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MM74HC175MTCX

产品描述Flip Flops Qd D-Type Flip-Flop
产品类别逻辑    逻辑   
文件大小195KB,共9页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
标准
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MM74HC175MTCX概述

Flip Flops Qd D-Type Flip-Flop

MM74HC175MTCX规格参数

参数名称属性值
Brand NameFairchild Semiconductor
是否无铅不含铅
是否Rohs认证符合
厂商名称Fairchild
零件包装代码TSSOP
包装说明TSSOP, TSSOP16,.25
针数16
制造商包装代码16 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
Reach Compliance Codecompliant
ECCN代码EAR99
系列HC/UH
JESD-30 代码R-PDSO-G16
JESD-609代码e4
长度5 mm
负载电容(CL)50 pF
逻辑集成电路类型D FLIP-FLOP
最大频率@ Nom-Sup24000000 Hz
最大I(ol)0.004 A
湿度敏感等级1
位数4
功能数量1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
输出极性COMPLEMENTARY
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP16,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源2/6 V
传播延迟(tpd)190 ns
认证状态Not Qualified
座面最大高度1.1 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
触发器类型POSITIVE EDGE
宽度4.4 mm
最小 fmax70 MHz

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
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device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at
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Please
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

MM74HC175MTCX相似产品对比

MM74HC175MTCX
描述 Flip Flops Qd D-Type Flip-Flop
Brand Name Fairchild Semiconductor
是否无铅 不含铅
是否Rohs认证 符合
厂商名称 Fairchild
零件包装代码 TSSOP
包装说明 TSSOP, TSSOP16,.25
针数 16
制造商包装代码 16 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
Reach Compliance Code compliant
ECCN代码 EAR99
系列 HC/UH
JESD-30 代码 R-PDSO-G16
JESD-609代码 e4
长度 5 mm
负载电容(CL) 50 pF
逻辑集成电路类型 D FLIP-FLOP
最大频率@ Nom-Sup 24000000 Hz
最大I(ol) 0.004 A
湿度敏感等级 1
位数 4
功能数量 1
端子数量 16
最高工作温度 85 °C
最低工作温度 -40 °C
输出极性 COMPLEMENTARY
封装主体材料 PLASTIC/EPOXY
封装代码 TSSOP
封装等效代码 TSSOP16,.25
封装形状 RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 TAPE AND REEL
峰值回流温度(摄氏度) 260
电源 2/6 V
传播延迟(tpd) 190 ns
认证状态 Not Qualified
座面最大高度 1.1 mm
最大供电电压 (Vsup) 6 V
最小供电电压 (Vsup) 2 V
表面贴装 YES
技术 CMOS
温度等级 INDUSTRIAL
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 GULL WING
端子节距 0.65 mm
端子位置 DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED
触发器类型 POSITIVE EDGE
宽度 4.4 mm
最小 fmax 70 MHz
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