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MAX2244EBL-T10

产品描述RF Amplifier
产品类别无线/射频/通信    射频和微波   
文件大小309KB,共14页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX2244EBL-T10概述

RF Amplifier

MAX2244EBL-T10规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
Reach Compliance Codecompliant
特性阻抗50 Ω
构造COMPONENT
最大输入功率 (CW)10 dBm
JESD-609代码e0
最大工作频率2500 MHz
最小工作频率2400 MHz
最高工作温度85 °C
最低工作温度-40 °C
射频/微波设备类型NARROW BAND LOW POWER
端子面层Tin/Lead (Sn/Pb)
最大电压驻波比6
Base Number Matches1

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19-2204; Rev 2; 8/03
2.5GHz, 22dBm/20dBm Power Amplifiers with
Analog Closed-Loop Power Control
General Description
The MAX2244/MAX2245/MAX2246 single-supply, low-
voltage power amplifiers (PAs) are designed for 20dBm
Bluetooth™ Class 1 applications in the 2.4GHz to 2.5GHz
band. The MAX2244/MAX2245 deliver a peak output
power of 22dBm with greater than 20dB output-power
control range. The 22dBm output power compensates for
the filter loss between the PA and the antenna, allowing
20dBm to be delivered to the antenna. The MAX2246 pro-
vides a peak output power of 20dBm for a 30% reduction
in supply current.
The PAs integrate a power detector and closed-loop
power-control circuitry to provide nearly constant output
power over the full range of supply voltage, temperature,
and input power level. The voltage at the analog control
input precisely controls the output power level.
The MAX2244/MAX2245/MAX2246 feature a low-current
shutdown mode through a simple logic input. Internal cir-
cuitry automatically controls the ramp-up/down of the
output power level during turn-on and turn-off to meet
Bluetooth spurious emissions requirements.
The devices operate from a 3V to 3.6V single supply.
The MAX2244/MAX2246 have a power-control voltage
range of 0.5V to 2V, and the MAX2245 has a control
voltage range of 0.9V to 2.2V. The devices are pack-
aged in a miniature ultra chip-scale package (UCSP™),
significantly reducing the required board area.
o
2.4GHz to 2.5GHz Operation
o
Accurate Closed-Loop Output Power Control
Over Full Temperature, Supply, and Input Power
Range
o
Convenient Analog Power-Control Interface
o
22dBm Peak Output Power (MAX2244/MAX2245)
o
20dBm Peak Output with 30% Reduced Supply
Current (MAX2246)
o
Internal Bandwidth-Limited Power Ramping
o
50Ω Integrated Input Match
o
0.5µA Shutdown Supply Current
o
Ultra Chip-Scale Package (1.56mm
1.56mm)
Features
MAX2244/MAX2245/MAX2246
Ordering Information
PART
MAX2244EBL-T
MAX2245EBL-T
MAX2246EBL-T
TEMP
RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
BUMP
PACKAGE
9 UCSP*-9
9 UCSP*-9
9 UCSP*-9
TOP
MARK
AAP
AAQ
AAY
Applications
Bluetooth Class 1 Radios
802.11 FHSS/HomeRF™ Radios
2.4GHz Cordless Phones
*UCSP
reliability is integrally linked to the user's assembly
methods, circuit board material, and environment. See the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
Pin Configuration appears at end of data sheet.
Functional Diagram
V
CC1
C2
SHUTDOWN
BIAS
V
CC2
A2
RFIN/
SHDN
B1
MATCH
MATCH
MATCH
B3
RFOUT
MAX2244
MAX2245
MAX2246
PC
A1
ANALOG
INTERFACE
C3
GND
C1
GND
CONTROL
AMP
POWER
DETECTOR
B2
GND
A3
GND
Bluetooth is a trademark of Ericsson Corp.
UCSP is a trademark of Maxim Integrated Products, Inc.
HomeRF is a trademark of The HomeRF Working Group.
1
________________________________________________________________
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX2244EBL-T10相似产品对比

MAX2244EBL-T10 MAX2244EBL-T MAX2246EBL-T
描述 RF Amplifier RF Amplifier RF Amplifier
是否Rohs认证 不符合 不符合 不符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
Reach Compliance Code compliant not_compliant not_compliant
特性阻抗 50 Ω 50 Ω 50 Ω
构造 COMPONENT COMPONENT COMPONENT
最大输入功率 (CW) 10 dBm 10 dBm 10 dBm
JESD-609代码 e0 e0 e0
最大工作频率 2500 MHz 2500 MHz 2500 MHz
最小工作频率 2400 MHz 2400 MHz 2400 MHz
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
射频/微波设备类型 NARROW BAND LOW POWER NARROW BAND LOW POWER NARROW BAND LOW POWER
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
最大电压驻波比 6 6 6
Base Number Matches 1 1 -
包装说明 - 3 X 3 MM, UCSP-9 3 X 3 MM, UCSP-9
安装特点 - SURFACE MOUNT SURFACE MOUNT
功能数量 - 1 1
端子数量 - 9 9
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY
封装等效代码 - BGA9,3X3,20 BGA9,3X3,20
电源 - 3 V 3 V
最大压摆率 - 205 mA 144 mA
表面贴装 - YES YES
技术 - BIPOLAR BIPOLAR

 
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