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21060

产品描述Solder 254,T4,LEADED SOLDER PASTE 10CC
产品类别工具与设备   
文件大小136KB,共2页
制造商AIM
官网地址http://www.aimsolder.com
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21060概述

Solder 254,T4,LEADED SOLDER PASTE 10CC

21060规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
AIM
产品种类
Product Category
Solder
RoHSNot Applicable

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NC264-5
No Clean Liquid Flux
Features:
- Broad Process Window
- Low Post Process Residues
-
Fast Wetting for SN100C
®
and SAC alloys
- Lead-Free and Tin-Lead Compatible
- Halide-Free
Description:
NC264-5 is an alcohol-based no-clean liquid flux formulated to offer a very wide process window for lead-free and tin-lead
wave soldering operations. NC264-5 offers faster wetting for SN100C
®
and SAC alloys than previously formulated fluxes
and is compatible with a broad range of lead-free and tin-lead solder alloys. NC264-5 offers low post-process residues and
has proven to reduce preventative maintenance requirements for spray fluxing applications. NC264-5 is designed to be a no-
clean, non-visible residue flux, which can be cleaned if critical to the product application.
Application:
- NC264-5 is formulated for application via spray, foam, brush, mist, or dip. For spraying, NC264-5 is ready to use directly
from its container, no thinning required. When spray fluxing, it is imperative that proper flux coverage and uniformity be
achieved and maintained. A dry flux coating of 500-1500 micrograms per square inch is recommended as a starting point.
- When nitrogen sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than normal as a
result of excess drying due to the extended length of the equipment.
- When foaming, air stones should be supplied with compressed air, free of oil and moisture. Adjust foam head to achieve
uniform bubble size for optimum coverage. During foaming applications, it is periodically necessary to add AIM’s
Common Flux Thinner to replace that which is lost due through evaporation.
Process Control:
Because of the low percentage of solids in this flux, control of specific gravity with automated equipment usually is found to
be ineffective; therefore, control via titration is necessary. AIM’s Titration Kit has proven to be cost-effective, user
friendly, quick and accurate. Titration should be carried out at least once an hour for flux foaming operations, or more often
if large variances are found.
Thermal Profile:
C
200
150
100
50
0
0
20
40
Sec
60
80
100
RATE of RISE
2-3 ºC / SEC MAX
PROGRESS THROUGH
66°C - 77°C ( 150 - 170ºF )
40 SECONDS
PCB TOP SIDE TEMP
87°C - 115°C ( 190ºF - 240ºF )
JUST BEFORE WAVE
COOLDOWN
4ºC
Cleaning:
NC264-5 can be cleaned, if necessary, with saponified water or an appropriate solvent cleaner. Please refer to the AIM No-
Clean-Cleaner Matrix for a list of suitable cleaning materials.

21060相似产品对比

21060
描述 Solder 254,T4,LEADED SOLDER PASTE 10CC
Product Attribute Attribute Value
制造商
Manufacturer
AIM
产品种类
Product Category
Solder
RoHS Not Applicable

 
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