3. Measured under pulse conditions to reduce heating.
Symbol
V
(BO)
−
−
V
(BO)
−
−
dV
(BO)
/dT
J
V
(BR)
I
D1
I
D2
V
T
I
BO
I
H
dv/dt
C
O
−
58
−
−
−
−
150
130
2000
−
−
−
−
0.054
−
−
−
−
91
−
−
−
67
130
77
80
−
−
2.0
5.0
3.0
−
−
−
−
−
−
V/°C
V
mA
V
mA
mA
V/ms
pF
−
−
77
80
V
Min
Typ
Max
Unit
V
Voltage Current Characteristic of TSPD
(Bidirectional Device)
Symbol
I
D1
, I
D2
V
D1
, V
D2
V
BR
V
BO
I
BO
I
H
V
TM
Parameter
Off State Leakage Current
Off State Blocking Voltage
Breakdown Voltage
Breakover Voltage
Breakover Current
Holding Current
On State Voltage
V
D1
V
D2
V
(BR)
I
H
I
D1
I
D2
I
(BO)
+ Voltage
V
TM
V
(BO)
+ Current
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2
MMT08B064T3
10
V
D1
= 50 V
1
V
BR
, BREAKDOWN VOLTAGE (V)
0
20
40 60 80
TEMPERATURE (°C)
100 120 140
I
D1
, OFF−STATE CURRENT (mA)
80
78
76
74
72
70
68
66
−60 −40 −20
0
20 40 60 80
TEMPERATURE (°C)
100 120 140
0.1
0.01
0.001
−60 −40 −20
Figure 1. Typical Off−State Current versus
Temperature
Figure 2. Typical Breakdown Voltage versus
Temperature
86
V
BO
, BREAKOVER VOLTAGE (V)
I
H
, HOLDING CURRENT (mA)
20 40
0
60
80
TEMPERATURE (°C)
100 120 140
84
82
80
78
76
74
−60 −40 −20
700
600
500
400
300
200
100
−40 −20
0
20
40
60
80
TEMPERATURE (°C)
100
120
Figure 3. Maximum Breakover Voltage versus
Temperature
Figure 4. Typical Holding Current versus
Temperature
I
PP
− PEAK PULSE CURRENT − %I
PP
250
Peak
Value
t
r
= rise time to peak value
t
f
= decay time to half value
CURRENT (A)
230
210
190
170
150
130
110
90
70
0
0 t
r
t
f
TIME (ms)
50
10
100
TIME (s)
1000
100000
100
50
Half Value
Figure 5. Exponential Decay Pulse Waveform
Figure 6. Peak Surge On−State Current versus
Surge Current Duration, Sinusoidal Waveform
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3
MMT08B064T3
TIP
OUTSIDE
PLANT
GND
TELECOM
EQUIPMENT
RING
PPTC*
TIP
OUTSIDE
PLANT
GND
TELECOM
EQUIPMENT
RING
PPTC*
*Polymeric PTC (positive temperature coefficient) overcurrent protection device
HEAT COIL
TIP
OUTSIDE
PLANT
GND
TELECOM
EQUIPMENT
RING
HEAT COIL
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4
MMT08B064T3
PACKAGE DIMENSIONS
SMB
CASE 403C−01
ISSUE A
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
INCHES
DIM MIN
MAX
A
0.160
0.180
B
0.130
0.150
C
0.075
0.095
D
0.077
0.083
H
0.0020 0.0060
J
0.006
0.012
K
0.030
0.050
P
0.020 REF
S
0.205
0.220
MILLIMETERS
MIN
MAX
4.06
4.57
3.30
3.81
1.90
2.41
1.96
2.11
0.051
0.152
0.15
0.30
0.76
1.27
0.51 REF
5.21
5.59
D
B
C
K
P
J
H
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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