832B Technical Data Sheet
Epoxy Encapsulating & Potting Compound
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
832B
Description
832B
potting and encapsulating compound
is a black, general purpose, hard, two-part epoxy that offers
extreme environmental, mechanical and physical protection for printed circuit boards and electronic
assemblies.
Due to its low mixed viscosity, 832B can easily penetrate small gaps and cavities. It also provides
excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal
shock, environmental humidity, salt water, fungus, and many harsh chemicals.
This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment.
832B can be cured at room temperature or higher.
Benefits and Features
•
•
•
•
•
•
•
•
Convenient 2A:1B volume mix ratio
Low mixed viscosity of 3 300 cP
Extremely high compressive and tensile strength
Excellent adhesion to a wide variety of substrates including metals, composites, glass,
ceramics, and many plastics
Excellent electrical insulating characteristics
Broad service temperature range -40 to 140 °C (-40 to 284 °F)
Extreme resistance to water and humidity (allows for submersion where needed)
Solvent-free
Usage Parameters
Properties
Working Time @22 °C [72 °F]
Shelf Life
Full Cure @22 °C [72 °F]
Full Cure @65 °C [149 °F]
Full Cure @80 °C [176 °F]
Full Cure @100 °C [212 °F]
a)
Temperature Ranges
Value
1h
≥3
y
24 h
1h
45 min
35 min
Properties
Constant Service
Temperature
Maximum Intermittent
Temperature
b)
Storage Temperature
of Unmixed Parts
Value
-40 to 140 °C
[-40 to 284 °F]
175 °C
[347 °F]
16 to 27 °C
[60 to 80 °F]
a) Working time and full cure assumes room
temperature and 100 g. A 10 °C increase can
decrease the working time by half.
b) Temperature that components can withstand
for short periods without sustaining damage.
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Rev. Date: 30 November 2017 / Ver. 2.03
832B Technical Data Sheet
Epoxy Encapsulating & Potting Compound
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
832B
Principal Components
Name
Part A: Bis-A Epoxide Resin
Alkyl Glycidyl Ether Epoxide Resin
Part B: Curing Polyamide
Curing Aliphatic amine
CAS Number
25068-38-6
68609-97-2
68082-29-1
112-24-3
Properties of Cured 832B
Physical Properties
Color
Density @26 °C [79 °F]
Hardness
Tensile Strength
Elongation
Lap Shear Strength (SS 304)
Izod Impact @0.259"
Compressive Strength
Flexural Strength
Electrical Properties
Breakdown Voltage @2.79 mm
Dielectric Strength @2.79 mm
Breakdown Voltage @3.175 mm [1/8"]
Dielectric Strength @3.175 mm [1/8"]
Volume Resistivity @0.95"
Comparative Tracking Index
Dielectric Dissipation & Constant
Dissipation & Constant
@1 kHz
Dissipation & Constant
@10 kHz
Dissipation & Constant
@100 kHz
Dissipation & Constant
@1 MHz
Method
Visual
ASTM D 792
Shore D Durometer
ASTM D 638
ASTM D 638
ASTM D 1002
ASTM D 256
ASTM D 695
ASTM D 790
Method
ASTM D 149
ASTM D 149
Reference fit
b)
Reference fit
b)
ASTM D 257
ASTM D 3628
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
Value
a)
Black
1.11 g/cm
3
80D
56.9 N/mm
2
3.3%
4.2 N/mm
2
0.932 kJ/m
2
155 N/mm
2
114 N/mm
2
Value
51.9 kV
472 V/mil [18.6
55.3 kV
442 V/mil [17.4
5.3 x 10
12
Ωcm
Not established
dissipation, D
0.008
0.013
0.018
0.017
[8 250 lb/in
2
]
[606 lb/in
2
]
[0.443 ft·lb/in]
[22 400 lb/in
2
]
[16 500 lb/in
2
]
kV/mm]
kV/mm]
constant, k’
2.95
2.89
2.83
2.77
Note:
Specifications are for epoxy samples cured at 65 °C for 1 hour, with additional curing time at room
temperature for optimal results. For most tests, samples were conditioned at 23 °C and 50% RH.
a) N/mm
2
= mPa; lb/in
2
= psi;
b) To allow comparison between products, the Tautscher equation was fitted to the experimental dielectric
strengths and interpolated to a standard reference thickness of 1/8" (3.175 mm).
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Rev. Date: 30 November 2017 / Ver. 2.03
832B Technical Data Sheet
Epoxy Encapsulating & Potting Compound
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
832B
Value
49 °C [120 °F]
47 °C [116 °F]
79 ppm/°C
196 ppm/°C
0.26 W/(mK)
0.26 W/(mK)
0.30 W/(mK)
2.2
J/(g∙K)
0.11 mm
2
/s
Thermal Properties
Glass Transition Temperature (T
g
)
Heat Deflection Temperature (HDT)
c)
Coefficient of Thermal Expansion (CTE)
d)
Before Tg
After Tg
Thermal Conductivity @25 °C [77 °F]
Thermal Conductivity
@50 °C [122 °F]
Thermal Conductivity
@100 °C [212 °F]
Specific Heat @25 °C [77 °F]
Thermal Diffusivity @25 °C [77 °F]
Method
ASTM D 3418
ASTM D 648
ASTM
ASTM
ASTM
ASTM
ASTM
ASTM
ASTM
E
E
E
E
E
E
E
831
831
1461
1461
1461
1461
1461
c) HDT under 1820 kPa [264 lb/in
2
] load
d) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6
Properties of Uncured 832B
Physical Properties
Color
Viscosity @20 °C [73 °F]
Density
Mix Ratio by volume (A:B)
Mix Ratio by weight (A:B)
Solids Content (w/w)
Mixture
Black
3 300 cP [3.3 Pa·s]
a)
1.08 g/mL
2.0:1.0
2.3:1.0
99%
Physical Properties
Color
Viscosity @24 °C [73 °F]
Density
Flash Point
Odor
Part A
Black
2 200 cP [2.2 Pa·s]
1.13 g/mL
>150 °C [302 °F]
Mild
Part B
Clear, Amber Tint
5 800 cP [5.8 Pa·s]
0.96 g/mL
>122 °C [>252 °F]
Musty
a) Brookfield viscometer at 50 RPM with spindle #4
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Rev. Date: 30 November 2017 / Ver. 2.03
832B Technical Data Sheet
Epoxy Encapsulating & Potting Compound
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
832B
Compatibility
Adhesion—As
seen in the substrate adhesion table, the 832B epoxy adheres to most plastics and metals
used to house printed circuit assemblies; however, it is not compatible with contaminants like water, oil,
or greasy flux residues, which may affect adhesion. In case of contamination, first clean the surface to be
coated with MG Chemicals 824 Isopropyl Alcohol.
Substrate Adhesion in Decreasing Order
Physical Properties
Aluminum
Steel
Fiberglass
Wood
Glass
Polycarbonate
Acrylic
Polypropylene
Adhesion
Stronger
Weaker
Chemical Resistance—The
chemical solvent resistance table presents the percent weight change over
the indicated period. The results show low water absorption and a high chemical resistance to water and
most ionic species. Softening and swelling occurs for aggressive organic solvents.
Chemical Solvent Resistance
Physical Properties
Water
Hydrochloric Acid
Isopropyl alcohol
Mineral spirits
Xylene
Ethyl Lactate
Iso hexanes
Acetone
Weight Change
3 days
<0.0 %
<0.0 %
0.3%
0.3 %
2%
3%
5%
7%
Weight Change
45 days
<1%
<1%
<1%
0.3 %
9%
7%
8%
destroyed
Storage
Store between 16 and 27 °C [60 and 80 °F] in a dry area, away from sunlight. Prolonged storage, or
storage at or near freezing temperatures, can result in crystallization.
If crystallization occurs, reconstitute the component to its original state by temporarily warming it to
between 50 and 60 °C [122 and 140 °F]. To ensure full homogeneity, stir the warm component
thoroughly, reincorporating all settled material, then re-secure container lid and let cool before use.
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Rev. Date: 30 November 2017 / Ver. 2.03
832B Technical Data Sheet
Epoxy Encapsulating & Potting Compound
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
832B
Health and Safety
Please see the 832B
Safety Data Sheet
(SDS) parts A and B for further details on transportation,
storage, handling, safety guidelines, and regulatory compliance.
Application Instructions
For best results, follow the procedure below.
To prepare 2:1 (A:B) epoxy mixture:
•
•
•
•
•
•
•
Scrape settled material free from the bottom and sides of
Part A
container; stir material until
homogenous.
Measure
two
parts by volume of the pre-stirred
A,
and pour into the mixing container.
Measure
one
part by volume of the pre-stirred
B,
and pour slowly into the mixing container while
stirring.
Let sit for 15 minutes to de-air.
—OR—
Put in a vacuum chamber, bring to 25 inHg pressure, and wait for 2 minutes to de-air.
If bubbles are present at the top, break them gently with the mixing paddle.
Pour mixture into the mold or container holding the components to be encapsulated.
Close container tightly between uses to prevent skinning.
A
TTENTION
!
Mixing >500 g [0.4 L] of Part
B
at a time into
A
decreases working life and promotes flash
cure. Use of epoxy mixing machines with static stirrers recommended for large volumes. Limit size of
hand-mixed batches.
Peak Exotherm Temperature
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Rev. Date: 30 November 2017 / Ver. 2.03
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