1. Zener voltage is measured with a pulse test current I
Z
at an ambient temperature of 25°C.
*Include SZ-prefix devices where applicable.
http://onsemi.com
3
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
−X−
D
−Y−
E
2X
b
0.08
1
M
2
X Y
TOP VIEW
A
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
c
H
E
SIDE VIEW
2X
L
2X
RECOMMENDED
SOLDERING FOOTPRINT*
1.80
0.40
2X
0.48
2X
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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