5. Fault conditions are viewed as beyond the normal operating range of the part.
http://onsemi.com
2
NIF5003N
TYPICAL PERFORMANCE CURVES
35
I
D,
DRAIN CURRENT (AMPS)
30
25
20
15
10
5
0
0
0.5
1
1.5
2
T
J
= 25°C
2.5
3
3.5
V
GS
= 5 V
V
GS
= 4 V
V
GS
= 3 V
4
4.5
5
V
GS
= 9 V
V
GS
= 7 V
V
GS
= 6 V
Current Limit
Inception Region
V
GS
= 10 V
V
GS
= 8 V
20
I
D,
DRAIN CURRENT (AMPS)
18
16
14
12
10
8
6
4
2
0
1
1.5
3.5
2
3
2.5
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS)
4
100°C
V
DS
≥
10 V
T
J
=
−55°C
25°C
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 1. On−Region Characteristics
R
DS(on),
DRAIN−TO−SOURCE RESISTANCE (W)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
2
5
4
6
7
8
9
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS)
3
10
I
D
= 3 A
T
J
= 25°C
R
DS(on),
DRAIN−TO−SOURCE RESISTANCE (W)
0.075
0.07
0.065
0.06
0.055
0.05
0.045
0.04
0.035
0.03
2
3
Figure 2. Transfer Characteristics
T
J
= 25°C
V
GS
= 5 V
V
GS
= 10 V
4
5
6
7
8
9
10
I
D,
DRAIN CURRENT (AMPS)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
1.8
R
DS(on),
DRAIN−TO−SOURCE
RESISTANCE (NORMALIZED)
1.6
1.4
1.2
1.0
0.8
0.6
−50 −30 −10
10
100000
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
I
D
= 3 A
V
GS
= 5 V
V
GS
= 0 V
I
DSS
, LEAKAGE (nA)
10000
T
J
= 150°C
1000
T
J
= 100°C
100
10
30
50
70
90
110 130 150
0
5
10
15
20
25
30
35
40
45
T
J
, JUNCTION TEMPERATURE (°C)
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
http://onsemi.com
3
NIF5003N
TYPICAL PERFORMANCE CURVES
10
I
S
, SOURCE CURRENT (AMPS)
V
GS
= 0 V
T
J
= 25°C
1
0.1
0.4
0.5
0.6
0.7
0.8
0.9
1
V
SD
, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 7. Diode Forward Voltage vs. Current
ORDERING INFORMATION
Device
NIF5003NT1
NIF5003NT1G
NIF5003NT3
NIF5003NT3G
Package
SOT−223
SOT−223
(Pb−Free)
SOT−223
SOT−223
(Pb−Free)
Shipping
†
1000 / Tape & Reel
1000 / Tape & Reel
4000 / Tape & Reel
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
4
NIF5003N
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE L
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
1.75
2.00
7.00
7.30
10°
−
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
0.069
0.276
−
4
H
E
E
1
2
3
e1
b
e
A
q
L1
C
DIM
A
A1
b
b1
c
D
E
e
e1
L1
H
E
q
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
1.50
6.70
0°
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.060
0.264
0°
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
0.078
0.287
10°
0.08 (0003)
A1
STYLE 3:
PIN 1.
2.
3.
4.
GATE
DRAIN
SOURCE
DRAIN
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
mm
inches
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
HDPlus is a trademark of Semiconductor Components Industries, LLC (SCILLC)
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
