Agilent HMPS-282x Series
MiniPak Surface Mount
RF Schottky Barrier Diodes
Data Sheet
Features
• Surface mount MiniPak package
– low height, 0.7 mm (0.028") max.
– small footprint, 1.75 mm
2
(0.0028 inch
2
)
• Better thermal conductivity for
higher power dissipation
Description/Applications
These ultra-miniature products
represent the blending of Agilent
Technologies’ proven semiconduc-
tor and the latest in leadless
packaging. This series of Schottky
diodes is the most consistent and
best all-round device available,
and finds applications in mixing,
detecting, switching, sampling,
clamping and wave shaping at
frequencies up to 6 GHz. The
MiniPak package offers reduced
parasitics when compared to
conventional leaded diodes, and
lower thermal resistance.
Package Lead Code Identification
(Top View)
2
Single
3
4
3
Anti-parallel
4
3
Parallel
4
The HMPS-282x family of diodes
offers the best all-around choice
for most applications, featuring
low series resistance, low forward
voltage at all current levels and
good RF characteristics.
Note that Agilent’s manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
• Single and dual versions
• Matched diodes for consistent
performance
• Low turn-on voltage (as low as
0.34 V at 1 mA)
• Low FIT (Failure in Time) rate*
• Six-sigma quality level
* For more information, see the Surface
Mount Schottky Reliability Data Sheet.
Pin Connections and
Package Marking
3
4
AA
1
Product code
Date code
2
#0
1
2
#2
1
2
#5
1
Notes:
1. Package marking provides orientation and
identification.
2. See “Electrical Specifications” for
appropriate package marking.
HMPS-282x Series Absolute Maximum Ratings
[1]
,
T
C
= 25°C
Symbol
I
f
P
IV
T
j
T
stg
θ
jc
Parameter
Forward Current (1
µs
pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
[2]
Units
A
V
°C
°C
°C/W
MiniPak 1412
1
15
150
-65 to +150
150
ESD WARNING:
Handling Precautions Should Be Taken To
Avoid Static Discharge.
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the
device.
2. T
C
= +25°C, where T
C
is defined to be the temperature at the package pins where contact is
made to the circuit board.
Electrical Specifications,
T
C
= +25°C, Single Diode
[4]
Minimum
Breakdown
Voltage
V
BR
(V)
15
Maximum
Forward
Voltage
V
F
(mV)
340
Maximum
Forward
Voltage
V
F
(V) @
I
F
(mA)
0.5
10
Maximum
Reverse
Leakage
I
R
(nA) @
V
R
(V)
100
1
Typical
Dynamic
Resistance
R
D
(Ω)
[4]
12
Part
Number
HMPS-
2820
2822
2825
Package
Marking
Code
L
K
J
Lead
Code
0
2
5
Configuration
Single
Anti-parallel
Parallel
Maximum
Capacitance
C
T
(pF)
1.0
Test Conditions
I
R
= 100
µA
I
F
= 1 mA
[1]
V
F
= 0 V
f = 1 MHz
[2]
I
F
= 5 mA
Notes:
1.
∆V
F
for diodes in pairs is 15 mV maximum at 1 mA.
2.
∆C
TO
for diodes in pairs is 0.2 pF maximum.
3. Effective carrier lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. R
D
= R
S
+ 5.2Ω at 25°C and I
f
= 5 mA.
2
Linear Equivalent Circuit Model Diode Chip
R
j
R
S
SPICE Parameters
Parameter
B
V
C
J0
E
G
I
BV
Units
V
pF
eV
A
A
Ω
V
HMPS-282x
15
0.7
0.60
1E-4
2.2E-8
1.08
8.0
0.65
2
0.5
C
j
I
S
N
R
S
= series resistance (see Table of SPICE parameters)
C
j
= junction capacitance (see Table of SPICE parameters)
8.33 X 10
-5
nT
R
j
=
I
b
+ I
s
where
I
b
= externally applied bias current in amps
I
s
= saturation current (see table of SPICE parameters)
T = temperature,
°K
n = ideality factor (see table of SPICE parameters)
R
S
P
B
P
T
M
Linear Circuit Model of the Diode’s Package
20 fF
3
30 fF
1.1 nH
2
1
4
30 fF
20 fF
Single diode package (HMPx-x8x0)
20 fF
0.05 nH
3
30 fF
0.05 nH
2
12 fF
0.5 nH
0.5 nH
30 fF
0.05 nH
1
0.5 nH
0.5 nH
0.05 nH
4
20 fF
Anti-parallel diode package (HMPx-x8x2)
20 fF
0.05 nH
3
30 fF
0.05 nH
2
12 fF
0.5 nH
0.5 nH
30 fF
0.05 nH
1
0.5 nH
0.5 nH
0.05 nH
4
20 fF
Parallel diode package (HMPx-x8x5)
3
HMPS-282x Series Typical Performance
T
c
= 25°C (unless otherwise noted), Single Diode
100
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
100,000
1
I
F
– FORWARD CURRENT (mA)
10,000
0.8
I
R
– REVERSE CURRENT (nA)
C
T
– CAPACITANCE (pF)
T
A
= +125°C
T
A
= +75°C
T
A
= +25°C
0
5
10
15
10
1000
0.6
1
100
0.4
0.1
10
1
0.2
0
0
2
4
6
8
V
R
– REVERSE VOLTAGE (V)
0.01
0
0.10
0.20
0.30
0.40
0.50
V
F
– FORWARD VOLTAGE (V)
V
R
– REVERSE VOLTAGE (V)
Figure 1. Forward Current vs. Forward
Voltage at Temperatures.
Figure 2. Reverse Current vs. Reverse Voltage
at Temperatures.
Figure 3. Total Capacitance vs. Reverse
Voltage.
1000
30
30
100
1.0
∆V
F
- FORWARD VOLTAGE DIFFERENCE (mV)
10
I
F
(Left Scale)
10
100
I
F
(Left Scale)
10
10
1
∆V
F
(Right Scale)
1
∆V
F
(Right Scale)
1
0.1
1
10
100
0.3
0.2
0.4
0.6
0.8
1.0
1.2
V
F
- FORWARD VOLTAGE (V)
0.3
1.4
1
0.10
0.15
0.20
0.1
0.25
I
F
– FORWARD CURRENT (mA)
V
F
- FORWARD VOLTAGE (V)
Figure 4. Dynamic Resistance vs. Forward
Current.
Figure 5. Typical V
f
Match, Series Pairs and
Quads at Mixer Bias Levels.
Figure 6. Typical V
f
Match, Series Pairs at
Detector Bias Levels.
1
10
10
1
V
O
– OUTPUT VOLTAGE (V)
V
O
– OUTPUT VOLTAGE (V)
0.1
-25°C
+25°C
+75°C
0.1
0.01
+25°C
CONVERSION LOSS (dB)
DC bias = 3
µA
9
8
0.01
RF in
18 nH
3.3 nH
HSMS-282B
Vo
0.001
RF in
68
Ω
HSMS-282B
Vo
100 pF
0.001
-40
100 KΩ
0
0.0001
1E-005
-20
100 pF
7
4.7 KΩ
20
30
6
0
2
4
6
8
10
12
LOCAL OSCILLATOR POWER (dBm)
-30
-20
-10
-10
0
10
P
in
– INPUT POWER (dBm)
P
in
– INPUT POWER (dBm)
Figure 7. Typical Output Voltage vs. Input
Power, Small Signal Detector Operating at
850 MHz.
Figure 8. Typical Output Voltage vs. Input
Power, Large Signal Detector Operating at
915 MHz.
Figure 9. Typical Conversion Loss vs. L.O.
Drive, 2.0 GHz (Ref AN997).
4
∆V
F
- FORWARD VOLTAGE DIFFERENCE (mV)
R
D
– DYNAMIC RESISTANCE (Ω)
I
F
- FORWARD CURRENT (mA)
I
F
- FORWARD CURRENT (µA)
Assembly Information
The MiniPak diode is mounted to
the PCB or microstrip board using
the pad pattern shown in
Figure 10.
0.4
0.5
0.4
0.3
0.5
0.3
Figure 10. PCB Pad Layout, MiniPak
(dimensions in mm).
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the MiniPak
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s diodes have been quali-
fied to the time-temperature
profile shown in Figure 12. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
350
300
250
221
200
150
100
50
0
0
30
60
90
120
150
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 255°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum temperatures
and times necessary to achieve a
uniform reflow of solder.
This mounting pad pattern is
satisfactory for most applications.
However, there are applications
where a high degree of isolation is
required between one diode and
the other is required. For such
applications, the mounting pad
pattern of Figure 11 is
recommended.
0.40 mm via hole
(4 places)
0.20
0.8
2.40
Peak Temperature
Min. 240°C
Max. 255°C
TEMPERATURE (°C)
0.40
2.60
Reflow Time
Min. 60 s
Max. 90 s
Preheat 130 – 170°C
Min. 60 s
Max. 150 s
Figure 11. PCB Pad Layout, High Isolation
MiniPak (dimensions in mm).
This pattern uses four via holes,
connecting the crossed ground
strip pattern to the ground plane
of the board.
180
210
240
270
300
330
360
TIME (seconds)
Figure 12. Surface Mount Assembly Temperature Profile.
5
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