Si52144
PCI-E
XPRESS
G
EN
1, G
EN
2 , & G
EN
3 Q
UAD
O
UTPUT
C
L O C K
G
ENERATOR
Features
PCI-Express Gen 1, Gen 2, Gen 3,
and Gen 4 common clock compliant
Gen 3 SRNS Compliant
Supports Serial ATA (SATA) at
100 MHz
Low power, push-pull HCSL
compatible differential outputs
No termination resistors required
Dedicated output enable hardware
pins for each clock output
Dedicated hardware pin for spread
spectrum control
Four PCI-Express clocks
25 MHz crystal input or clock input
Signal integrity tuning
I
2
C support with readback
capabilities
Triangular spread spectrum profile
for maximum electromagnetic
interference (EMI) reduction
Industrial temperature
–40 to 85 °C
3.3 V power supply
24-pin QFN package
Ordering Information:
See page 18
Applications
Network attached storage
Multi-function printer
Wireless access point
Routers
Pin Assignments
VDD_CORE
VSS_CORE
XIN/CLKIN
SDATA
20
Description
The Si52144 is a spread-spectrum enabled PCIe clock generator that can source
four PCIe clocks. The device has four hardware output enable pins for enabling
the outputs, and one hardware pin to control spread spectrum on PCIe clock
outputs. In addition to the hardware control pins, I
2
C programmability is also
available to dynamically control skew, edge rate and amplitude on the true,
compliment, or both differential signals on the PCIe clock outputs. This control
feature enables optimal signal integrity as well as optimal EMI signature on the
PCIe clock outputs.
Refer to AN636 for signal integrity and configurability. Measuring PCIe clock jitter
is quick and easy with the Silicon Labs PCIe Clock Jitter Tool. Download it for free
at
www.silabs.com/pcie-learningcenter.
VDD_DIFF
OE1
1
SSON
2
VSS
OE2
1
VDD_DIFF
1
2
3
4
5
6
24
23
22
XOUT
21
SCLK
19
1
18 OE3
17 VDD_DIFF
16 DIFF3
15 DIFF3
14 DIFF2
13 DIFF2
7
8
9
10
11
12
25
GND
DIFF0
DIFF1
DIFF1
Notes:
1. Internal 100 kohm pull-up.
2. Internal 100 kohm pull-down.
Patents pending
Functional Block Diagram
XIN/CLKIN
XOUT
DIFF0
DIFF1
PLL
(SSC)
Divider
DIFF2
DIFF3
SCLK
SDATA
OE [3:0]
SSON
Control & Memory
Control
RAM
Rev. 1.4 4/16
Copyright © 2016 by Silicon Laboratories
VDD_DIFF
DIFF0
OE0
1
Si52144
Si52144
T
ABLE
Section
OF
C
ONTENTS
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
2.1. Crystal Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
2.2. OE Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.3. OE Assertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.4. OE Deassertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.5. SSON Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.1. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2. Data Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
5. Pin Descriptions: 24-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8. Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Rev. 1.4
3
Si52144
1. Electrical Specifications
Table 1. DC Electrical Specifications
Parameter
3.3 V Operating Voltage
3.3 V Input High Voltage
3.3 V Input Low Voltage
Input High Voltage
Input Low Voltage
Input High Leakage Current
Input Low Leakage Current
High-impedance Output
Current
Input Pin Capacitance
Output Pin Capacitance
Pin Inductance
Dynamic Supply Current
Symbol
VDD core
V
IH
V
IL
V
IHI2C
V
ILI2C
I
IH
I
IL
I
OZ
C
IN
C
OUT
L
IN
I
DD_3.3V
All outputs enabled. Differ-
ential clocks with 5” traces
and 2 pF load.
Test Condition
3.3 ±5%
Control input pins
Control input pins
SDATA, SCLK
SDATA, SCLK
Except internal pull-down
resistors, 0 < V
IN
< V
DD
Except internal pull-up
resistors, 0 < V
IN
< V
DD
Min
3.135
2.0
V
SS
– 0.3
2.2
—
—
–5
–10
1.5
—
—
—
Typ
3.3
—
—
—
—
—
—
—
—
—
—
—
Max
3.465
V
DD
+ 0.3
0.8
—
1.0
5
—
10
5
6
7
50
Unit
V
V
V
V
V
A
A
A
pF
pF
nH
mA
4
Rev. 1.4
Si52144
Table 2. AC Electrical Specifications
Parameter
Crystal
Long-term Accuracy
Clock Input
Duty Cycle
CLKIN Rising and Falling Slew
Rate
Cycle to Cycle Jitter
Long Term Jitter
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
DIFF at 0.7 V
Duty Cycle
Symbol
L
ACC
T
DC
T
R
/T
F
T
CCJ
T
LTJ
V
IH
V
IL
I
IH
I
IL
T
DC
T
SKEW
T
CCJ
Pk-Pk
RMS
GEN2
RMS
GEN3
RMS
GEN3_SRNS
Test Condition
Measured at V
DD
/2 differential
Measured at V
DD
/2
Measured between 0.2 V
DD
and
0.8 V
DD
Measured at VDD/2
Measured at VDD/2
XIN/CLKIN pin
XIN/CLKIN pin
XIN/CLKIN pin, VIN = VDD
XIN/CLKIN pin, 0 < VIN <0.8
Measured at 0 V differential
Measured at 0 V differential
Measured at 0 V differential
PCIe Gen 1
10 kHz < F < 1.5 MHz
1.5 MHz< F < Nyquist Rate
PLL BW of 2–4 or 2–5 MHz,
CDR = 10 MHz
PLL BW of 2–4 or 2–5 MHz,
CDR = 10 MHz
PLL BW of 2–4 or 2–5 MHz,
CDR = 10 MHz
Measured at 0 V differential
Measured differentially from
±150 mV
Min
—
45
0.5
—
—
2
—
—
–35
45
—
—
0
0
0
0
—
Typ
—
—
—
—
—
—
—
—
—
—
—
35
40
1.8
1.8
0.45
0.35
Max
250
55
4.0
250
350
VDD+0.3
0.8
35
—
55
50
50
50
2.0
2.1
0.6
0.42
Unit
ppm
%
V/ns
ps
ps
V
V
uA
uA
%
ps
ps
ps
ps
ps
ps
ps
Output-to-Output Skew
Cycle to Cycle Jitter
PCIe Gen 1 Pk-Pk Jitter,
Common Clock
PCIe Gen 2 Phase Jitter,
Common Clock
PCIe Gen 3 Phase Jitter,
Common Clock
PCIe Gen 3 Phase Jitter,
Separate Reference No
Spread, SRNS
PCIe Gen 4 Phase Jitter,
Common Clock
Long Term Accuracy
Rising/Falling Slew Rate
Voltage High
Voltage Low
Crossing Point Voltage at
0.7 V Swing
Spread Range
Modulation Frequency
RMS
GEN4
L
ACC
T
R
/T
F
V
HIGH
V
LOW
V
OX
SPR
F
MOD
—
—
1
—
–0.3
300
0.45
—
—
—
—
—
–0.5
31.5
0.6
100
8
1.15
—
550
—
33
ps
ppm
V/ns
V
V
mV
%
kHz
Down spread
—
30
Notes:
1.
Visit
www.pcisig.com
for complete PCIe specifications.
2.
Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.
3.
Download the Silicon Labs PCIe Clock Jitter Tool at
www.silabs.com/pcie-learningcenter.
Rev. 1.4
5
传感器
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