Digital to Analog Converters - DAC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.75 mm |
| 最大线性误差 (EL) | 0.0122% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 12/15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大稳定时间 | 1.5 µs |
| 标称安定时间 (tstl) | 0.8 µs |
| 最大压摆率 | 2 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MX7547CQ | MX7547TQ | MX7547SQ-883B | MX7547TQ-883B | MX7537CQ | MX7537TQ | MX7537AQ | MX7547SQ | MX7547AQ | MX7537UQ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC 12-Bit 2Ch Precision DAC | Digital to Analog Converters - DAC CMOS, Parallel Loading, Dual, 12-Bit Multiplying DAC | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC |
| 是否无铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | DIP | - | - | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | CERDIP-24 | CERDIP-24 | - | - | CERAMIC, DIP-24 | CERAMIC, DIP-24 | CERAMIC, DIP-24 | CERDIP-24 | CERDIP-24 | CERAMIC, DIP-24 |
| 针数 | 24 | 24 | - | - | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | - | - | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | - | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | - | - | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | - | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | - | - | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 31.75 mm | 31.75 mm | - | - | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm |
| 最大线性误差 (EL) | 0.0122% | 0.0122% | - | - | 0.0122% | 0.0122% | 0.0244% | 0.0244% | 0.0244% | 0.0122% |
| 湿度敏感等级 | 1 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | - | - | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 2 | 2 | - | - | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | - | - | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 125 °C | - | - | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -25 °C | -55 °C | - | - | -25 °C | -55 °C | -25 °C | -55 °C | -25 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | - | - | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | - | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 245 | 245 | - | - | 245 | 245 | 245 | 245 | 245 | 245 |
| 电源 | 12/15 V | 12/15 V | - | - | 12/15 V | 12/15 V | 12/15 V | 12/15 V | 12/15 V | 12/15 V |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | - | - | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大稳定时间 | 1.5 µs | 1.5 µs | - | - | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs |
| 标称安定时间 (tstl) | 0.8 µs | 0.8 µs | - | - | 0.8 µs | 0.8 µs | 0.8 µs | 0.8 µs | 0.8 µs | 0.8 µs |
| 最大压摆率 | 2 mA | 2 mA | - | - | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| 标称供电电压 | 15 V | 15 V | - | - | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | - | - | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | MILITARY | - | - | OTHER | MILITARY | OTHER | MILITARY | OTHER | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | - | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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