Datasheet> 器件分类 > 半导体> 模拟混合信号IC> TSI721A1-16GCLY

TSI721A1-16GCLY: 产品描述PCI Interface IC Protocol Converter Bridge; 产品类别半导体模拟混合信号IC; 文件大小378KB，共66页; 制造商IDT(艾迪悌); 官网地址http://www.idt.com/

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TSI721A1-16GCLY概述

PCI Interface IC Protocol Converter Bridge

TSI721A1-16GCLY规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	IDT(艾迪悌)
产品种类 Product Category	PCI Interface IC
RoHS	Details
类型 Type	Bridge - PCIe to RapidIO
Maximum Clock Frequency	156.25 MHz
Number of Lanes	4 Lane
Number of Ports	1 Port
最小工作温度 Minimum Operating Temperature	0 C
最大工作温度 Maximum Operating Temperature	+ 70 C
安装风格 Mounting Style	SMD/SMT
封装 / 箱体 Package / Case	FCBGA-143
系列 Packaging	Tray
数据速率 Data Rate	16 Gb/s
Data Bus Width	32/64 bit
Moisture Sensitive	Yes
工厂包装数量 Factory Pack Quantity	10

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Titl

Tsi721

™

Datasheet

April 4, 2016

Table of Contents

About this Document......................................................................................................................6

Overview.................................................................................................................................................................................................... 6

Document Conventions.............................................................................................................................................................................. 6

Revision History......................................................................................................................................................................................... 7

Device Overview............................................................................................................................ 8

1.1

1.2

Features..................................................................................................................................................................................................... 8

1.2.1

PCIe Features ............................................................................................................................................................................ 8

1.2.2

S-RIO Features .......................................................................................................................................................................... 9

1.2.3

Bridging Features ....................................................................................................................................................................... 9

1.2.4

Messaging Features ................................................................................................................................................................. 10

1.2.5

Block DMA Engine Features .................................................................................................................................................... 10

1.2.6

Miscellaneous Features.............................................................................................................................................................11

1.3

Block Diagram.......................................................................................................................................................................................... 12

1.3.1

PCIe Interface........................................................................................................................................................................... 12

1.3.2

S-RIO Interface......................................................................................................................................................................... 12

1.3.3

Messaging Engine.................................................................................................................................................................... 12

1.3.4

Mapping Engine........................................................................................................................................................................ 12

1.3.5

Block DMA Engine.................................................................................................................................................................... 12

1.4

Typical Applications ................................................................................................................................................................................. 13

1.4.1

Defense/Aerospace Application ............................................................................................................................................... 13

1.4.2

Video and Imaging Application ................................................................................................................................................. 15

1.4.3

Wireless Application ................................................................................................................................................................. 15

Signals ......................................................................................................................................... 17

2.1

2.2

Ballmap.................................................................................................................................................................................................... 18

2.3

Pinlist ....................................................................................................................................................................................................... 19

2.4

PCIe Signals ............................................................................................................................................................................................ 19

2.5

S-RIO Signals .......................................................................................................................................................................................... 20

2.6

General Signals ....................................................................................................................................................................................... 20

2.7

I2C Signals .............................................................................................................................................................................................. 21

2.8

JTAG and Test Interface Signals.............................................................................................................................................................. 21

2.9

GPIO Signals ........................................................................................................................................................................................... 22

2.10 Power-up Signals..................................................................................................................................................................................... 23

2.11 Power Supply Signals.............................................................................................................................................................................. 26

Electrical Characteristics ........................................................................................................... 27

3.1

Absolute Maximum Ratings ..................................................................................................................................................................... 27

3.2

Recommended Operating Conditions...................................................................................................................................................... 28

3.3

Power Consumption................................................................................................................................................................................. 28

Tsi721 Datasheet

April 4, 2016

Integrated Device Technology

3.4

3.5

3.6

3.7

Power Supply Sequencing....................................................................................................................................................................... 29

3.4.1

Power-Up Sequencing.............................................................................................................................................................. 29

3.4.2

Power-Down Sequencing ......................................................................................................................................................... 29

DC Operating Characteristics .................................................................................................................................................................. 30

Decoupling Recommendation.................................................................................................................................................................. 31

AC Timing Specifications ......................................................................................................................................................................... 31

3.7.1

PCIe Differential Receiver Specifications ................................................................................................................................. 31

3.7.2

PCIe Differential Transmitter Specifications ............................................................................................................................. 34

3.7.3

RapidIO SerDes Characteristics............................................................................................................................................... 38

3.7.4

Level I Long Run Transmitter Specifications ............................................................................................................................ 43

3.7.5

Reference Clocks – PCCLKP/N and REFCLKP/N ................................................................................................................... 57

3.7.6

JTAG and Test Interface Signal Timings .................................................................................................................................. 59

3.7.7

I2C Interface Signal Timings .................................................................................................................................................... 60

3.7.8

GPIO Interface Signal Timings ................................................................................................................................................. 61

3.7.9

RSTn Signal Timings................................................................................................................................................................ 61

Package Specifications............................................................................................................... 62

4.1

Package Dimensions ............................................................................................................................................................................... 62

4.2

Package Diagrams................................................................................................................................................................................... 63

4.3

Thermal Characteristics........................................................................................................................................................................... 64

4.4

Moisture Sensitivity.................................................................................................................................................................................. 64

Ordering Information ................................................................................................................... 65

Tsi721 Datasheet

April 4, 2016

Integrated Device Technology

List of Figures

Figure 1:

Figure 2:

Figure 3:

Figure 4:

Figure 5:

Figure 6:

Figure 7:

Figure 8:

Figure 9:

Figure 10:

Figure 11:

Figure 12:

Figure 13:

Figure 14:

Figure 15:

Figure 16:

Figure 17:

Defense/Aerospace Application ................................................................................................................................................................ 14

Video and Imaging Application ................................................................................................................................................................. 15

Wireless Application .................................................................................................................................................................................. 16

Ballmap ....................................................................................................................................................................................................... 18

S-RIO Definition of Transmitter Amplitude and Swing ................................................................................................................................ 39

S-RIO Transition Symbol Transmit Eye Mask............................................................................................................................................. 44

S-RIO Single Frequency Sinusoidal Jitter Limits ........................................................................................................................................ 46

S-RIO Level I Receiver Input Mask............................................................................................................................................................. 47

Transition and Steady State Symbol Eye Mask .......................................................................................................................................... 51

Level II Receiver Input Compliance Mask................................................................................................................................................... 56

HCSL to REFCLKP/N / PCCLKP/N ............................................................................................................................................................ 58

LVDS to REFCLKP/N / PCCLKP/N............................................................................................................................................................. 58

LVPECL to REFCLKP/N / PCCLKP/N ........................................................................................................................................................ 58

LVPECL to REFCLKP/N / PCCLKP/N ........................................................................................................................................................ 59

I2C Interface Signal Timings....................................................................................................................................................................... 60

Package Diagrams...................................................................................................................................................................................... 63

Tsi721 Datasheet

April 4, 2016

Integrated Device Technology

List of Tables

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Table 2:

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Table 38:

Table 39:

Signal Types ............................................................................................................................................................................................... 17

I2C Signals.................................................................................................................................................................................................. 21

JTAG Interface Signals ............................................................................................................................................................................... 21

GPIO Mapping to Power-up Signals ........................................................................................................................................................... 22

Power-Up Signals ....................................................................................................................................................................................... 23

Power Supply Signals ................................................................................................................................................................................. 26

Absolute Maximum Ratings ........................................................................................................................................................................ 27

Recommended Operating Conditions......................................................................................................................................................... 28

Power Consumption.................................................................................................................................................................................... 28

Power Supply Sequencing Ramp Times .................................................................................................................................................... 29

3.3V LVTTL DC Operating Characteristics at Recommended Operating Condition of 3.3V ...................................................................... 30

2.5V LVTTL DC Operating Characteristics at Recommended Operating Condition of 2.5V ...................................................................... 30

Decoupling Recommendation..................................................................................................................................................................... 31

PCIe Differential Receiver Specifications ................................................................................................................................................... 31

PCIe Differential Transmitter Specifications................................................................................................................................................ 34

Level I Short Run Transmitter AC Timing Specifications ............................................................................................................................ 42

Level I Long Run Transmitter AC Timing Specifications............................................................................................................................. 43

Level I Near-End (Tx) Template Intervals ................................................................................................................................................... 44

Level I Receiver Electrical Input Specifications .......................................................................................................................................... 45

Level I Receiver Input Jitter Tolerance Specifications................................................................................................................................. 46

Level I Far-End (Rx) Template Intervals ..................................................................................................................................................... 47

Level II Short Run Transmitter Output Electrical Specifications.................................................................................................................. 49

Level II Medium Run Transmitter Output Electrical Specifications ............................................................................................................. 50

Level II Medium Run Near-End (Tx) Template Intervals ............................................................................................................................. 52

Level II Short Run Receiver Electrical Input Specifications ........................................................................................................................ 53

Level II MR Receiver Electrical Input Specifications................................................................................................................................... 55

Level II Far-End (Rx) Template Intervals .................................................................................................................................................... 56

PCCLKP/N and REFCLKP/NClock Electrical Characteristics .................................................................................................................... 57

JTAG and Test Interface AC Specifications ................................................................................................................................................ 59

I2C Interface AC Specifications .................................................................................................................................................................. 60

GPIO Interface AC Specifications............................................................................................................................................................... 61

RSTn Signal AC Specifications................................................................................................................................................................... 61

Package Dimensions .................................................................................................................................................................................. 62

Junction to Ambient Characteristics – Theta JB/JC.................................................................................................................................... 64

Junction to Ambient Characteristics – Theta JA ......................................................................................................................................... 64

Tsi721 Datasheet

April 4, 2016

Integrated Device Technology

TSI721A1-16GCLY相似产品对比

	TSI721A1-16GCLY	TSI721A1-16GILY	TSI721A1-16GIL	TSI721A1-16GILH
描述	PCI Interface IC Protocol Converter Bridge	PCI Interface IC Protocol Converter Bridge	PCI Interface IC PCIe to RapidIO	PCI接口IC PCIe-to-Rapid IO Bridge
Product Attribute	Attribute Value	Attribute Value	Attribute Value	-
制造商 Manufacturer	IDT(艾迪悌)	IDT(艾迪悌)	IDT(艾迪悌)	-
产品种类 Product Category	PCI Interface IC	PCI Interface IC	PCI Interface IC	-
RoHS	Details	N	N	-
类型 Type	Bridge - PCIe to RapidIO	Bridge - PCIe to RapidIO	Bridge - PCIe to RapidIO	-
Maximum Clock Frequency	156.25 MHz	156.25 MHz	156.25 MHz	-
Number of Lanes	4 Lane	4 Lane	4 Lane	-
Number of Ports	1 Port	1 Port	1 Port	-
最小工作温度 Minimum Operating Temperature	0 C	- 40 C	- 40 C	-
最大工作温度 Maximum Operating Temperature	+ 70 C	+ 85 C	+ 85 C	-
安装风格 Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	-
封装 / 箱体 Package / Case	FCBGA-143	FCBGA-143	FCBGA-143	-
系列 Packaging	Tray	Tray	Tray	-
数据速率 Data Rate	16 Gb/s	16 Gb/s	16 Gb/s	-
Data Bus Width	32/64 bit	32/64 bit	32/64 bit	-
Moisture Sensitive	Yes	Yes	Yes	-
工厂包装数量 Factory Pack Quantity	10	10	10	-

TSI721A1-16GCLY

TSI721A1-16GCLY在线购买

TSI721A1-16GCLY概述

TSI721A1-16GCLY规格参数

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