Metal Glaze
™
Surface Mount
Precision Power Chip
PPC Series
•
Surge tolerant
•
Up to 1000 volts
•
Tight TCR - 25 ppm/°C
•
Tolerance down to ±0.1%
Solder over nickel
barrier
High
temperature
dielectric
coating
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Electrical Data
Size
Code
B
D
F
H
Industry
Footprint
1206
2010
2512
3610
IRC
Type
PPC1/8
PPC1/2
PPC1
PPC2
Power
Rating at
70°C (W)
1/8 W
1/2 W
1W
2W 1.33W
Working
Voltage
200
300
350
500
Resistance
Range
(ohms)
100 - 10K
100 - 10K
100 - 10K
100 - 10K
0.1% (B)
0.25% (C)
0.5% (D)
Tolerance
(±%)
Qty /
Reel (7")
2500
1500
N/A
N/A
Qty /
Reel (13")
10000
5000
5000
1500
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Maximum Change
As specified
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±1% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5 2.5 x
√
for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C
for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60
seconds
Chip mounted in center of 90mm long board, deflected 1mm
so as to exert pull on chip contacts for 5 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
PPC Series Issue November 2008 Sheet 1 of 3
Metal Glaze
™
Surface Mount
Precision Power Chip
Physical Data
L
C
W
Size Code
B
D
F
H
Industry
Footprint
1206
2010
2512
3610
Dimensions (Inches and (mm))
Actual Size
L
0.128 ± 0.007
(3.25 ± 0.18)
0.200 ± 0.010
(5.08 ± 0.25)
0.251 ± 0.010
(6.38 ± 0.25)
0.367 ± 0.010
(9.32 ± 0.25)
W
0.057 ± 0.006
(1.45 ± 0.15)
0.079 ± 0.006
(2.01 ± 0.15)
0.079 ± 0.006
(2.01 ± 0.15)
0.105 ± 0.006
(2.67 ± 0.15)
C
0.020 ± 0.010
(0.51 ± 0.25)
0.030 ± 0.010
(0.761 ± 0.25)
0.040 ± 0.010
(1.02 ± 0.25)
0.050 ± 0.010
(1.27 ± 0.25)
Recommended Solder Pad Dimensions (Reflow):
To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide
a large repeatable solder fillet to the PPC resistor on reflow processes and will provide maximum heat transfert
to the PC board in high power applications. By placing the PPC on the solder paste while the paste is in the
"tacky" state, the PPC will be held in position until solder reflow begins. The pad design thes uses the surface
tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising
above the board level directly beneath the PPC is not recommended.
Recommended Solder Pad Dimensions (Reflow):
F
A
C
A
B
E
D
Size
Code
B
D
F
H
Industry
Footprint
1206
2010
2512
3610
Dimensions (Inches and mm))
A
0.076
(1.93)
0.111
(2.82)
0.121
(3.07)
0.170
(4.32)
B
0.093
(2.36)
0.126
(3.20)
0.126
(3.20)
0.160
(4.06)
C
0.058
(1.47)
0.096
(2.44)
0.127
(3.23)
0.213
(5.41)
D
0.098
(2.49)
0.152
(3.86)
0.183
(4.65)
0.273
(6.93)
E
0.032
(0.81)
0.040
(1.02)
0.040
(1.02)
0.044
(1.12)
F
0.211
(5.36)
0.318
(8.08)
0.369
(9.37)
0.553
(14.05)
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPC Series Issue November 2008 Sheet 2 of 3
Metal Glaze
™
Surface Mount
Precision Power Chip
Standard Reel Packaging Per EIA-481
Size
Code
B
D
F
H
Industry
Footprint
1206
2010
2512
3610
Reel
Diameter*
7", 13"
7", 13"
13"
7"
Quantity Per Reel
2,500 max., 10,000 max.
1,500 max., 5,000 max.
5,000 max.
1,500 max.
Carrier Tape Width
8mm
12mm
12mm
24mm
Component Pitch
4mm
4mm
4mm
4mm
* The 13" reel is considered standard and will be supplied unless otherwise specified.
Power Derating Curve
100
PPC 1/8, 1/2, 1
Repetitive Surge Curve
1000
% of Rated Power
80
Peak Power (watts)
PPC 2
100
60
PPC 2
PPC 1
40
20
0
10
PPC 1/8
PPC
1/2
30
40
50 60
70
80
90 100 110 120 130 140 150
1
0.0001
.1msec
Ambient Temperature (°C)
0.0010
1msec
0.0100
10msec
Ordering Data
Specify type, resistance, tolerance, RoHS-Compliance and packaging.
This example is for a Surface Mount Precision Power Chip.
100msec
0.1000
10000msec
1.0000
Surge or Pulse Duration (seconds)
Sample Part No.
IRC Type
PPC1 25
1001
F
LF
13
PPC 1/8, 1/2, 1, 2
(≥100Ω - First 3 significant digits plus 4th digit multiplier)
Example: 100Ω = 1000; 1000Ω = 1001
(>100Ω - "R" is used to designate decimal)
Example: 10Ω = 10R0; 0.25Ω = R250
Resistance Value (EIA 4-digit code)
Tolerance (EIA format)
B = ±0.1%, C = ±0.25%, D = ±0.5%
RoHS Indicator
LF indicates RoHS compliance
Blank designates 60% Sn / 40% Pb Solder
Packaging
(BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel)
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPC Series Issue November 2008 Sheet 3 of 3
NXP MCU
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