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BM20B08-10DP-04V75

产品描述Board to Board & Mezzanine Connectors
产品类别连接器   
文件大小2MB,共12页
制造商Hirose
官网地址http://www.hirose-connectors.com/
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BM20B08-10DP-04V75概述

Board to Board & Mezzanine Connectors

BM20B08-10DP-04V75规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
Hirose
产品种类
Product Category
Board to Board & Mezzanine Connectors
RoHSDetails
工厂包装数量
Factory Pack Quantity
8000

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0.4 mm Pitch, 0.6 and 0.8 mm Height, Board-to-Board and Board-to-FPC Connectors
BM20 Series
■Receptacle
Existing products
BM20
2.3mm
2.98mm
2.46mm
10.4mm
10.48mm
Feb.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
A 22.3%
reduction
Existing products
in size!
BM20
2.98 ∞ 10.4
=About 31.0mm
2
2.3 ∞ 10.48
= About 24.1mm
2
■Header
Existing products
BM20
■Features
1. High density mounting capability
A space saving design that keeps the connector
compact, but still maintains an adequate vacuum
area (no less than 0.7mm wide).
Depth DS: 2.3 mm DP: 1.78 mm
9.32mm
9.4mm
Board occupied area
A 27.1%
reduction
Existing products
in size!
2. Reliable contact performance
Even though the mated height is low, the BM20 still
leads it class in maximum effective mating lengths
for each mating height.
<Effective Mating Length>
Height 0.8 mm: 0.2 mm
Height 0.6 mm: 0.15 mm
The addition of the two point contact system adds
more reliability to the contacts.
BM20
2.46 ∞ 9.32
= About 22.9mm
2
1.78 ∞ 9.4
= About 16.7mm
2
Vaccum pick-up
3. No restrictions to PCB pattern design
for the 0.8 mm height connector
*1
This series utilizes a thin wall to insulate the
bottom surface of the connector and maintains an
effective mating length of 0.2 mm. This removes
any restriction for PCB pattern layout design
under the connector.
Note *1: There are some restrictions for the 0.6
mm height style.
Mating diagram (cross section)
H=0.8
2-point contact
structure
Molded Bottom
surface structure
4. Enhanced mating operations
The structure uses guide ribs to ease the mating
process and offers a self alignment range of up to
0.3 mm. A clear tactile click is used as an
indicator to the user that the mating process was
completed.
5. Drop and shock resistant structure
Dimples were designed into the contacts to
increase their retention force and to absorb the
shock delivered from a drop or other impact.
6. Debris resisting design
When mated, the connector’s design covers the
contacts which help to keep dust and other debris
away from the contacts. The SMT leads are kept
very close to the connector housing which also
helps to prevent shorts caused by debris on the
exposed contacts
H=0.6
Molded Bottom
surface structure
1.78
mm
2013.11②
1

 
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