Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Raytheon Company |
| 包装说明 | 0.300 INCH, CERDIP-24 |
| Reach Compliance Code | unknown |
| 其他特性 | OPTEMP SPECIFIED AS TC |
| 边界扫描 | NO |
| 最大时钟频率 | 30 MHz |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.94 mm |
| 低功率模式 | NO |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 40 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 |
| 5962-8944602LA | 5962-89446023A | 5962-89446013A | 5962-8944601LA | |
|---|---|---|---|---|
| 描述 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Pipeline Register, 8-Bit, CMOS, CQCC28, HERMETIC SEALED, CERAMIC, CC-28 | Pipeline Register, 8-Bit, CMOS, CQCC28, HERMETIC SEALED, CERAMIC, CC-28 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24 |
| 包装说明 | 0.300 INCH, CERDIP-24 | HERMETIC SEALED, CERAMIC, CC-28 | HERMETIC SEALED, CERAMIC, CC-28 | 0.300 INCH, CERDIP-24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | OPTEMP SPECIFIED AS TC | OPTEMP SPECIFIED AS TC | OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 20MHZ | OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 20MHZ |
| 边界扫描 | NO | NO | NO | NO |
| 最大时钟频率 | 30 MHz | 30 MHz | 30 MHz | 30 MHz |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 31.94 mm | 11.455 mm | 11.455 mm | 31.94 mm |
| 低功率模式 | NO | NO | NO | NO |
| 端子数量 | 24 | 28 | 28 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 8 | 8 | 8 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCN | QCCN | DIP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.54 mm | 2.54 mm | 5.08 mm |
| 最大压摆率 | 40 mA | 40 mA | 40 mA | 40 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL |
| 宽度 | 7.62 mm | 11.455 mm | 11.455 mm | 7.62 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 | 1 | 1 | - |
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