DATASHEET
ISL6208, ISL6208B
High Voltage Synchronous Rectified Buck MOSFET Drivers
The ISL6208 and ISL6208B are high frequency, dual MOSFET
drivers, optimized to drive two N-Channel power MOSFETs in a
synchronous-rectified buck converter topology. They are
especially suited for mobile computing applications that
require high efficiency and excellent thermal performance.
These drivers, combined with an Intersil multiphase Buck
PWM controller, form a complete single-stage core-voltage
regulator solution for advanced mobile microprocessors.
ISL6208 and ISL6208B have the same function but different
packages. The descriptions in this datasheet are based on
ISL6208 and also apply to ISL6208B.
The ISL6208 features 4A typical sinking current for the lower
gate driver. This current is capable of holding the lower
MOSFET gate off during the rising edge of the Phase node. This
prevents shoot-through power loss caused by the high dv/dt of
phase voltages. The operating voltage matches the 30V
breakdown voltage of the MOSFETs commonly used in mobile
computer power supplies.
The ISL6208 also features a three-state PWM input that,
working together with Intersil’s multiphase PWM controllers,
will prevent negative voltage output during CPU shutdown. This
feature eliminates a protective Schottky diode usually seen in
a microprocessor power systems.
MOSFET gates can be efficiently switched up to 2MHz using
the ISL6208. Each driver is capable of driving a 3000pF load
with propagation delays of 8ns and transition times under
10ns. Bootstrapping is implemented with an internal Schottky
diode. This reduces system cost and complexity, while allowing
the use of higher performance MOSFETs. Adaptive
shoot-through protection is integrated to prevent both
MOSFETs from conducting simultaneously.
A diode emulation feature is integrated in the ISL6208 to
enhance converter efficiency at light load conditions. This
feature also allows for monotonic start-up into pre-biased
outputs. When diode emulation is enabled, the driver will allow
discontinuous conduction mode by detecting when the
inductor current reaches zero and subsequently turning off the
low side MOSFET gate.
FN9115
Rev 7.00
July 14, 2014
Features
• Dual MOSFET drives for synchronous rectified bridge
• Adaptive shoot-through protection
• 0.5 On-resistance and 4A sink current capability
• Supports high switching frequency up to 2MHz
- Fast output rise and fall time
- Low propagation delay
• Three-state PWM input for power stage shutdown
• Internal bootstrap schottky diode
• Low bias supply current (5V, 80µA)
• Diode emulation for enhanced light load efficiency and pre-
biased start-up applications
• VCC POR (power-on-reset) feature integrated
• Low three-state shutdown holdoff time (typical 160ns)
• Pin-to-pin compatible with ISL6207
• QFN and DFN package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad flat no leads - package outline
DFN - Dual flat no leads - package outline
- Near chip scale package footprint, which improves PCB
efficiency and has a thinner profile
• Pb-free (RoHS compliant)
Applications
• Core voltage supplies for Intel® and AMD® mobile
microprocessors
• High frequency low profile DC/DC converters
• High current low output voltage DC/DC converters
• High input voltage DC/DC converters
Related Literature
• Technical Brief
TB363
“Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief
TB389
“PCB Land Pattern Design and
Surface Mount Guidelines for MLFP Packages”
• Technical Brief
TB447
“Guidelines for Preventing
Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs”
FN9115 Rev 7.00
July 14, 2014
Page 1 of 13
ISL6208, ISL6208B
Ordering Information
PART NUMBER
(Notes
3, 4)
ISL6208CBZ (Note
1)
ISL6208CRZ (Note
1)
ISL6208BCRZ-T (Note
2)
ISL6208IBZ (Note
1)
ISL6208IRZ (Note
1)
ISL6208BIRZ-T (Note
2)
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to
TB347
for details on reel specifications.
2. Please refer to
TB347
for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see device information page for
ISL6208, ISL6208B.
For more information on MSL please see techbrief
TB363.
PART
MARKING
ISL62 08CBZ
208Z
8BC
ISL62 08IBZ
8IRZ
8BI
TEMP. RANGE
(°C)
-10 to +100
-10 to +100
-10 to +100
-40 to +100
-40 to +100
-40 to +100
8 Ld SOIC
8 Ld 3x3 QFN
8 Ld 2x2 DFN
8 Ld SOIC
8 Ld 3x3 QFN
8 Ld 2x2 DFN
PACKAGE
(Pb-free)
PKG.
DWG. #
M8.15
L8.3x3
L8.2x2D
M8.15
L8.3x3
L8.2x2D
Pin Configurations
ISL6208CBZ, ISL6208IBZ
(8 LD SOIC)
TOP VIEW
UGATE
BOOT
PWM
GND
1
2
3
4
8
7
6
5
PHASE
FCCM
VCC
LGATE
BOOT 1
PWM 2
3
GND
4
LGATE
6
6 FCCM
5 VCC
ISL6208CRZ, ISL6208IRZ
(8 LD 3x3 QFN)
TOP VIEW
PHASE
UGATE
ISL6208BCRZ, ISL6208BIRZ
(8 LD 2x2 DFN)
TOP VIEW
UGATE 1
BOOT 2
PWM 3
GND 4
6
8 PHASE
7 FCCM
6
6 VCC
5 LGATE
8
7
Block Diagram
VCC
FCCM
SHOOT-
THROUGH
PROTECTION
PWM
10k
CONTROL
LOGIC
VCC
LGATE
GND
BOOT
UGATE
PHASE
THERMAL PAD (FOR QFN AND DFN PACKAGE ONLY)
FIGURE 1. BLOCK DIAGRAM
ti
FN9115 Rev 7.00
July 14, 2014
Page 2 of 13
ISL6208, ISL6208B
Absolute Maximum Ratings
ti
Thermal Information
Thermal Resistance (Typical)
JA
(°C/W)
JC
(°C/W)
8 Ld SOIC Package (Notes
6, 9)
. . . . . . . . .
110
67
8 Ld 3x3 QFN Package (Notes
7, 8)
. . . . . .
80
15
8 Ld 2x2 DFN Package (Notes
7, 8)
. . . . . .
89
24
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see
TB493
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
FCCM
, V
PWM
) . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V
BOOT-GND
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT To PHASE Voltage (V
BOOT-PHASE
). . . . . . . . . . . . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage (Note
5)
. . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
GND - 10V (<20ns Pulse Width, 10µJ)
UGATE Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . V
PHASE
- 0.3V (DC) to V
BOOT
V
PHASE
- 5V (<20ns Pulse Width, 10µJ) to V
BOOT
LGATE Voltage . . . . . . . . . . . . . . . . . . . . . . . . .GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-10°C to +100°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
6.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379
for details.
7.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief
TB379.
8. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
9. For
JC
, the “case temp” location is taken at the package top center.
Electrical Specifications
temperature range.
PARAMETER
V
CC
SUPPLY CURRENT
Bias Supply Current
POR
V
CC
Rising
V
CC
Falling
Hysteresis
BOOTSTRAP DIODE
Forward Voltage
PWM INPUT
Input Current
Recommended Operating Conditions, Unless Otherwise Noted. Boldface limits apply across the operating
MIN
(Note
11)
MAX
(Note
11)
UNITS
SYMBOL
TEST CONDITIONS
TYP
I
VCC
PWM pin floating, V
FCCM
= 5V
-
80
-
µA
-
2.40
-
3.40
2.90
500
3.90
-
-
V
V
mV
V
F
V
VCC
= 5V, forward bias current = 2mA
0.50
0.55
0.65
V
I
PWM
V
PWM
= 5V
V
PWM
= 0V
-
-
0.70
3.5
100
250
-250
1.00
3.8
175
-
-
1.30
4.1
250
µA
µA
V
V
ns
PWM Three-State Rising Threshold
PWM Three-State Falling Threshold
Three-State Shutdown Hold-off Time
FCCM INPUT
FCCM LOW Threshold
FCCM HIGH Threshold
SWITCHING TIME
UGATE Rise Time (Note
10)
LGATE Rise Time (Note
10)
UGATE Fall Time (Note 10)
t
RU
t
RL
t
FU
t
TSSHD
V
VCC
= 5V
V
VCC
= 5V
V
VCC
= 5V, temperature = +25°C
0.50
-
-
-
-
2.0
V
V
V
VCC
= 5V, 3nF load
V
VCC
= 5V, 3nF load
V
VCC
= 5V, 3nF load
-
-
-
8.0
8.0
8.0
-
-
-
ns
ns
ns
FN9115 Rev 7.00
July 14, 2014
Page 3 of 13
ISL6208, ISL6208B
Electrical Specifications
temperature range.
PARAMETER
LGATE Fall Time (Note 10)
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
UGATE Turn-On Propagation Delay
LGATE Turn-On Propagation Delay
UG/LG Three-State Propagation Delay
Minimum LG ON-TIME in DCM (Note
10)
OUTPUT
Upper Drive Source Resistance
Upper Driver Source Current (Note
10)
Upper Drive Sink Resistance
Upper Driver Sink Current (Note
10)
Lower Drive Source Resistance
Lower Driver Source Current (Note
10)
Lower Drive Sink Resistance
Lower Driver Sink Current (Note
10)
NOTES:
Recommended Operating Conditions, Unless Otherwise Noted. Boldface limits apply across the operating
MIN
(Note
11)
-
-
-
10
10
-
-
MAX
(Note
11)
UNITS
-
-
-
30
30
-
-
ns
ns
ns
ns
ns
ns
ns
SYMBOL
t
FL
t
PDLU
t
PDLL
t
PDHU
t
PDHL
t
PTS
t
LGMIN
TEST CONDITIONS
V
VCC
= 5V, 3nF load
V
VCC
= 5V, outputs unloaded
V
VCC
= 5V, outputs unloaded
V
VCC
= 5V, outputs unloaded
V
VCC
= 5V, outputs unloaded
V
VCC
= 5V, outputs unloaded
TYP
4.0
18
25
20
20
35
400
R
U
I
U
R
U
I
U
R
L
I
L
R
L
I
L
500mA source current
V
UGATE-PHASE
= 2.5V
500mA sink current
V
UGATE-PHASE
= 2.5V
500mA source current
V
LGATE
= 2.5V
500mA sink current
V
LGATE
= 2.5V
-
-
-
-
-
-
-
-
1
2.00
1
2.00
1
2.00
0.5
4.00
2.5
-
2.5
-
2.5
-
1.0
-
A
A
A
A
10. Limits established by characterization and are not production tested.
11. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
FN9115 Rev 7.00
July 14, 2014
Page 4 of 13
ISL6208, ISL6208B
Typical Application with 2-Phase Converter
+5V
+5V
+5V
VCC
FB
VCC
VSEN
PGOOD
PWM1
PWM2
FCCM
MAIN
CONTROL
VID
ISEN1
ISEN2
+5V
VCC
BOOT
FS
DACOUT
GND
FCCM
UGATE
DRIVE
ISL6208
PHASE
V
BAT
COMP
FCCM
PWM
DRIVE
ISL6208
THERMAL
PAD
BOOT
UGATE
PHASE
LGATE
V
BAT
+V
CORE
PWM
THERMAL LGATE
PAD
FN9115 Rev 7.00
July 14, 2014
Page 5 of 13
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
