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MA4P504-1072

产品描述Pin Diode, 500V V(BR), Silicon, HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN
产品类别分立半导体    二极管   
文件大小333KB,共7页
制造商MACOM
官网地址http://www.macom.com
标准
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MA4P504-1072概述

Pin Diode, 500V V(BR), Silicon, HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN

MA4P504-1072规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称MACOM
包装说明R-CDSO-R2
针数2
制造商包装代码CASE 1072
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性HIGH RELIABILITY
应用SWITCHING
最小击穿电压500 V
配置SINGLE
最大二极管电容0.5 pF
标称二极管电容0.5 pF
二极管元件材料SILICON
最大二极管正向电阻0.6 Ω
二极管电阻测试电流100 mA
二极管电阻测试频率100 MHz
二极管类型PIN DIODE
JESD-30 代码R-CDSO-R2
少数载流子标称寿命1 µs
元件数量1
端子数量2
最高工作温度150 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
最大功率耗散1.5 W
认证状态Not Qualified
表面贴装YES
技术POSITIVE-INTRINSIC-NEGATIVE
端子形式WRAP AROUND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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MA4P100 thru MA4P600 Series
Packaged PIN Diodes
RoHS Compliant
Features
High Power PIN Diodes
Fast Speed PIN Diodes
Voltage Ratings to 1500 Volts
Long Carrier Lifetime Designs
Wide Variety of Hermetic Packages
High Reliability for Space/Military Applications
M/A-COM Products
Maximum Power Dissipation
P
diss
=
30,31,32,36,43,94,111,120,150,255 T (max Operating)-25°C
Thermal Resistance
258,296,1072,1079
Leaded Packages
@ +25°C
186, 276,1088
P
diss
= 250mW
Cathode Heatsink Packages
Description and Applications
M/A-COM's product line of packaged PIN diodes
represents a comprehensive combination of PIN diode
electrical characteristics and package outlines. This
union of semiconductor and packaging technology gives
considerable design flexibility to the PIN diode circuit
designer. The fast switching speed PIN diodes utilize
thin I-region silicon dioxide passivated chips that
incorporate careful control of semiconductor processing
which enables these diodes to achieve consistent
performance in control circuit applications. The
packaged
PIN chip employs M/A-COM's unique
CERMACHIP process which provides for hard glass
encapsulation that hermetically seals the PIN diode
chip. The packaged CERMACHIP PIN diodes are
designed for use in high power and high RF voltage
applications. The PIN diode chips are bonded into
hermetically sealed ceramic packages that are designed
for the most stringent applications. Packages are
available which are suitable for mounting into a variety
of microwave and RF circuit media. The packaged
silicon PIN diode series has high inherent reliability and
are designed to meet the most rigorous environmental
conditions. These diodes may be ordered screened to
various selected reliability levels.
Package Style
1056 @+25°C
P
diss
= 300mW
Co-Axial Packages
31,32,94
36
30,296
120,255
Co-Planar Surface Mount Packages
276
1088
1056
186
1072,1079
Absolute Maximum Ratings
1
T
AMB
= +25°C
(unless otherwise specified
)
Parameter
Voltage
Operating Temperature
Storage Temperature
Operating and Storage
(Case Style 1088)
Threaded Packages
Absolution Max.
Voltage Rating
- 65°C to +175°C
-65°C to +200°C
- 65°C to +125°C
150
111
43
258
Bondable Die
1. Operation of these devices above any one of these
parameters may cause permanent damage.
Specifications subject to change without prior notification.
131,132.134
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.

MA4P504-1072相似产品对比

MA4P504-1072 MA4P505-1072 MA4P303-30
描述 Pin Diode, 500V V(BR), Silicon, HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN Pin Diode, 500V V(BR), Silicon, HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN Pin Diode, 200V V(BR), Silicon, HERMETIC SEALED, CERAMIC, CASE 30, 2 PIN
厂商名称 MACOM MACOM MACOM
包装说明 R-CDSO-R2 R-CDSO-R2 HERMETIC SEALED, CERAMIC, CASE 30, 2 PIN
针数 2 2 2
制造商包装代码 CASE 1072 CASE 1072 CASE 30
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
其他特性 HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY
应用 SWITCHING SWITCHING SWITCHING
最小击穿电压 500 V 500 V 200 V
配置 SINGLE SINGLE SINGLE
最大二极管电容 0.5 pF 0.65 pF 0.35 pF
标称二极管电容 0.5 pF 0.6 pF 0.35 pF
二极管元件材料 SILICON SILICON SILICON
最大二极管正向电阻 0.6 Ω 0.45 Ω 1.5 Ω
二极管电阻测试电流 100 mA 100 mA 10 mA
二极管电阻测试频率 100 MHz 100 MHz 500 MHz
二极管类型 PIN DIODE PIN DIODE PIN DIODE
JESD-30 代码 R-CDSO-R2 R-CDSO-R2 O-CEMW-N2
少数载流子标称寿命 1 µs 2 µs 0.2 µs
元件数量 1 1 1
端子数量 2 2 2
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR ROUND
封装形式 SMALL OUTLINE SMALL OUTLINE MICROWAVE
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES
技术 POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
端子形式 WRAP AROUND WRAP AROUND NO LEAD
端子位置 DUAL DUAL END
是否Rohs认证 符合 符合 -
最高工作温度 150 °C 150 °C -
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED -
最大功率耗散 1.5 W 1.5 W -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED -

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