The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 1 May 2013.
INCH-POUND
MIL-PRF-19500/406K
w/AMENDMENT 2
1 April 2013
SUPERSEDING
MIL-PRF-19500/406K
w/AMENDMENT 1
9 November 2012
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR,
TYPES 1N4460, 1N4460C, 1N4460D THROUGH 1N4496, 1N4496C, 1N4496D, AND 1N6485, 1N6485C, 1N6485D
THROUGH 1N6491, 1N6491C, 1N6491D, 1N4460US, 1N4460CUS, 1N4460DUS THROUGH 1N4496US,
1N4496CUS, 1N4496DUS, AND 1N6485US, 1N6485CUS, 1N6485DUS THROUGH 1N6491US, 1N6491CUS,
1N6491DUS, 1N4460UM THROUGH 1N4496UM, PLUS C AND D TOLERANCE SUFFIX; JAN, JANTX, JANTXV,
AND JANS
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein
shall consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for micro-miniature 1.5 watt silicon, low
leakage, voltage regulator diodes with tolerances of 5 percent, 2 percent, and 1 percent. Four levels of product
assurance are provided for each encapsulated device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See
figure 1
(DO-41),
figure 2
(surface mount), and figure 3 (UM surface mount).
1.3 Maximum ratings. T
STG
= T
J(max)
= -65°C to +175°C. Maximum ratings are as shown in maximum and primary
test ratings (see
3.11)
herein and as follows:
P
T
at
T
L
= +112ºC
L =
.375
inch
(9.53 mm)
1.5 W
(1)
P
T
at T
EC
=
+145ºC
1.5 W
(2)
P
T(PCB1)
at T
A
=
+55ºC
0.6 W
(3)
R
θJL
at
L =
.375
inch
P
T(PCB2)
P
T
(9.52 mm)
T
A
= +55ºC
At T
SP
= +25°C
1.5 W
(4)
1.5 W
(5)
42ºC/W
(6)
Barometric pressure reduced
(high altitude operation)
8 mm Hg
R
θJEC
20ºC/W
(6) (7)
R
θJSP
56°C/W
(8)
R
θJA(PCB1)
200ºC/W
(3)
R
θJA(PCB2)
80ºC/W
(4)
(1)
Derate: See
figure
4
herein
.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Derate: See
figure
5
herein.
Derate: See
figure
6
herein and
6.4.1
(PCB1) herein.
Derate: See
figure
7
herein and
6.4.2
(PCB2) herein.
Derate: See
figure
8
herein.
See figures
9
and
10
herein.
See figures
11
and
12
herein.
See
figure 13
herein.
Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dla.mil
.
Since contact
information can change, you may want to verify the currency of this address information using the ASSIST Online
database at
https://assist.dla.mil .
AMSC N/A
FSC 5961
MIL-PRF-19500/406K
w/AMENDMENT 2
1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in maximum and primary test
ratings (see
3.11)
and as follows: 3.3 V dc
≤
V
Z
≤
200 V dc (nominal).
a. 1N4460D through 1N4496D and 1N6485D through 1N6491D are 1 percent voltage tolerance.
b. 1N4460C through 1N4496C and 1N6485C through 1N6491C are 2 percent voltage tolerance.
c. 1N4460 through 1N4496 and 1N6485 through 1N6491 are 5 percent voltage tolerance.
R
θJL
= 42°C/W (max) at L =
.
375 inch (9.52 mm) (nonsurface mount).
R
θJEC
= 20ºC/W (max) (non-surface mount).
For thermal impedance curves, see figures
9, 10, 11, 12
and
13.
R
θJSP
= 56°C/W (max) (UM surface mount).
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or
https://assist.dla.mil
. or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
2
MIL-PRF-19500/406K
w/AMENDMENT 2
Ltr
BD
BL
LD
LL
LU
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.060
.085
1.52
2.16
.106
.160
2.69
4.06
.028
.032
0.71
0.81
.800
1.300
20.32 33.02
.050
1.27
Notes
3
3
4
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Package contour optional with BD and length BL. Heat slugs, if any, shall be included within this
cylinder length but shall not be subject to minimum limit of BD.
4. The specified lead diameters apply in the zone between .050 inch (1.27 mm) from the diode body and
the end of the lead.
5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
FIGURE 1. Physical dimensions of non-surface mount device (DO-41).
3
MIL-PRF-19500/406K
w/AMENDMENT 2
US
Ltr
BD
BL
ECT
S
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.091
.103
2.31
2.62
.168
.200
4.28
5.08
.019
.028
0.48
0.71
.003
0.08
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
FIGURE 2. Physical dimensions of surface mount device (US).
4
MIL-PRF-19500/406K
w/AMENDMENT 2
Ltr
BL
BW
BH
LW
LL1
LL2
LS1
CH
CL
CW
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.192
.202
4.877
5.131
.093
.104
2.362
2.642
.044
.062
1.117
1.574
.030
.083
.0024
.144
.020
.179
.081
.044
.094
.0035
.155
.034
.191
.093
.762
2.108
.0609
3.657
.508
4.546
2.057
1.118
2.387
.0889
3.937
.864
4.851
2.362
FIGURE 3. Physical dimensions of DPC surface mount device, UM.
5
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