(SFP28) 28 GBPS PLUGGABLE
I/O INTERCONNECT
The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28
Gbps with possible expansion to 40 Gbps. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is
hot-swappable with existing SFP+ connectors for fast system upgrades of 28-40Gbps. Alternatively, users can design-in the zSFP+
connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm
cost savings as this would eliminate the need to fully redesign for higher performance.
The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire
product family is offered as a dual source option with Molex. LLC.
z
SFP+
DATA AND DEVICES
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z
SFP+ 28 GBPS I/O INTERCONNECT
zSFP+ 28 Gbps Pluggable I/O Interconnect
FEATURES
•
Data rates: 28 Gbps (with possible expansion to 40 Gbps),
10 Gbps Ethernet and 16 Gbps Fibre Channel
•
Surface-mount connector design for single high 1xN cages
•
Press-fit 1xN cages and stacked assemblies (connector and
cage) for one-step, easy PCB placement
•
Coupled, narrow-edged, blanked- and formed-contact beam
geometry and insert molding for superior signal integrity,
mechanical and electrical performance
•
Backwards-compatibility: Shares same mating interface and
cage dimensions with the SFP+ connector (connector/single
high cages are also PCB footprint-compatible)
•
Elastomeric gasket or spring finger options for EMI
containment
•
Single high cages (1xN) for design flexibility; accommodates
belly-to-belly applications for increased density and
PCB space savings; available in 1x1, 1x2, 1x4 or 1x6 port
configurations
•
Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12
port
•
Heat sinks, LEDs and plating choices offered
•
Additional light pipe configurations available
Light pipe options include:
No light pipes
All 4 light pipes (shown left)
Inner light pipes
Outer light pipes [standard]
Three light pipes
Outer light pipes [reversed]
APPLICATIONS
•
Telecommunications:
Cellular infrastructure, central office
uplink equipment, optical transport equipment, switches/
routers, access equipment (CMTS, PON, DSL, etc)
•
Data Center:
Data center switches and routers, servers,
storage
•
Medical:
Medical diagnostic equipment
•
Networking:
Network interface, switches, routers
•
Test and Measurement Equipment
20-Pin Surface-Mount Connector
Electrical
•
Voltage (max.): 120V AC
•
Current (max.): 0.5A
•
Dielectric Withstanding Voltage:
300V AC between contacts
Mechanical
•
Mating Force: 25N
•
Unmating Force: 11.5N
•
Durability (min.): 250 cycles
Physical
•
High-temperature thermoplastic housing (glass-filled, UL
94V-0 black)
•
High-performance copper alloy contacts
•
Plating:
-
Nickel underplating; Tin plating on solder tail area;
Gold plating on mating area
-
Plating options: 15 and 30μ” Gold or Palladium Nickel
•
Operating Temperature: -40 to +85
o
C
DATA AND DEVICES
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z
SFP+ 28 GBPS I/O INTERCONNECT
PAGE 2
zSFP+ 28 Gbps Pluggable I/O Interconnect
Connector P/N
2170088-1
2170088-2
Description
30μ” in Au or Au Flash Over PdNi
15μ” in Au or Au Flash Over PdNi
Cages with Elastomeric Gaskets
EMI
Suppression
EMI gasket
Light Pipe
Option
No
Yes
1X1
2198709-1*
2198708-1*
1X2
2198720-1
2198719-1
1X4
2198722-1
2198721-1
1X6
2198724-1
2198723-1
1X8
TBD**
TBD**
Cages with EMI Springs
EMI
Suppression
Light Pipe
Option
No
EMI Spring
Fingers
Yes
Yes
Heat Sink
Option
No
No
Yes
1X1
2274001-1
2291579-1 (PCI)
2274000-1
TBD*
1X2
2227728-1
2227727-1
TBD**
1X4
2227730-1
2227729-1
2304342-X
1X6
2227732-1
2227731-1
2293156-X
1X8
2304921-1
2295325-6
TBD**
2294408-X
*Tooling in process **Not yet tooled, but planned
Ganged 1xN Cages
Mechanical
•
Transceiver insertion force (max.): 34 N without heat sink and clip;
Physical
•
Cage material: Nickel Silver
•
PCB thickness (min.): 1.50mm in single sided
45.37 N with heat sink and clip
•
Transceiver extraction force (max.): 12.5 N without heat sink and
clip; 14.36 N with heat sink and clip
•
SFP+ module to surface-mount connector and zSFP+ cage.
•
Cage press fit insertion force (max.): 44.5 N for single port cage,
applications; 2.25mm (EMI springs) or 3.0mm
(elastomeric gasket) in belly-to-belly applica-
tions
•
Operating Temperature: -40 to +85
o
C
54.3 N for ganged cage
•
Cage press fit extraction force (min.): 8.9 N for single port and
ganged cages
•
Durability (min.): 100 cycles
Ganged SFP+ 1x4 vs. zSFP+ 1x4
0
Radiated source RF leakage (dB)
-10
-20
-30
-40
-50
-60
-70
-80
0
5
10
15
20
25
30
Ganged SFP+ 1x4
—
Ganged zSFP+ 1x4
—
GHz
DATA AND DEVICES
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z
SFP+ 28 GBPS I/O INTERCONNECT
PAGE 3
zSFP+ 28 Gbps Pluggable I/O Interconnect
Stacked 2xN Assemblies
Electrical
•
Voltage (max.): 120V AC
•
Current (max.): 0.5A
•
Dielectric Withstanding Voltage: 300V AC
0
Stacked SFP+ vs. zSFP+
Radiated source RF leakage (dB)
-10
-20
-30
-40
-50
-60
-70
-80
0
5
10
15
20
25
30
between contacts
Mechanical
•
Durability (min.): 100 cycles
Physical
•
Cage material: Nickel Silver
-
High-temperature thermoplastic housing
Stacked SFP+
—
Stacked zSFP+
—
(glass-filled, UL 94V-0 black)
-
High-performance copper alloy contacts
-
Plating: Nickel underplating; Tin plating
on solder tail area; 30μ” Gold plating on
mating area
GHz
•
PCB thickness (min.): 1.57mm
•
Operating Temperature: -40 to +85
o
C
Upper contact row
—
Lower contact row
—
EMI
Suppression
Performance
Light Pipe
Configuration
None
All 4
2x1
2198318-(x)
2198318-1
2198318-2
2198318-3
2198318-4
1-2198318-7
1-2198318-8
--
2198318-5
2198318-6
2198318-7
2198318-8
1-2198318-9
2-2198318-0
--
2x2
2198325-(x)
2198325-1
2198325-2
2198325-3
2198325-4
1-2198325-7
1-2198325-8
--
2198325-5
2198325-6
2198325-7
2198325-8
1-2198325-9
2-2198325-0
--
2x4
2180324-(x)
2180324-1
2180324-2
2180324-3
2180324-4
1-2180324-7
1-2180324-8
3-2180324-0
2180324-5
2180324-6
2180324-7
2180324-8
1-2180324-9
2-2180324-0
3-2180324-1
2x6
2198339-(x)
2198339-1
2198339-2
2198339-3
2198339-4
1-2198339-7
1-2198339-8
--
2198339-5
2198339-6
2198339-7
2198339-8
1-2198339-9
2-2198339-0
2291491-1
2x8
2198346-(x)
2198346-1
2198346-2
2198346-3
2198346-4
1-2198346-7
1-2198346-8
--
2198346-5
2198346-6
2198346-7
2198346-8
1-2198346-9
2-2198346-0
--
2x12
2288172-(x)
2288172-1
2288172-2
2288172-3
2288172-4
1-2288172-7
1-2288172-8
2227838-8
2288172-5
2288172-6
2288172-7
2288172-8
1-2288172-9
2-2288172-0
2227838-7
2301210-2
EMI gasket
Standard
Inner
Outer
3
Outer (reversed)
Thermally
Enhanced
Multiple
None
EMI spring fingers
All 4
Standard
Inner
Outer
3
Outer (reversed)
Thermally
Enhanced
Multiple
DATA AND DEVICES
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z
SFP+ 28 GBPS I/O INTERCONNECT
PAGE 4
zSFP+ 28 Gbps Pluggable I/O Interconnect
SFP28 Passive Copper Cable Assemblies
Our SFP28 passive copper cable assembly features two differential copper pairs, providing one data transmission channel at
speeds up to 28 Gbps per channel that meets 25G Ethernet performance requirements.
Offered in a broad range of wire gages – from 30AWG through 33AWG – this next generation copper cable assembly features
low insertion loss and low cross talk. Our SFP28 assemblies share the same mating interface with SFP+ form factors, making
them backward compatible with existing SFP+ I/O ports. SFP28 cable assemblies can be used with legacy 10G Ethernet and
16G Fibre Channel applications with substantial signal integrity margin.
In addition to SFP28 straight cables, we offer break out assemblies with a 100G QSFP28 module on one end splitting to four
SFP28 modules on the opposite end of the assembly. In-line signal integrity (SI) based production testing ensures that each
cable assembly meets the electrical performance requirements of the applicable industry standard specification.
Features and Benefits
•
Compatible with IEEE 802.3by and Fibre Channel industry standards
•
Supports single lane data rate up to 28Gbps
•
Optimized construction to minimize insertion loss and cross talk
•
Customized cable braid termination limits EMI radiation
•
Backward compatible with existing SFP+ form factor connectors and cages
•
Pull-to-release latch design
•
30AWG through 33AWG cable
•
Straight and breakout cable assembly configurations available
•
Customizable EEPROM mapping for cable signature
•
RoHS compliant
SFP28 to SFP28 Straight Cable Assembly
Industry Standards
•
25G Ethernet (IEEE 802.3by)
•
Fibre Channel
•
SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28)
•
SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28)
QSFP28 to 4x SFP28 Breakout Cable
Assembly
Part Number Detail
Base Part Number
2821262
2821222
2821033
Description
SFP28 to SFP28 Straight
Assembly
QSFP28 to 4x SFP28
Breakout Assembly
AWG
33
30
33
30
Dash to Length (meters)
0.5
-1
-5
1
-2
-3
-8
-1
-10
-2
1.5
-3
2
-4
-2
-1
3
4
5
Contact your TE Representative for customized lengths and breakouts.
DATA AND DEVICES
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z
SFP+ 28 GBPS I/O INTERCONNECT
PAGE 5
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