REVISIONS
LTR
A
DESCRIPTION
Update to reflect current requirements. Editorial changes throughout. - drw
DATE (YR-MO-DA)
02-10-15
APPROVED
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED
REV
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REV STATUS
OF SHEETS
PMIC N/A
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PREPARED BY
Rick Officer
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
William J. Johnson
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
89-05-18
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, CMOS, 12-BIT BUFFERED
MULTIPLYING, DIGITAL TO ANALOG
CONVERTER, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
A
SIZE
A
SHEET
CAGE CODE
67268
1 OF
10
5962-88778
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E016-03
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88778
01
R
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types identify the circuit function as follows:
Device type
01
02
Generic number
7645A
7645B
Circuit function
CMOS 12-bit buffered multiplying DAC
CMOS 12-bit buffered multiplying DAC
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
2
Descriptive designator
GDIP1-T20 or CDIP2-T20
CQCC1-N20
Terminals
20
20
Package style
dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
V
DD
to DGND .....................................................................................................................
Supply voltage range .........................................................................................................
V
REF
to GND.......................................................................................................................
Digital input voltage to DGND ............................................................................................
V
RFB
, V
REF
to DGND...........................................................................................................
V
OUT
to DGND ....................................................................................................................
AGND to DGND.................................................................................................................
Power dissipation (P
D
):
Up to +75°C ...................................................................................................................
Derate above +75°C ......................................................................................................
Storage temperature range................................................................................................
Lead temperature (soldering, 10 seconds)........................................................................
Thermal resistance, junction-to-case (
JC
) ........................................................................
Thermal resistance, junction-to-ambient (
JA
):
Case R............................................................................................................................
Case 2 ............................................................................................................................
Junction temperature (T
J
) ..................................................................................................
1.4 Recommended operating conditions.
Operating ambient temperature range (T
A
) ....................................................................... -55°C to +125°C
Reference voltage (V
REF
) ................................................................................................... +10 V dc
Supply voltage.................................................................................................................... +15 V dc
-0.3 V dc to +17 V dc
+5 V dc to +17 V dc
-0.3 V dc to +17 V dc
-0.3 V dc to V
DD
±25 V dc
-0.3 V dc to V
DD
-0.3 V dc to V
DD
450 mW
6 mW/°C
-65°C to +150°C
+300°C
See MIL-STD-1835
120°C/W
110°C/W
+150°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
θ
θ
SIZE
A
REVISION LEVEL
5962-88778
SHEET
A
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is
required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections and mode selection. The terminal connections and mode selection shall be as specified on figure 1.
3.2.3 Functional and timing diagrams. The functional and timing diagrams shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full ambient operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88778
SHEET
A
3
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages
where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance
with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing
as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix
A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix
A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88778
SHEET
A
4
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
1/
Resolution
Relative accuracy
Output leakage current 2/
RES
RA
I
OUT
DB0 to DB11 = 0 V,
1, 2, 3
1, 2, 3
1
All
All
All
Test
Symbol
Group A
subgroups
Device
type
Min
12
Limits
Max
Unit
Bits
±.5
±10
LSB
nA
WR ,
CS = 0 V
2, 3
1, 2, 3
1
2, 3
All
All
±200
±1
±.002
±.004
01
±1
±2
02
±3
±4
LSB
LSB
%/%
Differential nonlinearity
Power supply rejection
DNL
PSRR
12-bit monotonic
V
DD
= ±5%
Gain error 3/
G
FSE
Digital input high voltage
Digital input low voltage
Digital input leakage current
V
IH
V
IL
I
IN
1, 2, 3
1, 2, 3
1
2, 3
All
All
All
2.4
0.8
±1
±10
V
V
µA
Gain temp. coefficient
Feedthrough error
Supply current from V
DD
TCAE
F
T
I
DD
4/
V
REF
= ±10 V, 10 kHz
sinewave 4/, 5/
All digital inputs = 0 or V
DD
All digital inputs = V
IL
or V
IH
1, 2, 3
4, 5, 6
1, 2, 3
1, 2, 3
4
All
All
All
All
All
±5
10
100
+2
8
ppm/°C
mV
P-P
µA
mA
pF
Digital input capacitance
C
IN
T
A
= +25°C, V
IN
= 0 V DB0
to DB11, WR , CS
6/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88778
SHEET
A
5
Ω
Referenced input resistance,
V
REF
to ground
R
IN
∆
Dac register loaded with
1111 1111 1111
1
2, 3
1
2, 3
1, 2, 3
All
7
25
k
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