RS9113 Module Family
Datasheet
Version 3.3
September 2016
Redpine Signals, Inc.
2107 N. First Street, #540
San Jose, CA 95131.
Tel: (408) 748-3385
Fax: (408) 705-2019
Email:
info@redpinesignals.com
Website:
www.redpinesignals.com
Redpine Signals, Inc. Proprietary and Confidential
RS9113 Module Family
Datasheet
Version 3.3
Overview:
The RS9113
module family is based on Redpine Signals’
RS9113 ultra-low-power Convergence SoC. These
modules offer dual-band 1x1 802.11n, dual-mode
Bluetooth 4.0 and ZigBee® 802.15.4 in a single device.
They are high performance, long range and ultra-low
power modules and include a proprietary multi-
threaded MAC processor called ThreadArch®, digital
and analog peripheral interfaces, baseband digital
signal processor, calibration OTP memory, dual-band RF
transceiver, dual-band high-power amplifiers, baluns,
diplexers, diversity switch
and Quad-SPI flash.
The modules are offered with two software
architectures – hosted and embedded. The hosted
variant (n-Link®) realizes a host-based architecture
where the necessary MAC and PHY layers are
implemented in the device to support high-
performance, long range WLAN, Bluetooth and ZigBee
applications in a 32-bit host processor over
SDIO or USB
interfaces.
The embedded variants (WiSeConnect® and
Connect-io-n®) realize WLAN, Bluetooth and ZigBee
protocols along with Wi-Fi Direct™(
1
),
WPA/WPA2-PSK,
WPA/WPA2-Enterprise (EAP-TLS, EAP-FAST, EAP-TTLS,
EAP-PEAP) (
1
) and a feature-rich networking
stack thus
providing a fully-integrated solution for embedded low-
end wireless applications.
These modules can be
connected to 8/16/32-bit host processors
through SPI,
UART, USB and USB-CDC interfaces.
The modules are available in two hardware footprints.
One footprint type comes with an integrated antenna
and a U.FL connector and the other footprint comes
without an integrated antenna.
Module Features:
WLAN:
Compliant to single-spatial stream IEEE 802.11
a/b/g/n with dual band (2.4 and 5 GHz) support.
Support for 20MHz and 40MHz (n-Link™ only)
channel bandwidths.
Transmit power up to +18dBm with integrated PA.
Receive sensitivity of -97dBm.
Bluetooth:
Compliant to dual-mode Bluetooth 4.0
Transmit power up to 15dBm (class-1) with
integrated PA.
Receive sensitivity of -94 dBm.
ZigBee:
Compliant to IEEE 802.15.4
Transmit power up to 15 dBm with integrated PA.
Receive sensitivity of -102 dBm.
ZigBee Pro stack embedded.
n-Link®:
Seamless integration with 32-bit processors
over SDIO and USB.
Host Drivers for Linux, Android and
Windows
2
WiSeConnect® and Connect-io-n®:
WLAN, Bluetooth and ZigBee stacks
embedded in the device.
Supports Wi-Fi Direct™(
1
), Access point
mode, WPA/WPA2-PSK, WPA/WPA2-
Enterprise (EAP-TLS, EAP-FAST, EAP-TTLS,
EAP-PEAP) (
1
)
Bluetooth profiles embedded.
3
ZigBee Pro stack embedded.
TCP/IP stack (IPv4/IPv6), HTTP/HTTPS, DHCP,
ICMP, SSL 3.0/TLS1.2, Websockets, IGMP,
FTP Client, SNTP, DNS, mDNS, DNS-SD,
SNMP
4
embedded in the device.
SPI, UART, USB, USB-CDC host interfaces.
Applications:
Smartphones, Tablets and e-Readers
VoWi-Fi phones
Smart meters and in-home displays
Industrial automation and telemetry
MP3 music and MP4 video players
Medical devices
Industrial monitoring and control
Home and building automation
Wireless Headset
General:
FCC, IC, ETSI/CE Certified
U.FL connector for external antenna connection.
Dual external antenna for antenna diversity (n-
Link™ only.
Wireless firmware upgrade (for
WiSeConnect™ and Connect-io-n™ only)
Options for single supply of 3.0 to 3.6 V operation
or multiple supplies for power saving
5
.
Operating temperature range: -40
o
C to +85
o
C
1
2
This feature is specific to WiSeConnect® Modules and not available in Connect-io-n® Modules.
Drivers for Linux and Android available now. Contact Redpine Signals Sales (sales@redpinesignals.com) for
availability of drivers Windows.
3
Refer to the Features section for list of profiles supported.
4
mDNS and DNS-SD supported in future software releases.
5
USB Interface needs VBUS level of 5V for detection and enumeration.
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RS9113 Module Family
Datasheet
Version 3.3
About this Document
This document describes the RS9113 module family specifications. The document covers the modules’
hardware and software features, package descriptions, pin descriptions, interface specifications, electrical
characteristics, performance specifications, reliability and certification information and ordering
information.
Disclaimer:
The information in this document pertains to information related to Redpine Signals, Inc. products. This
information is provided as a service to our customers, and may be used for information purposes only.
Redpine assumes no liabilities or responsibilities for errors or omissions in this document. This document
may be changed at any time at Redpine’s sole discretion without any prior notice to anyone.
Copyright © 2016 Redpine Signals, Inc. All rights reserved.
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Page 3
RS9113 Module Family
Datasheet
Version 3.3
Table Of Contents
1
2
3
Overview ................................................................................................................7
1.1
1.2
Block Diagram ............................................................................................................ 7
Product Naming and Variants ..................................................................................... 8
Features ............................................................................................................... 10
Package Description ............................................................................................. 18
3.1
Package Description of Module without Antenna (Package # P6) ............................. 18
Mechanical Characteristics ................................................................................................... 18
Package Dimensions ............................................................................................................. 19
PCB Landing Pattern ............................................................................................................. 20
Mechanical Characteristics ................................................................................................... 20
Package Dimensions ............................................................................................................. 21
PCB Landing Pattern ............................................................................................................. 23
3.1.1
3.1.2
3.1.3
3.2
Package Description of Module with Antenna (Package # P7) ................................... 20
3.2.1
3.2.2
3.2.3
3.1
3.2
Recommended Reflow Profile .................................................................................. 24
Baking Instructions................................................................................................... 24
Pinout of Module without Antenna .......................................................................... 25
Pinout of Module with Integrated Antenna .............................................................. 26
Pin Description ......................................................................................................... 26
Absolute Maximum Ratings ..................................................................................... 37
Recommended Operating Conditions ....................................................................... 38
DC Characteristics – Digital I/O Signals ..................................................................... 38
AC Characteristics .................................................................................................... 38
4
Pinout and Pin Description ................................................................................... 25
4.1
4.2
4.3
5
Specifications ....................................................................................................... 37
5.1
5.2
5.3
5.4
5.4.1
SDIO Interface ....................................................................................................................... 38
5.4.1.1 Full Speed Mode ............................................................................................................... 38
5.4.1.2 High Speed Mode ............................................................................................................. 40
5.4.2
SPI Slave (Host SPI) Interface ................................................................................................ 41
5.4.2.1 Low Speed Mode .............................................................................................................. 41
5.4.2.2 High Speed Mode ............................................................................................................. 42
5.4.3
I
2
C Interface .......................................................................................................................... 43
5.4.3.1 Fast Speed Mode .............................................................................................................. 43
5.4.3.2 High Speed Mode ............................................................................................................. 44
5.4.4
I
2
S and PCM Interfaces ......................................................................................................... 45
5.4.5
USB Interface ........................................................................................................................ 46
5.4.5.1 Timing Characteristics....................................................................................................... 46
5.4.5.2 Electrical Characteristics ................................................................................................... 47
5.4.5.3 Voltage Thresholds ........................................................................................................... 47
5.4.6
Reset Timing ......................................................................................................................... 47
5.5
Regulatory Specifications and Certifications ............................................................. 47
Regulatory Specifications ..................................................................................................... 47
Software Certifications ......................................................................................................... 48
5.5.1
5.5.2
6
Software Architecture .......................................................................................... 49
6.1
n-Link® Software Architecture .................................................................................. 49
Operating System Support ................................................................................................... 50
6.1.1
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RS9113 Module Family
Datasheet
Version 3.3
6.2
WiSeConnect®/Connect-io-n® Software Architecture ............................................... 50
Module Marking Information ................................................................................... 52
Ordering Information ............................................................................................... 52
Collateral ................................................................................................................. 55
Collateral for n-Link® Modules ............................................................................................. 55
Collateral for WiSeConnect®/Connect-io-n® Modules ......................................................... 55
7
Module Marking and Ordering Information.......................................................... 52
7.1
7.2
7.3
7.4
7.5
7.3.1
7.3.2
Packing Information ................................................................................................. 55
Contact Information ................................................................................................. 56
Table of Figures
Figure 1: Block Diagram of RS9113 Module without Integrated Antenna ................................................ 7
Figure 2: Block Diagram of RS9113 Module with Integrated Antenna ..................................................... 8
Figure 3: RS9113 Modules’ Naming Convention ..................................................................................... 8
Figure 4: Package Dimensions of Module without Antenna .................................................................. 19
Figure 5: PCB Landing Pattern of Module without Antenna .................................................................. 20
Figure 6: Package Dimensions of Module with Antenna ....................................................................... 22
Figure 7: PCB Landing Pattern of Module with Antenna ....................................................................... 23
Figure 8: Reflow Diagram .................................................................................................................... 24
Figure 9: Pinout Diagram of Module without Antenna ......................................................................... 25
Figure 10: Pinout Diagram of Module with Antenna ............................................................................. 26
Figure 11: SDIO Interface Timings – Full Speed Mode ........................................................................... 40
Figure 12: SDIO Interface Timings – High Speed Mode ......................................................................... 41
Figure 13: Slave SPI Interface Timings – Low Speed Mode .................................................................... 42
Figure 14: Slave SPI Interface Timings – High Speed Mode ................................................................... 43
Figure 15: Interface Timings – I
2
C Fast Speed Mode.............................................................................. 44
Figure 16: Interface Timings – I
2
C High Speed Mode ............................................................................. 44
Figure 17: Interface Timings – I
2
S ......................................................................................................... 45
Figure 18: Interface Timings – PCM ...................................................................................................... 46
Figure 19: Reset Timing ....................................................................................................................... 47
Figure 20: n-Link® Software Architecture ............................................................................................. 49
Figure 21: WiSeConnect®/Connect-io-n® Software Architecture ........................................................... 50
Figure 22: Module Marking Information .............................................................................................. 52
Figure 23: Mechanical Details of Tray for P6 Package ........................................................................... 55
Figure 24: Mechanical Details of Tray for P7 Package ........................................................................... 56
Table of Tables
Table 1: RS9113 Module Family Features ............................................................................................. 17
Table 2: Mechanical Dimensions of Module without Antenna .............................................................. 18
Table 3: Mechanical Dimensions of Module with Antenna ................................................................... 20
Table 4: Pin Descriptions ..................................................................................................................... 36
Table 5: Absolute Maximum Ratings .................................................................................................... 37
Table 6: Recommended Operating Conditions ..................................................................................... 38
Table 7: Input/Output DC Characteristics ............................................................................................. 38
Table 8: AC Characteristics – SDIO Full Speed Mode (as per SDIO v2.0 Protocol) ................................... 39
Table 9: AC Characteristics – SDIO Full Speed Mode (on Silicon) ........................................................... 39
Table 10: AC Characteristics – SDIO High Speed Mode (as per SDIO v2.0 Protocol)................................ 40
Table 11: AC Characteristics – SDIO High Speed Mode (on Silicon)........................................................ 41
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