1N6640U
Aerospace 0.3 A - 75 V switching diode
Datasheet
-
production data
Description
A
K
Packaged in LCC2D this device intended for use
in low voltage, high frequency inverters, free
wheeling, polarity protection and other aerospace
applications.
K
A
Leadless chip carrier 2 (LCC2D)
Features
Surface mount hermetic package
High thermal conductivity materials
Very small conduction losses
Negligible switching losses
Extremely fast switching
Low forward voltage drop
Target radiation qualification
– 150 krad (Si) low dose rate
– 3 Mrad (Si) high dose rate
Package mass: 0.12 g
ESCC
detailed
specification
Table 1. Device summary
(1)
Quality level
Engineering model
Lead
finish
Gold
Gold
Solder dip
Yes
Yes
0.3
75
175
1,06
EPPL
I
F(AV)
V
RRM
T
j(max)
VF
(max)
Order code
1N6640UD1
1N6640U01D
1N6640U02D
5101/027/07
5101/027/08
ESCC
ESCC
1. Contact ST sales office for information about the specific conditions for products in die form.
December 2015
This is information on a product in full production.
DocID16971 Rev 4
1/9
www.st.com
Characteristics
1N6640U
1
Characteristics
Table 2. Absolute ratings (limiting values)
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T
stg
T
j
T
sol
Parameter
Repetitive peak reverse voltage
Forward rms current
Average forward rectified current
(1)
Forward surge current
Storage temperature range
Operating junction temperature range
Maximum soldering temperature
(2)
t
p
= 8.3 ms sinusoidal,
t
amb
25 °C
Value
75
0.5
300
2
-65 to +175
-65 to +175
245
Unit
V
A
mA
A
°C
°C
°C
1. For all variants at T
c
+155 °C per diode, derate linearly to 0 A at +175 °C.
2. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed.
Table 3. Thermal resistance
Symbol
R
th (j-c)
R
th (j-a)
Junction to case
(1)
Junction to ambient
Parameter
Value
60
280
Unit
C/W
1. Package mounted on infinite heatsink
Table 4. Static electrical characteristics
Symbol
V
BR (1)
I
R (1)
Parameter
Breakdown voltage
Reverse current
Tests conditions
T
j
= 25 °C
T
j
= 25 °C
T
j
= 150 °C
T
j
= 25
C
T
j
= 25
C
V
F (2)
Forward voltage
T
j
= 25
C
T
j
= 25
C
T
j
= -55
C
1. Pulse test: tp = 10 ms,
δ
< 2%
2. Pulse test: tp = 680 µs,
δ
< 2%
Min.
75
-
Typ.
-
-
-
-
-
-
-
-
Max.
-
40
30
630
890
980
1100
1200
Unit
V
nA
µA
I
R
= 10 µA
V
R
= 50 V
I
F
= 1 mA
I
F
= 50 mA
I
F
= 100 mA
I
F
= 200 mA
I
F
= 200 mA
-
540
760
820
870
-
mV
To evaluate the conduction losses use the following equation:
P = 0.74 x
IF(AV)
+ 1.00 x I
F2(RMS )
2/9
DocID16971 Rev 4
1N6640U
Table 5. Dynamic characteristics
Symbol
t
rr
V
FP
t
FR
C
j
Parameter
Reverse recovery time
Forward recovery voltage
Forward recovery time
Diode capacitance
I
F
= I
R
= 10 mA
I
F
= 1 A, V
r
= 30 V, dI/dt = -15 A/µs
I
FM
= 200 mA
I
FM
= 200 mA
V
R
= 0 V, V = 50 mV, F = 1 MHz
-
-
-
Test conditions
Characteristics
Min. Typ. Max. Unit
-
-
9
ns
20
-
-
-
5
20
3
V
ns
pF
Figure 1. Forward voltage drop versus forward Figure 2. Forward voltage drop versus forward
current (typical values)
current (maximum values)
I
FM
(A)
1.2
1.2
I
FM
(A)
1.0
1.0
0.8
0.8
0.6
T
j
=150 °C
0.6
T
j
=150 °C
0.4
T
j
=25 °C
T
j
=-55 °C
0.4
T
j
=25 °C
T
j
=-55 °C
0.2
0.2
V
FM
(V)
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
V
FM
(V)
1.8
2.0
Figure 3. Reverse leakage current versus
reverse voltage applied (typical values)
Figure 4. Relative variation of thermal
impedance, junction to case, versus pulse
duration
Z
th
(j-c)
/R
th(j-c)
1.E+03
I
R
(nA)
1.0
0.9
T
j
=150 °C
0.8
0.7
0.6
1.E+02
1.E+01
T
j
=75 °C
0.5
0.4
0.3
Single pulse
1.E+00
T
j
=25 °C
0.2
0.1
1.E-01
0
10
20
30
40
50
60
V
R
(V)
70
80
t
P
(s)
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
0.0
1.E-06
DocID16971 Rev 4
3/9
9
Characteristics
1N6640U
Figure 5. Junction capacitance versus reverse voltage applied (typical values)
10.0
C(pF)
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
1.0
V
R
(V)
0.1
1
10
100
4/9
DocID16971 Rev 4
1N6640U
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
2.1
Leadless chip carrier 2 (LCC2D) package information
Figure 6. Leadless chip carrier 2 (LCC2D) package outline
A
B
D
Note 1
2
C
1
F
Pin 2 Cathode
Pin 1 Anode
Note 1
E
Note 1
E
H
1
2
r1
G
I
r2
1. The anode is identified by metalization in two top internal angles and the index mark.
DocID16971 Rev 4
5/9
9
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