CY7C1021CV33 Automotive
1-Mbit (64 K × 16) Static RAM
1-Mbit (64 K × 16) Static RAM
Features
■
Functional Description
The CY7C1021CV33 is a high performance CMOS static RAM
organized as 65,536 words by 16 bits. This device has an
automatic power down feature that significantly reduces power
consumption when deselected.
Writing to the device is accomplished by taking Chip Enable (CE)
and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is
LOW, then data from I/O pins (I/O
1
through I/O
8
)
[1]
, is written into
the location specified on the address pins (A
0
through A
15
). If
Byte High Enable (BHE) is LOW, then data from I/O pins (I/O
9
through I/O
16
)
[1]
is written into the location specified on the
address pins (A
0
through A
15
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins appear
on I/O
1
to I/O
8 [1]
. If Byte High Enable (BHE) is LOW, then data
from memory appears on I/O
9
to I/O
16 [1]
. For more information,
see the
Truth Table on page 11
for a complete description of
Read and Write modes.
The input and output pins (I/O
1
through I/O
16
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW
and WE LOW).
For a complete list of related documentation,
click here.
Temperature ranges
❐
Automotive-A: –40 °C to 85 °C
❐
Automotive-E: –40 °C to 125 °C
Pin and function compatible with CY7C1021CV33
High speed
❐
t
AA
= 10 ns (Automotive-A)
❐
t
AA
= 12 ns (Automotive-E)
CMOS for optimum speed and power
Low active power: 325 mW (max)
Automatic power down when deselected
Independent control of upper and lower bits
Available in Pb-free and non Pb-free 44-pin 400 Mil SOJ, 44-pin
TSOP II, and 48-ball FBGA packages
■
■
■
■
■
■
■
Logic Block Diagram
DATA IN DRIVERS
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
ROW DECODER
64K x 16
RAM Array
SENSE AMPS
I/O
0
–I/O
7
[1]
I/O
8
–I/O
15
[1]
COLUMN DECODER
BHE
WE
CE
OE
BLE
Note
1. I/O
1
–I/O
16
for SOJ/TSOP and I/O
0
–I/O
15
for BGA packages.
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
Cypress Semiconductor Corporation
Document Number: 38-05132 Rev. *Q
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised December 2, 2014
CY7C1021CV33 Automotive
Contents
Selection Guide ................................................................ 3
Pin Configuration ............................................................. 3
Pin Definitions .................................................................. 4
Maximum Ratings ............................................................. 5
Operating Range ............................................................... 5
Electrical Characteristics ................................................. 5
Capacitance ...................................................................... 6
Thermal Resistance .......................................................... 6
AC Test Loads and Waveforms ....................................... 6
Switching Characteristics ................................................ 7
Switching Waveforms ...................................................... 8
Truth Table ...................................................................... 11
Ordering Information ...................................................... 12
Ordering Code Definitions ......................................... 12
Package Diagrams .......................................................... 13
Acronyms ........................................................................ 16
Document Conventions ................................................. 16
Units of Measure ....................................................... 16
Document History Page ................................................. 17
Sales, Solutions, and Legal Information ...................... 19
Worldwide Sales and Design Support ....................... 19
Products .................................................................... 19
PSoC Solutions ......................................................... 19
Document Number: 38-05132 Rev. *Q
Page 2 of 19
CY7C1021CV33 Automotive
Selection Guide
Description
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Automotive-A
Automotive-E
Automotive-A
Automotive-E
-10
10
90
–
5
–
-12
12
–
90
–
10
Unit
ns
mA
mA
mA
mA
Pin Configuration
Figure 1. 44-pin SOJ/TSOP II pinout
[2]
Figure 2. 48-ball FBGA pinout
[2]
A
4
A
3
A
2
A
1
A
0
CE
I/O
1
I/O
2
I/O
3
I/O
4
V
CC
V
SS
I/O
5
I/O
6
I/O
7
I/O
8
WE
A
15
A
14
A
13
A
12
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
5
A
6
A
7
OE
BHE
BLE
I/O
16
I/O
15
I/O
14
I/O
13
V
SS
V
CC
I/O
12
I/O
11
I/O
10
I/O
9
NC
A
8
A
9
A
10
A
11
NC
1
BLE
I/O
8
I/O
9
2
OE
BHE
I/O
10
3
A
0
A
3
A
5
NC
NC
4
A
1
A
4
A
6
A
7
NC
A
15
A
13
A
10
5
A
2
CE
I/O
2
I/O
3
I/O
4
I/O
5
WE
A
11
6
NC
I/O
0
I/O
1
V
CC
V
SS
I/O
6
I/O
7
NC
A
B
C
D
E
F
G
H
V
SS
I/O
11
V
CC
I/O
12
I/O
14
I/O
13
A
14
I/O
15
NC
NC
A
8
A
12
A
9
Note
2. NC pins are not connected on the die.
Document Number: 38-05132 Rev. *Q
Page 3 of 19
CY7C1021CV33 Automotive
Pin Definitions
Pin Name
A
0
–A
15
SOJ, TSOP
Pin Number
1–5, 18–21,
24–27, 42–44
BGA Pin
Number
A3, A4, A5,
B3, B4, C3,
C4, D4, H2,
H3, H4, H5,
G3, G4, F3,
F4
B6, C6, C5,
D5, E5, F5,
F6, G6, B1,
C1, C2, D2,
E2, F2, F1,
G1
A6, D3, E3,
E4, G2, H1,
H6
G5
B5
B2, A1
A2
I/O Type
Input
Description
Address Inputs.
Used to select one of the address locations.
I/O
1
–I/O
16 [3]
7–10, 13–16,
29–32, 35–38
Input or
Output
Bidirectional Data I/O lines.
Used as input or output lines depending
on operation.
NC
22, 23, 28
No Connect
No Connects.
Not connected to the die.
WE
CE
BHE, BLE
OE
17
6
40, 39
41
Input or
Control
Input or
Control
Input or
Control
Input or
Control
Ground
Write Enable Input, Active LOW.
When selected LOW, a write is
conducted. When deselected HIGH, a read is conducted.
Chip Enable Input, Active LOW.
When LOW, selects the chip. When
HIGH, deselects the chip.
Byte Write Select Inputs, Active LOW.
BHE controls I/O
16
–I/O
9 [3]
,
BLE controls I/O
8
–I/O
1 [3]
.
Output Enable, Active LOW.
Controls the direction of the I/O pins.
When LOW, the I/O pins are allowed to behave as outputs. When
deasserted HIGH, the I/O pins are tristated and act as input data pins.
Ground for the Device.
Connected to ground of the system.
V
SS
V
CC
12, 34
11, 33
D1, E6
D6, E1
Power Supply
Power Supply Inputs to the Device.
Note
3. I/O
1
–I/O
16
for SOJ/TSOP and I/O
0
–I/O
15
for BGA packages.
Document Number: 38-05132 Rev. *Q
Page 4 of 19
CY7C1021CV33 Automotive
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ............................... –65
C
to +150
C
Ambient Temperature with
Power Applied ......................................... –55
C
to +125
C
Supply Voltage on
V
CC
Relative to GND
[4]
...............................–0.5 V to +4.6 V
DC Voltage Applied to Outputs
in High Z State
[4]
................................ –0.5 V to V
CC
+ 0.5 V
DC Input Voltage
[4]
............................ –0.5 V to V
CC
+ 0.5 V
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage
(MIL-STD-883, Method 3015) ................................. > 2001 V
Latch Up Current ................................................... > 200 mA
Operating Range
Range
Automotive-A
Automotive-E
Ambient Temperature (T
A
)
–40
C
to +85
C
–40
C
to +125
C
V
CC
3.3 V
10%
Electrical Characteristics
Over the Operating Range
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I/O
Z
I
CC
I
SB1
Description
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW
Voltage
[4]
GND < V
I
< V
CC
Automotive-A
Automotive-E
Output Leakage Current GND < V
I
< V
CC
,
Output disabled
V
CC
Operating Supply
Current
Automatic CE Power
Down Current —TTL
Inputs
V
CC
= Max,
I
OUT
= 0 mA,
f = f
MAX
= 1/t
RC
Automotive-A
Automotive-E
Automotive-A
Automotive-E
Input Leakage Current
Test Conditions
V
CC
= Min, I
OH
= –4.0 mA
V
CC
= Min, I
OL
= 8.0 mA
-10
Min
2.4
–
2.0
–0.3
–1
–
–1
–
–
–
–
–
–
–
Max
–
0.4
V
CC
+ 0.3
0.8
+1
–
+1
–
90
–
15
–
5
–
Min
2.4
–
2.0
–0.3
–
–12
–
–12
–
–
–
–
–
–
-12
Max
–
0.4
V
CC
+ 0.3
0.8
–
+12
–
+12
–
90
–
20
–
10
mA
mA
mA
A
Unit
V
V
V
V
A
Max V
CC
,
Automotive-A
CE > V
IH
Automotive-E
V
IN
> V
IH
or
V
IN
< V
IL
, f = f
MAX
I
SB2
Automatic CE Power
Max V
CC
,
Automotive-A
Down Current — CMOS CE > V
CC
– 0.3 V, Automotive-E
V
IN
> V
CC
– 0.3 V,
Inputs
or V
IN
< 0.3 V, f = 0
Note
4. V
IL
(min) = –2.0 V and V
IH
(max) = V
CC
+ 0.5 V for pulse durations of less than 20 ns.
Document Number: 38-05132 Rev. *Q
Page 5 of 19
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