2SK3600-01L,S,SJ
FUJI POWER MOSFET
200304
Super FAP-G Series
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
N-CHANNEL SILICON POWER MOSFET
Outline Drawings
(mm)
P4
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DC converters
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Drain-source voltage
Continuous drain current
Pulsed drain current
Gate-source voltage
Non-repetitive Avalanche current
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
Operating and storage
temperature range
Symbol
V
DS
V
DSX *5
I
D
I
D(puls]
V
GS
I
AS *2
E
AS *1
dV
DS
/dt
*4
dV/dt
*3
P
D
Ta=25°C
Tc=25°C
T
ch
T
stg
Ratings
100
70
±29
±116
±30
29
155.8
20
5
1.67
105
+150
-55 to +150
Unit
V
V
A
A
V
A
mJ
kV/µs
kV/µs
W
°C
°C
*2 Tch < 150°C
=
*5 V
GS
=-30V
Equivalent circuit schematic
Drain(D)
Gate(G)
Source(S)
*1 L=222µH, Vcc=48V, Tch=25°C, See to Avalanche Energy Graph
*3 I
F
< -I
D
, -di/dt=50A/µs, Vcc < BV
DSS
, Tch < 150°C *4 V
DS
< 100V
=
=
=
=
Symbol
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
I
AV
V
SD
t
rr
Q
rr
Electrical characteristics (T
c
=25°C unless otherwise specified)
Item
Drain-source breakdown voltaget
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on time t
on
Turn-off time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
Test Conditions
I
D
= 250µA
V
GS
=0V
I
D
= 250µA
V
DS
=V
GS
V
DS
=100V V
GS
=0V
V
DS
=80V V
GS
=0V
V
GS
=±30V V
DS
=0V
I
D
=10A V
GS
=10V
I
D
=10A V
DS
=25V
V
DS
=75V
V
GS
=0V
f=1MHz
V
CC
=48V I
D
=10A
V
GS
=10V
R
GS
=10
Ω
V
CC
=50V
I
D
=20A
V
GS
=10V
L=222µH T
ch
=25°C
I
F
=20A V
GS
=0V T
ch
=25°C
I
F
=20A V
GS
=0V
-di/dt=100A/µs T
ch
=25°C
T
ch
=25°C
T
ch
=125°C
10
47
12
730
190
12
12
3.8
23
8.5
22
9
6
1.10
65
0.17
Min.
100
3.0
Typ.
Max.
5.0
25
250
100
62
1095
285
18
18
6
35
13
33
13.5
9
1.65
Units
V
V
µA
nA
mΩ
S
pF
6
ns
nC
29
A
V
ns
µC
Thermalcharacteristics
Item
Thermal resistance
Symbol
R
th(ch-c)
R
th(ch-a)
Test Conditions
channel to case
channel to ambient
Min.
Typ.
Max.
1.191
75.0
Units
°C/W
°C/W
www.fujielectric.co.jp/denshi/scd
1
2SK3600-01L,S,SJ
Characteristics
Allowable Power Dissipation
PD=f(Tc)
FUJI POWER MOSFET
120
400
Maximum Avalanche Energy vs. starting Tch
E(AS)=f(starting Tch):Vcc=48V
I
AS
=12A
350
100
300
80
250
I
AS
=17A
60
EAS [mJ]
PD [W]
200
I
AS
=29A
150
40
100
20
50
0
0
25
50
75
100
125
150
0
0
25
50
75
100
125
150
Tc [
°
C]
starting Tch [
°
C]
Typical Output Characteristics
ID=f(VDS):80µs Pulse test,Tch=25°C
80
20V
10V
60
10
100
Typical Transfer Characteristic
ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C
ID [A]
40
8V
7.5V
ID[A]
1
0.1
0
1
2
3
4
5
6
7
8
9
10
10
12
7.0V
20
6.5V
6.0V
VGS=5.5V
0
0
2
4
6
8
VDS [V]
VGS[V]
Typical Transconductance
gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C
100
0.18
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80µs Pulse test, Tch=25°C
VGS=
5.5V 6.0V
0.15
6.5V
7.0V
7.5V
8V
RDS(on) [
Ω
]
10
0.12
gfs [S]
0.09
10V
0.06
20V
0.03
1
0.1
0.1
1
10
100
0.00
0
10
20
30
40
50
60
ID [A]
ID [A]
2
2SK3600-01L,S,SJ
FUJI POWER MOSFET
Drain-Source On-state Resistance
RDS(on)=f(Tch):ID=10A,VGS=10V
150
7.0
6.5
125
6.0
5.5
5.0
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch):VDS=VGS,ID=250
µ
A
max.
RDS(on) [ m
Ω
]
100
VGS(th) [V]
4.5
4.0
3.5
3.0
min.
75
max.
50
2.5
typ.
2.0
1.5
25
1.0
0.5
0
-50
-25
0
25
50
75
100
125
150
0.0
-50
-25
0
25
50
75
100
125
150
Tch [
°
C]
Tch [
°
C]
Typical Gate Charge Characteristics
VGS=f(Qg):ID=20A, Tch=25°C
10
14
12
10
0
1
Typical Capacitance
C=f(VDS):VGS=0V,f=1MHz
10
Ciss
VGS [V]
8
6
Vcc= 50V
C [nF]
Coss
10
4
2
-1
Crss
0
0
10
20
30
40
10
-2
10
-1
10
0
10
1
10
2
Qg [nC]
VDS [V]
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80µs Pulse test,Tch=25°C
100
10
3
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=48V, VGS=10V, RG=10Ω
tf
10
10
2
IF [A]
t [ns]
td(off)
td(on)
1
10
1
tr
0.1
0.00
10
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0
10
-1
10
0
10
1
10
2
VSD [V]
ID [A]
3
2SK3600-01L,S,SJ
10
2
FUJI POWER MOSFET
Maximum Avalanche Current Pulsewidth
I
AV
=f(t
AV
):starting Tch=25
°
C,Vcc=48V
Avalanche Current I
AV
[A]
Single Pulse
10
1
10
0
10
-1
10
-8
10
-2
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
t
AV
[sec]
10
1
Maximum Transient Thermal Impedance
Zth(ch-c)=f(t):D=0
10
0
Zth(ch-c) [°C/W]
10
-1
10
-2
10
-3
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
t [sec]
Outline Drawings (mm)
Type(L)
Type(S)
Type(SJ)
4
1
2 3
1
4 2
3
1
2 3
1
2
3
http://www.fujielectric.co.jp/denshi/scd/
4
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