Precision Digital Power Monitor; MSOP10, QFN16; Temp Range: -40° to 125°C
参数名称 | 属性值 |
Brand Name | Intersil |
Objectid | 1312142462 |
零件包装代码 | MSOP, QFN |
包装说明 | HVQCCN, LCC16,.12SQ,20 |
针数 | 10, 16 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 26 weeks |
可调阈值 | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PQCC-N16 |
JESD-609代码 | e3 |
长度 | 3 mm |
湿度敏感等级 | 1 |
信道数量 | 2 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC16,.12SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电流 (Isup) | 10 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3 mm |
ISL28022FRZ-T | ISL28022FUZ | ISL28022FRZ | |
---|---|---|---|
描述 | Precision Digital Power Monitor; MSOP10, QFN16; Temp Range: -40° to 125°C | Precision Digital Power Monitor; MSOP10, QFN16; Temp Range: -40° to 125°C | Precision Digital Power Monitor; MSOP10, QFN16; Temp Range: -40° to 125°C |
Brand Name | Intersil | Intersil | Intersil |
Objectid | 1312142462 | 1312142469 | 1312142464 |
零件包装代码 | MSOP, QFN | MSOP, QFN | MSOP, QFN |
包装说明 | HVQCCN, LCC16,.12SQ,20 | TSSOP, TSSOP10,.19,20 | HVQCCN, LCC16,.12SQ,20 |
针数 | 10, 16 | 10, 16 | 10, 16 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 26 weeks | 58 weeks 4 days | 78 weeks |
可调阈值 | YES | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PQCC-N16 | S-PDSO-G10 | S-PQCC-N16 |
JESD-609代码 | e3 | e3 | e3 |
长度 | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 1 | 1 | 1 |
信道数量 | 2 | 1 | 1 |
功能数量 | 1 | 1 | 1 |
端子数量 | 16 | 10 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | TSSOP | HVQCCN |
封装等效代码 | LCC16,.12SQ,20 | TSSOP10,.19,20 | LCC16,.12SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1.1 mm | 1 mm |
最大供电电流 (Isup) | 10 mA | 10 mA | 10 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD | GULL WING | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | DUAL | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 |
宽度 | 3 mm | 3 mm | 3 mm |
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