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BUH100G

产品描述Bipolar Transistors - BJT 10A 700V 100W NPN
产品类别分立半导体    晶体管   
文件大小282KB,共10页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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BUH100G概述

Bipolar Transistors - BJT 10A 700V 100W NPN

BUH100G规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
零件包装代码TO-220AB
包装说明ROHS COMPLIANT, CASE 221A-09, 3 PIN
针数3
制造商包装代码221A-09
Reach Compliance Codenot_compliant
ECCN代码EAR99
Factory Lead Time1 week
其他特性LEADFORM OPTIONS ARE AVAILABLE
外壳连接COLLECTOR
最大集电极电流 (IC)10 A
集电极-发射极最大电压400 V
配置SINGLE
最小直流电流增益 (hFE)6
JEDEC-95代码TO-220AB
JESD-30 代码R-PSFM-T3
JESD-609代码e3
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式FLANGE MOUNT
峰值回流温度(摄氏度)260
极性/信道类型NPN
最大功率耗散 (Abs)100 W
认证状态Not Qualified
表面贴装NO
端子面层Tin (Sn)
端子形式THROUGH-HOLE
端子位置SINGLE
处于峰值回流温度下的最长时间40
晶体管应用SWITCHING
晶体管元件材料SILICON
标称过渡频率 (fT)23 MHz
Base Number Matches1

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BUH100G
SWITCHMODE NPN Silicon
Planar Power Transistor
The BUH100G has an application specific state−of−art die designed
for use in 100 W Halogen electronic transformers.
This power transistor is specifically designed to sustain the large
inrush current during either the startup conditions or under a short
circuit across the load.
Features
http://onsemi.com
Improved Efficiency Due to the Low Base Drive Requirements:
High and Flat DC Current Gain h
FE
Fast Switching
Robustness Due to the Technology Developed to Manufacture
this Device
ON Semiconductor Six Sigma Philosophy Provides Tight and
Reproducible Parametric Distributions
These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating
Collector−Emitter Sustaining Voltage
Collector−Base Breakdown Voltage
Collector−Emitter Breakdown Voltage
Emitter−Base Voltage
Collector Current
Base Current
Continuous
Peak (Note 1)
Continuous
Peak (Note 1)
Symbol
V
CEO
V
CBO
V
CES
V
EBO
I
CM
I
B
I
BM
P
D
T
J
, T
stg
I
C
Value
400
700
700
10
10
20
4
10
100
0.8
−60
to 150
Unit
Vdc
Vdc
Vdc
Vdc
Adc
Adc
W
W/_C
_C
POWER TRANSISTORS
10 AMPERES
700 VOLTS
100 WATTS
TO−220AB
CASE 221A−09
STYLE 1
1
2
3
MARKING DIAGRAM
Total Device Dissipation @ T
C
= 25_C
Derate above 25°C
Operating and Storage Temperature
THERMAL CHARACTERISTICS
Characteristics
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes1/8″ from Case for 5 Seconds
Symbol
R
qJC
R
qJA
T
L
Max
1.25
62.5
260
Unit
_C/W
_C/W
_C
A
Y
WW
G
BUH100G
AY WW
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle
10%.
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
BUH100G
Package
TO−220AB
(Pb−Free)
Shipping
50 Units / Rail
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2011
October, 2011
Rev. 6
1
Publication Order Number:
BUH100/D

 
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