OM
PL
IA
N
Features
n
High resistance to heat and humidity
Applications
n
Mobile phones
n
Cellular phones
n
CTV, VCR, HIC, FDD
T
*R
oH
S
LE
AD
F
RE
E
pressure
n
Accurate dimensions for automatic
surface mounting
n
Inductance range: 0.12 to 150 µH
n
RoHS compliant*
n
Resistance to mechanical shock and
C
22
0
CM322522 Series - Chip Inductor
General Specifications
Q
Min.
Test
Frequency
(MHz)
SRF
Min.
(MHz)
DCR
Max.
(W)
Electrical Specifications @25 °C
Inductance
Standard
Other
Tol.
Tol.
(%)
(%)
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
CM322522-R12ML
CM322522-R15ML
CM322522-R18ML
CM322522-R22*L
CM322522-R27*L
CM322522-R33*L
CM322522-R39*L
CM322522-R47*L
CM322522-R56*L
CM322522-R68*L
CM322522-R82*L
CM322522-1R0*L
CM322522-1R2*L
CM322522-1R5*L
CM322522-1R8*L
CM322522-2R2*L
CM322522-2R7*L
CM322522-3R3*L
CM322522-3R9*L
CM322522-4R7*L
CM322522-5R6*L
CM322522-6R8*L
CM322522-8R2*L
CM322522-100*L
CM322522-120*L
CM322522-150*L
CM322522-180*L
CM322522-220*L
CM322522-270*L
CM322522-330*L
CM322522-390*L
CM322522-470*L
CM322522-560*L
CM322522-680*L
CM322522-820*L
CM322522-101*L
CM322522-121*L
CM322522-151*L
Bourns
Part No.
IDC
(mA)
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
µH
± 20
± 20
± 20
± 20
± 20
± 20
± 20
± 20
± 20
± 20
± 20
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
N/A
N/A
N/A
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
20
20
20
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
500
450
400
350
320
300
250
220
180
160
140
120
100
85
80
75
70
60
55
50
45
40
35
30
20
20
20
20
20
17
16
15
13
12
11
10
10
8
0.22
0.25
0.28
0.32
0.36
0.4
0.45
0.5
0.55
0.6
0.65
0.7
0.75
0.85
0.9
1
1.1
1.2
1.3
1.5
1.6
1.8
2
2.1
2.5
2.8
3.3
3.7
5
5.6
6.4
7
8
9
10
11
11
15
450
450
450
450
450
450
450
450
450
450
450
400
390
370
350
320
290
260
250
220
200
180
170
150
140
130
120
110
80
70
65
60
55
50
45
40
70
65
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-40 °C to +125 °C
Resistance to Soldering Heat
.............................. 245 °C, 5 seconds
Temperature Rise ..........................20 °C
Rated Current .... Inductance drops 10 %
Moisture Sensitivity Level .....................3
ESD Classification (HBM).................
N/A
Materials
Core ..............................................Ferrite
Wire ...........................Enamelled copper
Enclosure............................. Epoxy resin
Terminal Finish ...................................Sn
Packaging ...... 2,000 pcs. per 7-inch reel
Product Dimensions
2.90 ± 0.2
(.114 ± .008)
2.20 ± 0.2
(.087 ± .008)
0.60 +0.3/-0.0
(.024 +.012/-.000)
3.20 ± 0.4
(.126 ± .016)
0.60 +0.3/-0.0
(.024 +.012/-.000)
0.75 +0.2
(.030 +.008)
2.50 ± 0.2
(.098 ± .008)
0.75 +0.2
(.030 +.008)
1.00 ± 0.2
(.039 ± .008)
* Enter Standard or Other Tolerance Code:
M = ±20 %, K = ±10 %, J = ±5 %
Schematic
Recommended Layout
1.9 ~ 2.4
(.075 ~ .094)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device
performance may vary over time.
Users should verify actual device performance in their specific applications.
1.2 ~ 1.3
(.047 ~ .051)
DIMENSIONS:
MM
(INCHES)
1.2 ~ 1.3
(.047 ~ .051)
1.6 ~ 2.0
(.063 ~ .079)
SRF0504 Series - Line Filter
CM322522 Series - Chip Inductor
Soldering Profile
Temperature
Rising Area
Preheat
Area
150~200 °C / 60~180 Sec.
Reflow
Area
Forced
Cooling Area
6 °C/Sec. Max.
Temperature (°C)
250
245
217
200
150
Peak Temperature: 250 °C
Peak Temperature
250
max.
Max. Time Above 245
20~40 sec. max.
Max. Time Above 217
60~150 sec. max.
:
20~40 Sec.
60~150 Sec.
100
50
200 °C ~ 250 °C Average Ramp-up Rate:
3 °C / sec. max.
50
100
150
200
250
0
Time (Seconds)
Packaging Specifications
178
DIA.
(7.008)
2.0 ± 0.5
(.079 ± .020)
12.5
(.492)
DIA.
13.0
(.512)
50.0 -0
(1.97 -0)
21.0 ± 0.8
(.827 ± .031)
13.0
DIA.
(.512)
10 +0
(.394 +0)
8.0
(.315)
END
4.0
(.157)
4.0
(.157)
START
100
100
100
100
100
100
100
200
(7.874)
LEADER
COMPONENTS
100
160
(6.299)
TRAILER
MIN.
NO COMPONENT
USER DIRECTION OF FEED
MIN.
NO COMPONENT
QTY: 2000 PCS. PER REEL
DIMENSIONS:
MM
(INCHES)
REV. 08/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
FPGA/CPLD
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