °C to +85 °C
Operating voltage
❐
V
CCQ
: 1.7 V - 1.95 V or 2.7 V - 3.6 V
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V
CC
: 2.7 V - 3.6 V
Density: 8/16 GB of data storage
Data bus width:
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SDR mode: 1 bit, 4 bit, 8 bit
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DDR mode: 4 bit, 8 bit
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HS200 mode: 4 bit, 8 bit
Clock frequency: 52 MHz, 200 MHz (e.MMC 4.51)
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SDR mode: up to 52 MHz
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DDR mode: up to 52 MHz
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HS200 mode: up to 200 MHz
BGA packages
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153-ball VFBGA: 13 mm
11.5 mm
1.0 mm
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100-ball LBGA: 18 mm
14 mm
1.4 mm
Operating temperature range
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Embedded:
25 °C to +85 °C
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Industrial:
40 °C to +85 °C
Boot Operation
Partition Management
Boot Area Partition
Replay Protected Memory Block (RPMB)
Sleep (CMD5)
Sanitize
Trim
High Priority Interrupt
Background Operations
Auto Background Operations
Hardware Reset
HS200
Health Monitoring
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Performance
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Sequential Read (MB/s): 120
Sequential Write (MB/s): 20
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Based on 16-GB device
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Bus in x8 I/O and HS200 modes
Random Read (IOPS): 5000
Random Write (IOPS): 1400
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Cypress Semiconductor Corporation
Document Number: 002-02760 Rev. *H
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised March 03, 2016
S4041-1B1
General Description
Cypress
®
e.MMC is a managed NAND memory solution designed for embedded applications. Cypress e.MMC includes a flash
controller and a standard MLC NAND flash memory, and is compatible with the JEDEC JESD84-B451 with backwards compatibility
to previous e.MMC specifications.
Designed for faster throughput and large data transfer, Cypress e.MMC offers high performance, great reliability, and minimal latency.
In addition to higher performance, Cypress’s e.MMC offers optimum power management features resulting in reduced power
consumption, making it an ideal solution for mobile applications.
In addition, highly optimized Cypress firmware fully utilizes the MLC NAND capabilities leveraging wear-leveling, defect management,
garbage collection, and ECC to enhance product life.
The Cypress e.MMC product family offers a vast array of the JEDEC e.MMC features including HS200, high priority interrupt (HPI),
boot partitions, RPMB partitions, background operations, hardware reset, and power off notification.
Combined with an advanced e.MMC feature set and Cypress’s commitment to quality, Cypress e.MMC is ideal for industrial applica-
tions as well as set top boxes, gaming consoles, and consumer electronic devices.
Cypress Product Offering
The Cypress e.MMC product offering includes: 8/16 GB in 153-FBGA (13 mm
11.5 mm) and 100-BGA (18 mm
14 mm) packages.
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8 GB: S40410081
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153 VFBGA (13
11.5
1.0, 0.5 mm ball pitch)
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100 LBGA (18
14
1.4, 1.0 mm ball pitch)
16 GB: S40410161
❐
153 VFBGA (13
11.5
1.0, 0.5 mm ball pitch)
❐
100 LBGA (18
14
1.4, 1.0 mm ball pitch)
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Document Number: 002-02760 Rev. *H
Page 2 of 29
S4041-1B1
Contents
Package Configurations .................................................. 4
Architecture ...................................................................... 6
Key Supported e.MMC Features
..................................... 7
Boot Operation ............................................................ 7
Partition Management ................................................. 7
Sleep (CMD5) .............................................................. 8
High Priority Interrupt (HPI) ......................................... 8
Background Operations ............................................... 8
Auto Background Operations ...................................... 8
Trim ............................................................................. 8
Sanitize ........................................................................ 8
Hardware Reset .......................................................... 8
Health Monitoring ........................................................ 9
Field Firmware Update ................................................ 9
Register Values ............................................................... 10
Operating Conditions Register .................................. 10
Card Identification Register ....................................... 10
Product Table ............................................................ 10
Card Specific Data Register ...................................... 11
Extended CSD Register (EXT_CSD) ........................ 12
AC Parameter
.................................................................. 18
Bus Timing ................................................................ 18
High Speed Timing .................................................... 18
Backward Compatible Timing .................................... 19
DDR Interface Timing ................................................ 19
Timing Specifications for HS200 Mode ..................... 20
Signal Levels ............................................................. 23
Open-Drain Mode Bus Signal Level .......................... 23
Push-Pull Mode Bus Signal Level —
High Voltage e.MMC ................................................. 23
Push-Pull Bus Signal Level —
Dual Voltage e.MMC ................................................. 23
DC Parameter
.................................................................. 24
Supply Voltage .......................................................... 24
Bus Operating Condition ........................................... 24
Power Consumption (Temperature = 25 °C) ............. 24
Ordering Information ...................................................... 25
Valid Combinations ................................................... 25
Package Diagrams .......................................................... 26
Document History Page ................................................. 28
Sales, Solutions, and Legal Information ...................... 29
Worldwide Sales and Design Support ....................... 29
Products .................................................................... 29
PSoC® Solutions ...................................................... 29
Cypress Developer Community ................................. 29
Technical Support ..................................................... 29
Document Number: 002-02760 Rev. *H
Page 3 of 29
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