1.6x0.8mm SMD CHIP LED LAMP
KP-1608SYC SUPER BRIGHT YELLOW
Features
!
1.6mmx0.8mm
!
LOW
!
WIDE
Description
SMT LED, 1.1mm THICKNESS.
The Super Bright Yellow source color devices
are made with DH InGaAlP on GaAs substrate
Light Emitting Diode.
POWER CONSUMPTION.
VIEWING ANGLE.
FOR BACKLIGHT AND INDICATOR.
COLORS AND LENS TYPES AVAILABLE.
!
IDEAL
!
VARIOUS
!
PACKAGE : 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
±0.1(0.004")
unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
SPEC NO: KDA0024
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: SEP/04/2001
DRAWN: S. H. CHEN
PAGE: 1 OF4
Selection Guide
Par t No .
Di c e
L en s Ty p e
Iv (mc d )
@ 20 mA
Min .
KP-1608SYC
SUPER BRIGHT YELLOW ( InGaAlP )
WATER CLEAR
40
Ty p .
80
View in g
An g l e
2θ1/2
120°
Note:
1.
θ1/2
is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
°
Electrical / Optical Characteristics at T
)
=25°C
Sy m b o l
λ
peak
λ
D
∆λ
1/2
C
V
F
I
R
Par ameter
Peak Wavelength
Dominate Wavelength
Spectral Line Halfwidth
Capacitance
Forward Voltage
Reverse Current
Dev ic e
Super Bright Yellow
Super Bright Yellow
Super Bright Yellow
Super Bright Yellow
Super Bright Yellow
Super Bright Yellow
Ty p .
590
588
28
25
2.0
2.5
10
Max .
Un i t s
nm
nm
nm
pF
V
uA
Tes t Co n d itio n s
IF=20mA
IF=20mA
IF=20mA
VF=0V;f=1MHz
IF=20mA
VR = 5V
Absolute Maximum Ratings at T
)
=25°C
°
Par ameter
Power dissipation
DC Forward Current
Peak Forward Current [1]
Reverse Voltage
Operating Temperature
Storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Su p er B r ig h t Yello w
125
30
175
5
-40
°
C To +85
°C
-40
°
C To +85
°C
Un i t s
mW
mA
mA
V
SPEC NO: KDA0024
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: SEP/04/2001
DRAWN: S. H. CHEN
PAGE: 2 OF4
Super Bright Yellow KP-1608SYC
SPEC NO: KDA0024
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: SEP/04/2001
DRAWN: S. H. CHEN
PAGE: 3 OF4
KP-1608SYC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: KDA0024
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: SEP/04/2001
DRAWN: S. H. CHEN
PAGE: 4 OF4
stm32/stm8
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