Buffers & Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP14,.25 |
| 针数 | 14 |
| Reach Compliance Code | compliant |
| 控制类型 | ENABLE LOW |
| 系列 | LVT |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.064 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP14,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 4 ns |
| 传播延迟（tpd） | 4.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| 74LVTH125PW | 74LVTH125DB-T | 74LVTH125DB | 74LVTH125D-T | 74LVTH125D | 74LVTH125BQ-G | 74LVT125DB | 74LVTH125PW-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Buffers & Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S | Buffers u0026 Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S | Buffers u0026 Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S | Buffers u0026 Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S | Buffers u0026 Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S | Buffers u0026 Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S | Buffers & Line Drivers 3.3V QUAD BUFFER | Buffers & Line Drivers 3.3V BUF/LDRVR ACTIVE LOW 3S |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | TSSOP, TSSOP14,.25 | - | SSOP, SSOP14,.3 | - | 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 | - | SSOP, SSOP14,.3 | TSSOP, |
| Reach Compliance Code | compliant | - | compliant | - | unknown | - | unknown | unknown |
| 系列 | LVT | - | LVT | - | LVT | - | LVT | LVT |
| JESD-30 代码 | R-PDSO-G14 | - | R-PDSO-G14 | - | R-PDSO-G14 | - | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 5 mm | - | 6.2 mm | - | 8.65 mm | - | 6.2 mm | 5 mm |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | - | 1 | - | 1 | - | 1 | 1 |
| 功能数量 | 4 | - | 4 | - | 4 | - | 4 | 4 |
| 端口数量 | 2 | - | 2 | - | 2 | - | 2 | 2 |
| 端子数量 | 14 | - | 14 | - | 14 | - | 14 | 14 |
| 最高工作温度 | 85 °C | - | 85 °C | - | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | TRUE | - | TRUE | - | TRUE | - | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | SSOP | - | SOP | - | SSOP | TSSOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 4.9 ns | - | 4.9 ns | - | 4.9 ns | - | 4.9 ns | 4.9 ns |
| 座面最大高度 | 1.1 mm | - | 2 mm | - | 1.75 mm | - | 2 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | - | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | - | 2.7 V | - | 2.7 V | - | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | - | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | - | YES | - | YES | YES |
| 技术 | BICMOS | - | BICMOS | - | BICMOS | - | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | - | GULL WING | - | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | - | 0.65 mm | - | 1.27 mm | - | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL | - | DUAL | DUAL |
| 宽度 | 4.4 mm | - | 5.3 mm | - | 3.9 mm | - | 5.3 mm | 4.4 mm |
| Base Number Matches | 1 | - | 1 | - | 1 | - | 1 | 1 |
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