20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State)
| 74AVC16836A | 74AVC16836ADGG | 74AVC16836ADGV | |
|---|---|---|---|
| 描述 | 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) | 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) | 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) |
| 是否Rohs认证 | - | 不符合 | 符合 |
| 厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | - | _compli | unknow |
| 控制类型 | - | ENABLE LOW | ENABLE LOW |
| JESD-30 代码 | - | R-PDSO-G56 | R-PDSO-G56 |
| 负载电容（CL） | - | 30 pF | 30 pF |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | - | 0.012 A | 0.012 A |
| 位数 | - | 20 | 20 |
| 功能数量 | - | 1 | 1 |
| 端子数量 | - | 56 | 56 |
| 最高工作温度 | - | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP |
| 封装等效代码 | - | TSSOP56,.3,20 | TSSOP56,.25,16 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | - | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | - | 2.7 ns | 2.7 ns |
| 认证状态 | - | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | - | GULL WING | GULL WING |
| 端子节距 | - | 0.5 mm | 0.4 mm |
| 端子位置 | - | DUAL | DUAL |
传感器
嵌入式系统
微控制器 MCU
嵌入式系统
FPGA/CPLD
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