• Load Switch, PA Switch and Battery Switch for Portable
Devices
S
1
S
2
1
S
1
2
G
1
D
1
D
1
6
5
2.05 mm
G
2
4
S
2
2.05 mm
D
2
D
2
3
DCX
Part # code
XXX
Lot Traceability
and Date code
D
1
Ordering Information:
SiA911DJ-T1-E3 (Lead (Pb)-free)
P-Channel MOSFET
D
2
P-Channel MOSFET
Marking Code
G
1
G
2
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
d, e
Symbol
V
DS
V
GS
I
D
I
DM
I
S
Limit
- 20
±8
- 4.5
a
- 4.5
a
- 3.6
b, c
- 2.9
b, c
-8
- 4.5
a
- 1.6
b, c
6.5
5
1.9
b, c
1.2
b, c
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
A
Pulsed Drain Current
Continuous Source-Drain Diode Current
Maximum Power Dissipation
P
D
T
J
, T
stg
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
b, f
t
≤
5 sec
Steady State
Symbol
R
thJA
R
thJC
Typical
52
12.5
Maximum
65
16
Unit
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 Board.
c. t = 5 sec.
d. See Solder Profile (
h
ttp://www.vishay.com/ppg?73257).
The PowerPAK SC70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is
not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 74329
S-62027-Rev. A, 16-Oct-06
www.vishay.com
1
SiA911DJ
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= - 4.5 A, di/dt = 100 A/µs, T
J
= 25 °C
I
S
= - 4.5 A, V
GS
= 0 V
- 0.85
30
13
10
15
T
C
= 25 °C
- 4.5
8
- 1.2
60
26
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= - 10 V, R
L
= 2.2
Ω
I
D
≅
- 4.5 A, V
GEN
= - 8 V, R
g
= 1
Ω
V
DD
= - 10 V, R
L
= 2.2
Ω
I
D
≅
- 4.5 A, V
GEN
= - 4.5 V, R
g
= 1
Ω
f = 1 MHz
V
DS
= - 10 V, V
GS
= - 8 V, I
D
= - 4.5 A
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 4.5 A
V
DS
= - 10 V, V
GS
= 0 V, f = 1 MHz
355
75
50
8.5
4.9
0.75
1.2
8
10
35
40
50
5
10
20
10
15
55
60
75
10
15
30
15
ns
Ω
12.8
7.4
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
r
DS(on)
g
fs
V
GS
= 0 V, I
D
= - 250 µA
I
D
= - 250 µA
V
DS
= V
GS
, I
D
= - 250 µA
V
DS
= 0 V, V
GS
= ± 8 V
V
DS
= - 20 V, V
GS
= 0 V
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≤
5 V, V
GS
= - 4.5 V
V
GS
= - 4.5 V, I
D
= - 2.8 A
V
GS
= - 2.5 V, I
D
= - 2.3 A
V
GS
= - 1.8 V, I
D
= - 0.54 A
V
DS
= - 10 V, I
D
= - 2.8 A
8
0.078
0.109
0.153
7
0.094
0.131
0.185
S
Ω
- 0.4
- 20
- 16.2
2.1
-1
± 100
-1
- 10
V
mV/°C
V
ns
µA
A
Symbol
Test Conditions
Min
Typ
Max
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 74329
S-62027-Rev. A, 16-Oct-06
SiA911DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
10
25 °C, unless noted
2.0
I
D
– Drain Current (A)
V
GS
= 2.5 thru 5 V
6
2V
4
1.5 V
2
I
D
– Drain Current (A)
8
1.6
1.2
T
C
= 125 °C
0.8
T
C
= 25 °C
0.4
T
C
= - 55 °C
0
0.0
0.4
0.8
1.2
1.6
2.0
0.0
0.0
0.3
0.6
0.9
1.2
1.5
V
DS
– Drain-to-Source Voltage (V)
V
GS
– Gate-to-Source Voltage (V)
Output Characteristics
0.3
600
Transfer Characteristics
500
0.25
r
DS ( o n )
– On-Resistance (Ω)
C – Capacitance (pF)
V
GS
= 1.8 V
400
0.2
V
GS
= 2.5 V
0.15
C
iss
300
200
C
oss
C
rss
0.1
V
GS
= 4.5 V
100
0.05
0
2
4
6
I
D
– Drain Current (A)
8
10
0
0
4
8
12
16
20
V
DS
– Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
8
V
GS
– Gate-to-Source Voltage (V)
I
D
= 4.5 A
1.4
V
DS
= 10 V
r
DS(on)
– On-Resistance
(Normalized)
6
1.6
I
D
= 2.8 A
Capacitance
1.2
4
V
DS
= 16 V
1.0
V
GS
= 4.5 V, 2.5 V, 1.8 V
0.8
2
0
0
2
4
6
8
10
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
– Total Gate Charge (nC)
T
J
– Junction Temperature (°C)
Gate Charge
Document Number: 74329
S-62027-Rev. A, 16-Oct-06
On-Resistance vs. Junction Temperature
www.vishay.com
3
SiA911DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless noted
10
0.3
I
D
= 2.8 A
0.25
T
J
= 150 °C
T
J
= 25 °C
r
DS(on)
– On-Resistance (Ω)
I
S
– Source Current (A)
0.2
T
A
= 125 °C
0.15
1
0.1
T
A
= 25 °C
0.1
0
0.2
0.4
0.6
0.8
1
1.2
0.05
0
1
2
3
4
5
V
GS
– Gate-to-Source Voltage (V)
V
SD
– Source-to-Drain Voltage (V)
Soure-Drain Diode Forward Voltage
0.9
20
On-Resistance vs. Gate-to-Source Voltage
0.8
15
V
GS(th)
(V)
Power (W)
0.7
I
D
= 250 µA
0.6
10
5
0.5
0.4
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
10
100
1000
T
J
– Temperature (°C)
Pulse (sec)
Threshold Voltage
10
*Limited by r
DS(on)
I
D(on)
limited
Single Pulse Power, Junction-to-Ambient
IDM limited
100 µs
I
D
- Drain Current (A)
1
1 ms
10 ms
100 ms
1s
10 s
dc
T
A
= 25 °C
Single Pulse
BVDSS limited
1
10
100
0.1
0.01
0.1
V
DS
- Drain-to-Source Voltage (V)
*V
GS
> minimum V
GS
at which r
DS(on)
is specified
Safe Operating Area, Junction-to-Case
www.vishay.com
4
Document Number: 74329
S-62027-Rev. A, 16-Oct-06
SiA911DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless noted
8
8
I
D
– Drain Current (A)
Package Limited
4
Power Dissipation (W)
6
6
4
2
2
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
T
C
– Case Temperature (°C)
T
C
– Case Temperature (°C)
Current Derating*
Power Derating
*The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissi-
pation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
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