VS6451
Ultra small reflowable CIF+ camera module
Data Brief
Features
■
■
■
■
■
■
■
■
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CIF+ resolution sensor (384x320 or 320x384)
Z Height - See table 1
Electrical and logical interface fully SMIA
compliant
Video data interface - CCP2.0
Command interface - CCI
2.8 V/1.8 V operation
On-board 10-bit ADC
Small physical size
Integral EMC shielding
Ultra low power standby mode
On-chip PLL
Lead free reflowable module
MP
NY
A
CO
FI
N
EN
D
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TI
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C
B
The module design is optimized to provide an ultra
small footprint and height, and is designed to be
reflowable at lead-free solder profiles. The product
is lead free.
The lens design is optimized for video conferen-
cing and maintains its performance even after the
high temperatures of lead-free reflow.
VS6451 offers an ultra low power consumption
hardware standby mode consuming less than
30 µW.
Description
This VS6451 is an ultra small reflowable CIF+
camera module for use across a range of mobile
phone handsets and accessories. It is primarily
designed to be used as a second camera in video
conferencing applications, but it may also be used
as a primary camera. The camera sensor is SMIA
class 2 profile 0 compliant and is capable of
generating raw bayer CIF+ images up to 30 fps.
The VS6451 supports the CCI control and
CCP2.0 data interfaces.
As different phone platforms have different
baseband processors with varying capabilities, it
may not be possible for all phones to support the
associated image processing algorithms. Where
the baseband cannot support this processing
load, a separate hardware accelerator (STV0976
or STV0984) device can be incorporated in the
phone system to run the algorithms in hardware.
The STV0984 processor can support 2 cameras.
The specifications of these devices are contained
in a separate document.
Applications
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■
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Mobile phone
PDA
Videophone
Order code
Part number
VS6451R0BA/T2
Package
Lead-free reflowable module
April 2006
Rev 1
1/5
www.st.com
5
For further information contact your local STMicroelectronics sales office.
VS6451
Figure 1.
Application diagram
Figure 2.
Block diagram
VS6451
CIF+
Mobile
Camera
Module
STV0984
CLK or
PDN STV0976
Processor
CCI
CCP2.0
CLK
PDN
I2C
CCP2.0
or
ITU
Baseband
or
Application
Processor
EXTCLK
XSHUTDOWN
VS6451
PLL and Clock Management
Power Mgmt
CCI
Receiver
Sensor
Control
Registers
Power-On Reset
CIF+
Pixel array
1152 x 864
VDIG
DGND
Readout
CCI
CCP2.0
SMIA Rx’er
CLKP
CLKN
DATAP
DATAN
CCP2.0
Transmitter
VS6451
CIF+
Mobile
Camera
Module
CLK
PDN
Baseband
or
Application
Processor
SCL
SDA
SMIA
profile 0
frame
formatter
Y Decoder
VANA
AGND
Column ADC
X Decoder
Line SRAM
Table 1.
Technical specifications
Parameter
Values
CIF+ portrait and landscape
0.18 µm HCMOS8i shrink
3.6µm x 3.6µm
+8 dB
+24 dB (max)
61 dB
34 dB (@ 100 lux)
< 7lux
Analogue: 2.4V to 2.9V
Digital: 1.8V ± 0.1V
<60 mW
4.5 mm x 4.5 mm x 3.6 mm
45°+/- 2°
(CIF+, CIF equiv. 45°)
2.8
On axis 45% (typ)
Horizontal field (70%) 25% (typical)
<|5%|
60% (typ)
Lead free reflowable BGA
[-40; +85]°C
[-30; +70]°C
[-25; +55]°C
[+5; +30]°C
Pixel array
Sensor technology
Pixel size
Exposure control
Analogue gain
Dynamic range
Signal to noise
Minimum illumination
Supply voltage
Average power consumption @ 30fps
Module size (XYZ) max
Lens HFOV
F number
Lens SFR
Lens TV distortion
Relative illumination
System connectivity
Storage temperature
Functional operating temperature
Normal operating temperature
Optimal operating temperature
2/5
VS6451
Figure 3.
Mechanical data
4.50 0.10
2.00, note 2
3°
4.50 0.10
3.12 ±0.10
C
Z Height - See table 1
B
PART CODE SENSOR RESOLUTION
VS6451ROBA
CIF+ (384 X 320)
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TABLE 1
PLATING SPECIFICATION
2.54 - 5.08 microns tin over Nickel strike (shield can)
Z HEIGHT
3.60 +/-0.10 after
soldering (0.10 paste
thickness)
3/5
Revision history
VS6451
Revision history
Table 2.
Date
26-Apr-2006
Document revision history
Revision
1
Initial release.
Changes
4/5
VS6451
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