Buffer, CMOS, CDIP16,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | RCA |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUFFER |
| 最大I(ol) | 0.004 A |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Sup | 26 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| CD54HC4050F | CD74HC4049H | CD54HC4050H | CD74HC4049E | CD74HC4050M | CD54HC4049H | CD74HC4050H | CD74HC4050E | CD54HC4049F | CD74HC4049M | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Buffer, CMOS, CDIP16, | Inverter, CMOS, | Buffer, CMOS, | Inverter, CMOS, PDIP16, | Buffer, CMOS, PDSO16, | Inverter, CMOS, | Buffer, CMOS, | Buffer, CMOS, PDIP16, | Inverter, CMOS, CDIP16, | Inverter, CMOS, PDSO16, |
| 包装说明 | DIP, DIP16,.3 | , DIE OR CHIP | , DIE OR CHIP | DIP, DIP16,.3 | SOP, SOP16,.25 | , DIE OR CHIP | , DIE OR CHIP | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUFFER | INVERTER | BUFFER | INVERTER | BUFFER | INVERTER | BUFFER | BUFFER | INVERTER | INVERTER |
| 最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| 封装等效代码 | DIP16,.3 | DIE OR CHIP | DIE OR CHIP | DIP16,.3 | SOP16,.25 | DIE OR CHIP | DIE OR CHIP | DIP16,.3 | DIP16,.3 | SOP16,.25 |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Sup | 26 ns | 21 ns | 26 ns | 21 ns | 21 ns | 26 ns | 21 ns | 21 ns | 26 ns | 21 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | RCA | RCA | RCA | RCA | - | - | RCA | RCA | RCA | RCA |
| JESD-30 代码 | R-XDIP-T16 | - | - | R-PDIP-T16 | R-PDSO-G16 | - | - | R-PDIP-T16 | R-XDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | - | - | e0 | e0 | - | - | e0 | e0 | e0 |
| 端子数量 | 16 | - | - | 16 | 16 | - | - | 16 | 16 | 16 |
| 封装主体材料 | CERAMIC | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | - | - | DIP | SOP | - | - | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | - | IN-LINE | SMALL OUTLINE | - | - | IN-LINE | IN-LINE | SMALL OUTLINE |
| 表面贴装 | NO | - | - | NO | YES | - | - | NO | NO | YES |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | - | THROUGH-HOLE | GULL WING | - | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | - | - | 2.54 mm | 1.27 mm | - | - | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | - | - | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
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