Buffer, CMOS, CDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | RCA |
包装说明 | DIP-16 |
Reach Compliance Code | unknown |
系列 | HC/UH |
JESD-30 代码 | R-CDIP-T16 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUFFER |
最大I(ol) | 0.004 A |
功能数量 | 6 |
输入次数 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 2/6 V |
Prop。Delay @ Nom-Sup | 26 ns |
传播延迟(tpd) | 130 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
筛选级别 | 38535Q/M;38534H;883B |
标称供电电压 (Vsup) | 4.5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
CD54HC4050F/3A | CD54HC4050FX | CD54HC4050F/3 | CD54HC4050F/3W | CD74HC4050M96 | CD74HC4050MX | |
---|---|---|---|---|---|---|
描述 | Buffer, CMOS, CDIP16 | Buffer, CMOS, CDIP16 | Buffer, CMOS, CDIP16 | Buffer, CMOS, CDIP16 | Buffer, CMOS, PDSO16, | Buffer, CMOS, PDSO16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-CDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | SOP | SOP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | SOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Sup | 26 ns | 26 ns | 26 ns | 26 ns | 21 ns | 21 ns |
施密特触发器 | NO | NO | NO | NO | NO | NO |
表面贴装 | NO | NO | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
厂商名称 | RCA | RCA | RCA | RCA | - | - |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
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