Freescale Semiconductor, Inc.
Data Sheet: Technical Data
Document Number: KL26P64M48SF5
Rev 5 08/2014
Kinetis KL26 Sub-Family
48 MHz Cortex-M0+ Based Microcontroller
MKL26ZxxxVFM4
MKL26ZxxxVFT4
MKL26ZxxxVLH4
Designed with efficiency in mind. Compatible with all other
Kinetis L families as well as Kinetis K2x family. General purpose
MCU with USB 2.0, featuring market leading ultra low-power to
provide developers an appropriate entry-level 32-bit solution.
This product offers:
• Run power consumption down to 40 μA/MHz in very low
power run mode
• Static power consumption down to 2 μA with full state
retention and 4.5 μs wakeup
• Ultra-efficient Cortex-M0+ processor running up to 48 MHz
64-pin LQFP (LH)
10 x 10 x 1.4 Pitch 0.5 mm
with industry leading throughput
• Memory option is up to 128 KB flash and 16 KB RAM
• Energy-saving architecture is optimized for low power with
90nm TFS technology, clock and power gating techniques, and zero wait state flash memory controller
32-pin QFN (FM)
48-pin QFN (FT)
5 x 5 x 1 Pitch 0.5 mm 7 x 7 x 1 Pitch 0.5 mm
Performance
• 48 MHz ARM
®
Cortex
®
-M0+ core
Memories and memory interfaces
• Up to 128 KB program flash memory
• Up to 16 KB SRAM
Human-machine interface
• Low-power hardware touch sensor interface (TSI)
• Up to 50 general-purpose input/output (GPIO)
Communication interfaces
• USB full-/low-speed On-the-Go controller with on-
chip transceiver and 5 V to 3.3 V regulator
System peripherals
• Two 16-bit SPI modules
• Nine low-power modes to provide power optimization
• I2S (SAI) module
based on application requirements
• One low power UART module
• COP Software watchdog
• Two UART modules
• 4-channel DMA controller, supporting up to 63 request
• Two I2C module
sources
Analog Modules
• Low-leakage wakeup unit
• SWD debug interface and Micro Trace Buffer
• 16-bit SAR ADC
• Bit Manipulation Engine
• 12-bit DAC
• Analog comparator (CMP) containing a 6-bit DAC
Clocks
and programmable reference input
• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator
• Multi-purpose clock source
Timers
• Six channel Timer/PWM (TPM)
Operating Characteristics
• Two 2-channel Timer/PWM modules
• Voltage range: 1.71 to 3.6 V
• Periodic interrupt timers
• Flash write voltage range: 1.71 to 3.6 V
• 16-bit low-power timer (LPTMR)
• Temperature range (ambient): -40 to 105°C
• Real time clock
Freescale reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products. © 2013–2014 Freescale
Semiconductor, Inc. All rights reserved.
Security and integrity modules
• 80-bit unique identification number per chip
Ordering Information
Part Number
Flash (KB)
MKL26Z32VFM4
MKL26Z64VFM4
MKL26Z128VFM4
MKL26Z32VFT4
MKL26Z64VFT4
MKL26Z128VFT4
MKL26Z32VLH4
MKL26Z64VLH4
MKL26Z128VLH4
32
64
128
32
64
128
32
64
128
Memory
SRAM (KB)
4
8
16
4
8
16
4
8
16
23
23
23
36
36
36
50
50
50
Maximum number of I\O's
Related Resources
Type
Selector Guide
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
Description
The Freescale Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
The chip mask set Errata provides additional or corrective
information for a particular device mask set.
Package dimensions are provided in package drawings.
Resource
Solution Advisor
KL26P64M48SF5RM
1
KL26P64M48SF5
1
KINETIS_L_xN15J
2
QFN 32-pin: 98ASA00473D
1
QFN 48-pin: 98ASA00466D
1
LQFP 64-pin: 98ASS23234W
1
1. To find the associated resource, go to
http://www.freescale.com
and perform a search using this term.
2. To find the associated resource, go to
http://www.freescale.com
and perform a search using this term with the “x”
replaced by the revision of the device you are using.
2
Freescale Semiconductor, Inc.
Kinetis KL26 Sub-Family, Rev5 08/2014.
Table of Contents
1 Ratings.................................................................................. 4
1.1 Thermal handling ratings............................................... 4
1.2 Moisture handling ratings...............................................4
1.3 ESD handling ratings..................................................... 4
1.4 Voltage and current operating ratings............................4
2 General................................................................................. 5
2.1 AC electrical characteristics...........................................5
2.2 Nonswitching electrical specifications............................6
2.2.1 Voltage and current operating requirements......6
2.2.2 LVD and POR operating requirements.............. 6
2.2.3 Voltage and current operating behaviors........... 7
2.2.4 Power mode transition operating behaviors.......8
2.2.5 Power consumption operating behaviors...........9
2.2.6 EMC radiated emissions operating behaviors... 15
2.2.7 Designing with radiated emissions in mind........ 16
2.2.8 Capacitance attributes....................................... 16
2.3 Switching specifications................................................. 16
2.3.1 Device clock specifications................................ 16
2.3.2 General switching specifications........................17
2.4 Thermal specifications................................................... 17
2.4.1 Thermal operating requirements........................17
2.4.2 Thermal attributes.............................................. 18
3 Peripheral operating requirements and behaviors................ 18
3.1 Core modules................................................................ 18
3.1.1 SWD electricals .................................................18
3.2 System modules............................................................ 20
3.3 Clock modules............................................................... 20
3.3.1 MCG specifications............................................ 20
3.3.2 Oscillator electrical specifications...................... 22
3.4 Memories and memory interfaces................................. 24
3.4.1 Flash electrical specifications............................ 24
3.5 Security and integrity modules.......................................26
3.6 Analog............................................................................26
3.6.1 ADC electrical specifications..............................26
3.6.2 CMP and 6-bit DAC electrical specifications......31
3.6.3 12-bit DAC electrical characteristics.................. 33
3.7 Timers............................................................................ 36
3.8 Communication interfaces............................................. 36
3.8.1 USB electrical specifications..............................36
3.8.2 USB VREG electrical specifications...................37
3.8.3 SPI switching specifications...............................37
3.8.4 Inter-Integrated Circuit Interface (I2C) timing.....42
3.8.5 UART................................................................. 43
3.8.6 I2S/SAI switching specifications........................ 43
3.9 Human-machine interfaces (HMI).................................. 47
3.9.1 TSI electrical specifications................................47
Dimensions........................................................................... 48
4.1 Obtaining package dimensions......................................48
Pinout.................................................................................... 48
5.1 KL26 Signal Multiplexing and Pin Assignments.............48
5.2 KL26 pinouts.................................................................. 51
Ordering parts....................................................................... 54
6.1 Determining valid orderable parts.................................. 54
Part identification...................................................................54
7.1 Description..................................................................... 55
7.2 Format........................................................................... 55
7.3 Fields............................................................................. 55
7.4 Example......................................................................... 55
Terminology and guidelines.................................................. 56
8.1 Definition: Operating requirement.................................. 56
8.2 Definition: Operating behavior....................................... 56
8.3 Definition: Attribute........................................................ 56
8.4 Definition: Rating........................................................... 57
8.5 Result of exceeding a rating.......................................... 57
8.6 Relationship between ratings and operating
requirements.................................................................. 57
4
5
6
7
8
8.7 Guidelines for ratings and operating requirements........ 58
8.8 Definition: Typical value................................................. 58
8.9 Typical value conditions.................................................59
9 Revision history.....................................................................60
Kinetis KL26 Sub-Family, Rev5 08/2014.
3
Freescale Semiconductor, Inc.
Ratings
1 Ratings
1.1 Thermal handling ratings
Table 1. Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Table 2. Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Table 3. ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105 °C
Min.
–2000
–500
–100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
4
Freescale Semiconductor, Inc.
Kinetis KL26 Sub-Family, Rev5 08/2014.
General
1.4 Voltage and current operating ratings
Table 4. Voltage and current operating ratings
Symbol
V
DD
I
DD
V
IO
I
D
V
DDA
V
USB_DP
V
USB_DM
V
REGIN
Description
Digital supply voltage
Digital supply current
IO pin input voltage
Instantaneous maximum current single pin limit (applies to
all port pins)
Analog supply voltage
USB_DP input voltage
USB_DM input voltage
USB regulator input
Min.
–0.3
—
–0.3
–25
V
DD
– 0.3
–0.3
–0.3
–0.3
Max.
3.8
120
V
DD
+ 0.3
25
V
DD
+ 0.3
3.63
3.63
6.0
Unit
V
mA
V
mA
V
V
V
V
2 General
2.1 AC electrical characteristics
Unless otherwise specified, propagation delays are measured from the 50% to the 50%
point, and rise and fall times are measured at the 20% and 80% points, as shown in the
following figure.
Low
High
80%
50%
20%
Rise Time
V
IH
Input Signal
Midpoint1
Fall Time
V
IL
The midpoint is V
IL
+ (V
IH
- V
IL
) / 2
Figure 1. Input signal measurement reference
All digital I/O switching characteristics, unless otherwise specified, assume the output
pins have the following characteristics.
• C
L
=30 pF loads
• Slew rate disabled
• Normal drive strength
Kinetis KL26 Sub-Family, Rev5 08/2014.
5
Freescale Semiconductor, Inc.
FPGA/CPLD
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