®
TN4035-600G
40A SCRs
MAIN FEATURES:
Symbol
I
T(RMS)
V
DRM
/V
RRM
I
GT
Value
40
600
35
Unit
A
V
mA
G
A
K
A
DESCRIPTION
The TN4035-600G is designed for applications
where in-rush current conditions are critical, such
as overvoltage crowbar protection circuits in
power supplies.
Using clip assembly technology, provides higher
fusing threshold than wires.
Mounting precautions detailled in application note
AN533 on www.st.com.
K A
G
D
2
PAK
ABSOLUTE RATINGS
(limiting values)
Symbol
I
T(RMS)
IT
(AV)
I
TSM
Parameter
RMS on-state current (180° conduction angle)
Average on-state current (180° conduction angle)
Non repetitive surge peak on-state
current
I
²
t Value for fusing
Critical rate of rise of on-state current
I
G
= 2 x I
GT
, tr
≤
100 ns
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
Maximum peak reverse gate voltage
F = 60 Hz
tp = 20 µs
tp = 8.3 ms
tp = 10 ms
Tj = 25°C
Tj = 125°C
Tj = 125°C
Tj = 125°C
Tc = 95°C
Tc = 95°C
Tj = 25°C
Value
40
25
480
460
1060
50
4
1
- 40 to + 150
- 40 to + 125
5
A
2
S
A/µs
A
W
°C
V
Unit
A
A
A
I
²
t
dI/dt
I
GM
P
G(AV)
T
stg
Tj
V
RGM
April 2004 - Ed: 3
1/5
TN4035-600G
ELECTRICAL CHARACTERISTICS
(Tj = 25°C, unless otherwise specified)
Symbol
I
GT
V
D
= 12 V
V
GT
V
GD
I
H
I
L
dV/dt
V
TM
V
t0
R
d
I
DRM
I
RRM
V
D
= V
DRM
I
T
= 500 mA
I
G
= 1.2 I
GT
V
D
= 67 % V
DRM
I
TM
= 80 A
Gate open
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
tp = 380 µs
R
L
= 3.3 kΩ
Gate open
Tj = 125°C
R
L
= 33
Ω
Test Conditions
MIN.
MAX.
MAX.
MIN.
MAX.
MAX.
MIN.
MAX.
MAX.
MAX.
MAX.
Value
3.5
35
1.3
0.2
75
150
1000
1.6
0.85
10
5
4
Unit
mA
V
V
mA
mA
V/µs
V
V
mΩ
µA
mA
Threshold voltage
Dynamic resistance
V
DRM
= V
RRM
THERMAL RESISTANCES
Symbol
R
th(j-c)
R
th(j-a)
Junction to case (DC)
Junction to ambient (DC)
S = 1cm
2
(*)
Parameter
Value
0.8
45
Unit
°C/W
°C/W
* Surface under tab/Epoxy printed circuit board FR4, copper thickness 85µm
ORDERING INFORMATION
TN
STANDARD
SCR
SERIES
40
CURRENT: 40A
35
-
600 G (-TR)
VOLTAGE:
600: 600V
PACKAGE:
G: D
2
PAK
PACKING MODE:
Blank: Tube
-TR: Tape & Reel
SENSITIVITY:
35: 35mA
OTHER INFORMATION
Part Number
TN4035-600G
TN4035-600G-TR
■
Marking
TN4035-600G
TN4035-600G
Weight
1.5 g
1.5 g
Base Quantity
50
1000
Packing mode
Tube
Tape & Reel
Epoxy meets UL94, V0
2/5
TN4035-600G
Fig. 1:
Maximum average power dissipation
versus average on-state current.
P(W)
40
35
30
25
20
15
10
5
0
0
5
10
IT(av)(A)
15
20
α
360°
Fig. 2:
Average and DC on-state current versus
case temperature.
IT(av)(A)
50
α
= 180°
40
30
20
10
D.C.
α
= 180°
Tcase(°C)
25
30
0
0
25
50
75
100
125
Fig. 3:
Relative variation of thermal impedance
versus pulse duration.
Fig. 4:
Relative variation of gate trigger current,
holding current and latching current versus
junction temperature.
IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25 °C]
2.5
K = [Zth/Rth]
1.00
Zth(j-c)
2.0
IGT
1.5
0.10
Zth(j-a)
1.0
0.5
tp(s)
0.01
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2 5E+2
0.0
-40
IH & IL
Tj(°C)
-20
0
20
40
60
80
100
120
140
Fig. 5:
Surge peak on-state current versus
number of cycles.
Fig. 6:
Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding value of I²t.
ITSM(A),I
2
t(A
2
s)
5000
Tj initial = 25 °C
ITSM
I
2
t
ITSM(A)
500
450
400
350
300
250
200
150
100
50
0
tp = 10ms
Non repetitive
Tj initial = 25 °C
One cycle
1000
dI/dt
limitattion
Repetitive
Tcase = 95 °C
Number of cycles
1
10
100
1000
100
0.01
0.10
tp(ms)
1.00
10.00
3/5
TN4035-600G
Fig. 7:
values).
On-state
characteristics
(maximum
Fig. 8:
Thermal resistance junction to ambient
versus surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
ITM(A)
500
Tj max.:
Vto = 0.85V
Rd = 10m
Ω
Tj = Tj max.
100
10
Tj = 25°C
1
0.0
VTM(V)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
S(cm²)
0
10
20
30
40
50
0
4/5
TN4035-600G
PACKAGE MECHANICAL DATA
D
2
PAK
JEDEC REFERENCE: TO-263
DIMENSIONS
A
E
L2
C2
REF.
Millimeters
Min.
Typ.
Max.
4.60
2.69
0.23
0.93
Min.
Inches
Typ.
Max.
D
L
L3
A1
B2
B
G
A2
2.0 MIN.
FLAT ZONE
V2
C
R
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
R
V2
4.30
2.49
0.03
0.70
1.25
0.45
1.21
8.95
10.00
4.88
15.00
1.27
1.40
0°
1.40
0.40
0.169
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.048 0.055
0.60 0.017
0.024
1.36 0.047
0.054
9.35 0.352
0.368
10.28 0.393
0.405
5.28 0.192
0.208
15.85 0.590
0.624
1.40 0.050
0.055
1.75 0.055
0.069
0.016
8°
0°
8°
FOOTPRINT DIMENSIONS
(in millimeters)
D
2
PAK (Plastic)
16.90
10.30
1.30
5.08
3.70
8.90
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
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