CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For
θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature
range of the device as follows:
T
A
= -40°C to +85°C; V
IN
= (V
O
+ 1.0V) to 6.5V with a minimum V
IN
of 2.3V; C
IN
= 1µF; C
O
= 1µF;
C
BYP
= 0.01µF.
SYMBOL
TEST CONDITIONS
MIN
MAX
(Note 7) TYP (Note 7)
UNITS
PARAMETER
DC CHARACTERISTICS
Supply Voltage
Ground Current
V
IN
Quiescent condition: I
O1
= 0µA; I
O2
= 0µA
I
DD1
I
DD2
One LDO active
Both LDO active
@ +25°C
2.3
6.5
V
25
45
0.1
1.9
1.6
2.1
1.8
40
60
1.0
2.3
2.0
+1.8
µA
µA
µA
V
V
%
%/V
%
%
mA
mA
Shutdown Current
UVLO Threshold
I
DDS
V
UV+
V
UV-
Regulation Voltage Accuracy
Line Regulation
Load Regulation
Variation from nominal voltage output, V
IN
= V
O
+0.5V to 5.5V,
T
J
= -40°C to +125°C
V
IN
= (V
OUT
+ 1.0V relative to highest output voltage) to 5.5V
I
OUT
= 100µA to 150mA
I
OUT
= 100µA to 300mA
-1.8
-0.2
0
0.1
0.2
0.7
1.0
Maximum Output Current
I
MAX
VO1: Continuous
VO2: Continuous
300
300
350
475
125
300
250
200
145
110
600
200
500
400
325
Internal Current Limit
Dropout Voltage (Note 6)
I
LIM
V
DO1
V
DO2
V
DO3
V
DO4
I
O
= 150mA; V
O
>
2.1V
I
O
= 300mA; V
O
< 2.5V
I
O
= 300mA; 2.5V
≤
V
O
≤
2.8V
I
O
= 300mA; V
O
> 2.8V
mA
mV
mV
mV
mV
°C
°C
Thermal Shutdown Temperature
T
SD+
T
SD-
AC CHARACTERISTICS
Ripple Rejection
I
O
= 10mA, V
IN
= 2.8V(min), V
O
= 1.8V, C
BYP
= 0.1µF
@ 1kHz
@ 10kHz
@ 100kHz
70
55
40
dB
dB
dB
3
FN9245.3
March 11, 2008
ISL9014
Electrical Specifications
Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature
range of the device as follows:
T
A
= -40°C to +85°C; V
IN
= (V
O
+ 1.0V) to 6.5V with a minimum V
IN
of 2.3V; C
IN
= 1µF; C
O
= 1µF;
C
BYP
= 0.01µF.
(Continued)
SYMBOL
TEST CONDITIONS
I
O
= 100µA, V
O
= 1.5V, T
A
= +25°C, C
BYP
= 0.1µF
BW = 10Hz to 100kHz
MIN
MAX
(Note 7) TYP (Note 7)
30
UNITS
µV
RMS
PARAMETER
Output Noise Voltage
DEVICE START-UP CHARACTERISTICS
Device Enable Time
LDO Soft-Start Ramp Rate
EN1, EN2 PIN CHARACTERISTICS
Input Low Voltage
Input High Voltage
Input Leakage Current
Pin Capacitance
NOTES:
6. VOx = 0.98*VOx(NOM); Valid for VOx greater than 1.85V.
7. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.
V
IL
V
IH
I
IL
, I
IH
C
PIN
Informative
5
-0.3
1.4
0.5
V
IN
+ 0.3
0.1
V
V
µA
pF
t
EN
t
SSR
Time from assertion of the ENx pin to when the output voltage
reaches 95% of the VO(nom)
Slope of linear portion of LDO output voltage ramp during
主题：自备终端(BYOD)发展趋势;用员工自己的移动设备来控制对工作设施及设备的使用，会对信息安全产生怎样的影响;在不使公司有安全风险或不损害员工隐私的前提下，有哪些方式能安全地实现这样的设施及设备使用。 自备终端(Bring Your Own Device，简称BYOD)，即企业允许员工离职时保留自己的手机，这种做法正日益流行。如今智能手机功能也越来越多，我们不仅能用自己的手机访问电脑、网...[详细]
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