FIFO, 2KX9, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 厂商名称 | SHARP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-28 |
| Reach Compliance Code | unknown |
| 周期时间 | 45 ns |
| JESD-30 代码 | R-PDIP-T28 |
| 长度 | 34.67 mm |
| 内存密度 | 18432 bit |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2KX9 |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| LH540203D35 | LH540203D25 | LH540203U25 | LH540203U15 | |
|---|---|---|---|---|
| 描述 | FIFO, 2KX9, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 2KX9, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 2KX9, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 | FIFO, 2KX9, Asynchronous, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 |
| 厂商名称 | SHARP | SHARP | SHARP | SHARP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.450 INCH, PLASTIC, LCC-32 | 0.450 INCH, PLASTIC, LCC-32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 周期时间 | 45 ns | 35 ns | 35 ns | 25 ns |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 |
| 长度 | 34.67 mm | 34.67 mm | 13.97 mm | 13.97 mm |
| 内存密度 | 18432 bit | 18432 bit | 18432 bit | 18432 bit |
| 内存宽度 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 32 | 32 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2KX9 | 2KX9 | 2KX9 | 2KX9 |
| 可输出 | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 4.57 mm | 3.55 mm | 3.55 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD |
| 宽度 | 7.62 mm | 7.62 mm | 11.43 mm | 11.43 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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