circuits, AC power cross, induction and lightning surges.
Line Out/
Line In
TBU
®
Device
UL
Description
File Number: E315805
The TBU
®
high-speed protector placed in the system circuit will monitor the current with
the MOSFET detection circuit triggering to provide an effective barrier behind which
sensitive electronics will not be exposed to large voltages or currents during surge
events. The TBU
®
device is provided in a surface mount DFN package and meets
industry standard requirements such as RoHS and Pb Free solder reflow profiles.
Absolute Maximum Ratings (@ T
A
= 25 °C Unless Otherwise Noted)
Symbol
V
imp
Parameter
Peak impulse voltage withstand with duration less than 10 ms
Part Number
TBU-CA025-xxx-WH
TBU-CA040-xxx-WH
TBU-CA050-xxx-WH
TBU-CA065-xxx-WH
TBU-CA085-xxx-WH
TBU-CA025-xxx-WH
TBU-CA040-xxx-WH
TBU-CA050-xxx-WH
TBU-CA065-xxx-WH
TBU-CA085-xxx-WH
Value
250
400
500
650
850
100
200
250
300
425
Unit
V
V
rms
T
op
T
stg
Continuous A.C. RMS voltage
Operating temperature range
Storage temperature range
V
°C
°C
ESD
T
jmax
HBM ESD protection per IEC 61000-4-2
Maximum Junction Temperature
-55 to +125
-65 to +150
+125
±2
kV
°C
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA:
Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-CA Series - TBU
®
High-Speed Protectors
Electrical Characteristics (@ T
A
= 25 °C Unless Otherwise Noted)
Symbol
Parameter
Current required for the device to go from operating state to
protected state
V
imp
= 250 V
V
imp
= 250 V
V
imp
= 250 V
V
imp
= 250 V
V
imp
= 250 V
V
imp
= 400 V
V
imp
= 400 V
V
imp
= 400 V
V
imp
= 400 V
V
imp
= 400 V
V
imp
= 500 V
V
imp
= 500 V
V
imp
= 500 V
V
imp
= 500 V
V
imp
= 500 V
V
imp
= 650 V
V
imp
= 650 V
V
imp
= 650 V
V
imp
= 650 V
V
imp
= 650 V
V
imp
= 850 V
V
imp
= 850 V
V
imp
= 850 V
V
imp
= 850 V
V
imp
= 850 V
I
trigger
(min.) = 50 mA
I
trigger
(min.) = 100 mA
I
trigger
(min.) = 200 mA
I
trigger
(min.) = 300 mA
I
trigger
(min.) = 500 mA
I
trigger
(min.) = 50 mA
I
trigger
(min.) = 100 mA
I
trigger
(min.) = 200 mA
I
trigger
(min.) = 300 mA
I
trigger
(min.) = 500 mA
I
trigger
(min.) = 50 mA
I
trigger
(min.) = 100 mA
I
trigger
(min.) = 200 mA
I
trigger
(min.) = 300 mA
I
trigger
(min.) = 500 mA
I
trigger
(min.) = 50 mA
I
trigger
(min.) = 100 mA
I
trigger
(min.) = 200 mA
I
trigger
(min.) = 300 mA
I
trigger
(min.) = 500 mA
I
trigger
(min.) = 50 mA
I
trigger
(min.) = 100 mA
I
trigger
(min.) = 200 mA
I
trigger
(min.) = 300 mA
I
trigger
(min.) = 500 mA
Part Number
TBU-CAxxx-050-WH
TBU-CAxxx-100-WH
TBU-CAxxx-200-WH
TBU-CAxxx-300-WH
TBU-CAxxx-500-WH
TBU-CA025-050-WH
TBU-CA025-100-WH
TBU-CA025-200-WH
TBU-CA025-300-WH
TBU-CA025-500-WH
TBU-CA040-050-WH
TBU-CA040-100-WH
TBU-CA040-200-WH
TBU-CA040-300-WH
TBU-CA040-500-WH
TBU-CA050-050-WH
TBU-CA050-100-WH
TBU-CA050-200-WH
TBU-CA050-300-WH
TBU-CA050-500-WH
TBU-CA065-050-WH
TBU-CA065-100-WH
TBU-CA065-200-WH
TBU-CA065-300-WH
TBU-CA065-500-WH
TBU-CA085-050-WH
TBU-CA085-100-WH
TBU-CA085-200-WH
TBU-CA085-300-WH
TBU-CA085-500-WH
0.25
12
Min.
50
100
200
300
500
Typ.
75
150
300
450
750
13.3
7.1
4.2
3.2
2.6
14.3
8.1
5.2
4.3
3.6
15.7
9.5
6.6
5.6
5.0
17.7
11.5
8.6
7.6
7.0
21.4
15.2
12.3
11.3
10.7
0.50
16
98
40
Max.
100
200
400
600
1000
15.3
8.2
4.8
3.8
3.0
16.5
9.4
6.0
5.0
4.2
18.0
10.9
7.5
6.5
5.7
20.3
13.2
9.8
8.8
8.0
24.5
17.4
14.0
13.0
12.2
1
1.00
20
µs
mA
V
°C/W
°C/W
Unit
I
trigger
mA
R
device
Series resistance of
the TBU device
Ω
V
reset
I
Q
t
block
Time for the device to go from normal operating state to protected state
Current through the triggered TBU
®
device with 50 Vdc circuit voltage
Voltage below which the triggered TBU
®
device will transition to normal operating state
Junction to package pads - FR4 using recommended pad layout
Junction to package pads - FR4 using heat sink on board (6 cm
2
) (1 in
2
)
R
th(j-l)
R
th(j-l)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-CA Series - TBU
®
High-Speed Protectors
Reference Application
The TBU
®
devices are general use protectors used in a wide
variety of applications. The maximum voltage rating of the TBU
®
device should never be exceeded. Where necessary, an OVP
should be employed to limit the maximum voltage. A cost-
effective protection solution combines Bourns
®
TBU
®
protection
devices with a pair of Bourns
®
MOVs. For bandwidth sensitive
applications, a Bourns
®
GDT may be substituted for the MOV.
Basic TBU Operation
The TBU
®
device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the current
with the MOSFET detection circuit triggering to provide an
effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during surge events. The
TBU
®
device operates in approximately 1 μs - once line current
exceeds the TBU
®
device’s trigger current I
trigger
. When operat-
ed, the TBU
®
device will limit the current to less than the I
trigger
value within the t
block
duration. If voltage above V
reset
is contin-
uously sustained, the TBU
®
device will subsequently reduce the
current to a quiescent current level within a period of time that is
dependent upon the applied voltage.
After the surge, the TBU
®
device resets when the voltage
across the TBU
®
device falls to the V
reset
level. The TBU
®
device will automatically reset on lines which have no DC bias
or have DC bias below V
reset
(such as unpowered signal lines).
Line Out
/ Line In
TBU
®
Device
TBU
®
Device
Line Out
/ Line In
Line In /
Line Out
OVP
Line
Equip.
OVP
Line In /
Line Out
Line
If the line has a normal DC bias above V
reset
, the voltage
across the TBU
®
device may not fall below V
reset
after the
surge. In such cases, special care needs to be taken to ensure
that the TBU
®
device will reset, with software monitoring as one
method used to accomplish this. Bourns application
engineers can provide further assistance.
Performance Graphs
Typical V-I Characteristics (TBU-CA050-300-WH)
I
TRIP
Typical Trigger Current vs. Temperature
1.8
1.8
1.6
1.6
1.4
1.4
1.2
1.2
1.0
1.0
0.8
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0
-75 -50 -25
-75 -50 -25
0
0
25
25
50
50
75 100 125 150
75 100 125 150
V
RESET
VOLTAGE
(5 V/div)
Normalized Trip Current
Normalized Trip Current
CURRENT
(100 mA/div)
Junction Temperature (°C)
Power Derating Curve
3.0
2.5
Typical Resistance vs. Temperature
No Additional PCB Cu
0.5 sq. in. Additional PCB Cu
2.2
2.2
2.0
2.0
Total Max. Power (W)
2.0
1.5
1.0
0.5
0.0
Normalized Resistance
Normalized Resistance
20
40
60
80
100
120
140
1.8
1.8
1.6
1.6
1.4
1.4
1.2
1.2
1.0
1.0
0.8
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0
-75 -50 -25
-75 -50 -25
Junction Temperature (°C)
0
0
25
25
50
50
75 100 125 150
75 100 125 150
Junction Temperature (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-CA Series - TBU
®
High-Speed Protectors
Product Dimensions
0.70
(.028)
1.85
(.073)
6.50 ± 0.10
(.256 ± .004)
0.30
(.012)
0.80
(.031)
0.70
(.028)
1.85
(.073)
4.00 ± 0.10
(.157 ± .004)
XXXXX
YWWLL
6.50 ± 0.10
PIN 1 & BACKSIDE CHAMFER
(.256 ± .004)
0.80 - 1.00
A=
(.031 - .039)
3.40
(.134)
1.85
(.073)
0.30
0.30
(.012)
(.012)
0.70
(.028)
0.80
(.031)
0.70
(.028)
C
0.25 1.85
PIN
(.073)1
(.010)
4.00 ± 0.10
(.157 ± .004)
SEATING PLANE
DIMENSIONS:
(INCHES)
XXXXX
= 0.00 - 0.05
A1
YWWLL
(.000 - .002)
MM
0.80 - 1.00
A=
(.031 - .039)
3.40
Pad #
(.134)
Pad Designation
Pin Out
Line In/Out
NU
Line Out/In
C
0.25
PIN 1
(.010)
1
2
0.30
3
(.012)
PIN 1 & BACKSIDE CHAMFER
0.80
0.70
(.028)
(.031)
Recommended Pad Layout
(.073)
1.85
1.85
SEATING PLANE
(.073)
A1 =
0.00 - 0.05
(.000 - .002)
TBU
®
High-Speed Protectors have a 100 % matte-tin termination
finish. For improved thermal dissipation, the recommended layout
3.55
3.55
uses PCB copper areas
(.140)
extend beyond the exposed solder
which
(.140)
0.80
pad. The exposed solder pads should be defined by a solder mask
1
3
(.031)
0.70
®
device in size and spac-
which matches the pad layout of the TBU
(.028)
2
ing. It is recommended that they should be the same dimension as
1.85
1.85
the TBU
®
pads but if smaller solder pads
(.073)
used, they should be
are
(.073)
centered on the TBU
®
package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be
3.55
than the TBU
®
pad sizes
larger
(.140)
to ensure adequate clearance is maintained. The recommended
1
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
3
2
opening size 0.025 mm (0.0010 in.) less than the solder pad size.
Extended copper areas beyond the solder pad significantly improve
the junction to ambient thermal resistance, resulting in operation
at lower junction temperatures with a corresponding benefit of reli-
ability. All pads should soldered to the PCB, including pads marked
as NC or NU but no electrical connection should be made to these
pads. For minimum parasitic capacitance, it is recommended that
signal, ground or power signals are not routed beneath any pad.
3
2
1
3
3.55
(.140)
2
1
Dark grey areas show added PCB copper area for better
thermal resistance.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
K
J
B
C
K
E
F
E
J
N
0.70
(.028)
2.625
(.103)
1.15
(.045)
3
A
2
1
H
3.55
(.140)
PIN 1
D
N
TBU-CA Series - TBU High-Speed Protectors
®
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
6 °C/sec. max.
8 min. max.
How to Order
Typical Part Marking
TBU - CA 085 - 500 - WH
Series
CA = Bi-Series
TBU
®
Product
MANUFACTURER’S
TRADEMARK
Impulse Voltage Rating
025 = 250 V
040 = 400 V
050 = 500 V
065 = 650 V
085 = 850 V
Trigger Current
050 = 50 mA
100 = 100 mA
200 = 200 mA
300 = 300 mA
500 = 500 mA
XXXXX
YWWLL
PIN 1
5 DIGIT PRODUCT CODE:
• 1ST ALPHA CHARACTER INDICATES PRODUCT FAMILY:
A = TBU-CA SERIES
• 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE.
• 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT.
MANUFACTURING
DATE CODE:
• 1ST DIGIT INDICATES THE YEAR.
• 2ND & 3RD DIGITS INDICATE THE WEEK NUMBER.
• 4TH & 5TH DIGITS INDICATE LOT CODE.
Hold to Trip Ratio Suffix
W = Hold to Trip Ratio
Package Suffix
H = DFN Package
Thermal Resistance vs Additional PCB Cu Area
120
100
Thermal Resistance (°C/W)
80
60
40
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
三星刚出的旗舰新机Galaxy S III固然不错，但是高昂的价格不是每个人都能承受的起。昨天我们报道了一部山寨版的i9300，而现在该机价格和具体配置已经全部出炉。 这款山寨的Galaxy S III名叫HDC Galaxy S3，其外形甚至UI界面都与原型机异常相似。该机的三围为138×70×9.2mm，配备了一块4.7寸触摸屏，分辨率只有800×480像素。
该机还搭载了...[详细]
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