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MM5Z22VT1G

产品描述Zener Diodes 22V 200mW
产品类别分立半导体    二极管   
文件大小95KB,共4页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
标准
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MM5Z22VT1G概述

Zener Diodes 22V 200mW

MM5Z22VT1G规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明0.047 X 0.032 INCH, 0.028 INCH HEIGHT, ROHS COMPLIANT, PLASTIC, CASE 502-01, 2 PIN
针数2
制造商包装代码CASE 502-01
Reach Compliance Codecompliant
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
最大动态阻抗55 Ω
JESD-30 代码R-PDSO-F2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散0.5 W
认证状态Not Qualified
标称参考电压22 V
表面贴装YES
技术ZENER
端子面层Tin (Sn)
端子形式FLAT
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差5.67%
工作测试电流5 mA
Base Number Matches1

文档预览

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MM5ZxxxT1G Series,
SZMM5ZxxxT1G Series
Zener Voltage Regulators
300 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
Specification Features:
http://onsemi.com
Standard Zener Breakdown Voltage Range
2.4 V to 75 V
Steady State Power Rating of 300 mW
Small Body Outline Dimensions:
SOD−523
CASE 502
STYLE 1
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
Low Body Height: 0.028″ (0.7 mm)
ESD Rating of Class 3 (> 16 kV) per Human Body Model
AEC−Q101 Qualified and PPAP Capable
SZMM5ZxxxT1G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
1
Cathode
2
Anode
MARKING DIAGRAM
XX M
G
G
1
2
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260°C
XX = Specific Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−5 Board,
@ T
A
= 25°C
Thermal Resistance,
Junction−to−Ambient (Note 1)
Junction and Storage
Temperature Range
Symbol
P
D
R
qJA
T
J
, T
stg
Max
300
390
−65
to +150
Unit
mW
°C/W
°C
ORDERING INFORMATION
Device
MM5ZxxxxT1G
SZMM5ZxxxT1G
Package
SOD−523
(Pb−Free)
SOD−523
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method
(25 mm
2
, 2 oz., 3.8
mm
plating).
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
April, 2013
Rev. 10
1
Publication Order Number:
MM5Z2V4T1/D
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