I/O Controller Interface IC
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | Maxim(美信半导体) |
| 产品种类 Product Category | I/O Controller Interface IC |
| 产品 Product | Smart Card Interfaces |
| 最小工作温度 Minimum Operating Temperature | - 40 C |
| 最大工作温度 Maximum Operating Temperature | + 85 C |
| 73S8023C-IM-F1 | 73S8023C-IM-F2 | 73S8023C-IMR | 73S8023C-IMR/F1 | 73S8023C-IMR-F1 | 73S8023C-IM/F2 | 73S8023C-IM/F1 | 73S8023C-IMR/F2 | 73S8023C-IM | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | I/O Controller Interface IC | I/O Controller Interface IC | Analog Circuit, 1 Func, 5 X 5 MM, QFN-32 | Analog Circuit, 1 Func, 5 X 5 MM, LEAD FREE, QFN-32 | I/O Controller Interface IC | Analog Circuit, 1 Func, 5 X 5 MM, LEAD FREE, QFN-32 | Analog Circuit, 1 Func, 5 X 5 MM, LEAD FREE, QFN-32 | I/O Controller Interface IC | Analog Circuit, 1 Func, 5 X 5 MM, QFN-32 |
| 包装说明 | - | - | HVQCCN, | HVQCCN, | - | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
| Reach Compliance Code | - | - | compliant | unknown | - | unknown | unknown | unknown | compliant |
| 模拟集成电路 - 其他类型 | - | - | ANALOG CIRCUIT | ANALOG CIRCUIT | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | - | - | S-XQCC-N32 | S-XQCC-N32 | - | S-XQCC-N32 | S-XQCC-N32 | S-XQCC-N32 | S-XQCC-N32 |
| 长度 | - | - | 5 mm | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm |
| 功能数量 | - | - | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | 32 | 32 | - | 32 | 32 | 32 | 32 |
| 最高工作温度 | - | - | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | - | HVQCCN | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | - | - | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | - | - | 0.9 mm | 0.9 mm | - | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm |
| 最大供电电压 (Vsup) | - | - | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | - | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | - | - | YES | YES | - | YES | YES | YES | YES |
| 温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | - | - | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | - | - | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | - | QUAD | QUAD | - | QUAD | QUAD | QUAD | QUAD |
| 宽度 | - | - | 5 mm | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm |
| Base Number Matches | - | - | 1 | 1 | - | 1 | 1 | 1 | 1 |
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