mature 1-micron MESFET process, this parts is ideal
for modules or other packaging for use in the
Cellular, GPS, LAN and infrastructure markets.
Demonstrating performance up to 20 GHz, the
MASW20000 will perform well in many types of
applications within that range.
GND
GND
A1
B2
B1
A2
Bond Pad Dimensions
Bond Pad
RF, RF1, RF2
Dimension Inches (mm)
0.004 x 0.004 (0.100 x 0.100)
0.004 x 0.004 (0.100 x 0.100)
0.083 x 0.035 x 0.004
(2.10 x 0.89 x 0.10)
Ordering Information
1
Part Number
MASW20000
1. Die quantity varies.
A1, A2, B1, B2
Package
Die
DIE Size
Schematic
Absolute Maximum Ratings
2
Parameter
Control Voltage
(A1/B2 or A2/B1)
Input RF Power
Operating Temperature
Storage Temperature
Absolute Maximum
-8.5 VDC
+34 dBm
+175°C
-65°C to +175°C
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW20000
GaAs SPDT Switch
DC - 20 GHz
Electrical Specifications
3
: T
A
= 25°C, Z
0
= 50, +25°C
4
Parameter
Insertion Loss
Test Conditions
10 GHz
18 GHz
20 GHz
10 GHz
18 GHz
20 GHz
10 GHz
18 GHz
20 GHz
10% to 90% RF and 90% to 10% RF
50% control to 90% RF, and 50% control to 10% RF
In-Band
0.5 - 20 GHz, 0 to -5 V
0.05 GHz, 0 to -5 V
Two Tone, +5 dBm/Tone, 5 MHz Spacing, >50 MHz
0.5 - 20 GHz
Two Tone, +5 dBm/Tone, 5 MHz Spacing, >50 MHz
0.5 - 20 GHz
0.05 GHz
V
IN
Low, 0 to -0.2 V
V
IN
High, -5 V
Units
dB
dB
dB
dB
dB
dB
Ratio
Ratio
Ratio
ns
ns
mV
dBm
dBm
dBm
dBm
dBm
µA
µA
Min.
—
—
—
50
42
40
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
1.4
1.75
2.0
59
49
47
—
—
—
2
3
20
25
18
+59
+43
+27
—
—
Max.
1.7
2.1
2.5
—
—
—
1.6:1
1.8:1
2.0:1
—
—
—
—
—
—
—
—
5
50
Rev. V5
Isolation
VSWR
Trise, Tfall
Ton, Toff
Transients
Input P1dB
IP2
IIP3
Control Voltage
(Complementary Logic)
3. All specifications apply with 50 Ω impedance connected to all RF ports, 0 and –5 VDC control voltages.
4. Loss changes 0.0025 dB/°C (From –55°C to +85°C).
Truth Table
5,6
Control Inputs
A1/B2
V
IN
Hi
V
IN
Low
A2/B1
V
IN
Low
V
IN
Hi
Condition of Switch
RF1
On
Off
RF2
Off
On
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
5. V
IN
Low = 0 to –0.2 V, V
IN
Hi = -5V
6. For normal SPDT operation A1 is connected to B2 and A2 is
connected to B1.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW20000
GaAs SPDT Switch
DC - 20 GHz
Typical Performance Curves
Insertion Loss
2.5
Rev. V5
Isolation
80
2.0
65
1.5
50
1.0
35
0.5
0
2
4
6
8
10
12
14
16
18
20
20
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
Frequency (GHz)
VSWR
2.00
1.75
Input
Output
1.50
1.25
1.00
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW20000
GaAs SPDT Switch
DC - 20 GHz
Handling Procedures
Permanent damage to the MASW20000 may occur if the
following precautions are not adhered to:
A.
B.
C.
Cleanliness - The MASW20000 should be handled in
a clean environment. DO NOT attempt to clean
assembly after the MASW20000 is installed.
Static Sensitivity - All die handling equipment and
personnel should be DC grounded.
Transients - Avoid instrument and power supply
transients while bias is connected to the
MASW20000. Use shielded signal and bias cables
to minimize inductive pick-up.
Bias - Apply voltage to either control port A1/B2 or
A2/B1 only when the other is grounded. Neither port
should be allowed to ―float‖.
General Handling - It is recommended that the
MASW20000 chip be handled along the long side of
the die with a sharp pair of bent tweezers. DO NOT
touch the surface of the chip with fingers or
tweezers.
Rev. V5
Wire Bonding
A.
Ball or wedge bond with 1.0 mil diameter pure gold
wire. Gold ribbon (3.0 mil x 0.5 mil) may also be
used. Thermo sonic wire bonding with a nominal
stage temperature of 150°C and a ball bonding force
of 40 to 50 grams or wedge bonding force of 18 to
22 grams is recommended. Ultrasonic energy and
time should be adjusted to the minimum levels to
achieve reliable wirebonds.
B.
Wirebonds should be started on the chip and termi-
nated on the package.
D.
E.
Mounting
The MASW20000 is back-metallized with Pd/Ni/Au
(100/1,000/30,000Å) metallization. It can be die-mounted
using Au/Sn eutectic preforms or a thermally conductive
epoxy. The package surface should be clean and flat
before attachment.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with a
work surface temperature of approximately 255°C
and a tool temperature of 265°C. When hot 90/10
nitrogen/hydrogen gas is applied, solder temperature
should be approximately 290°C.
B. DO NOT expose the MASW20000 to a temperature
greater than 320°C for more than 20 seconds. No
more than 3 seconds of scrubbing should be
required for attachment.
Epoxy Die Attach:
A. Apply a minimum amount of epoxy and place the
MASW20000 into position. A thin epoxy fillet should
be visible around the perimeter of the die.
B. Cure epoxy per manufacturer’s recommended
schedule.
C. Electrically conductive epoxy is recommended but is
not required.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW20000
GaAs SPDT Switch
DC - 20 GHz
Rev. V5
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[详细]
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