IMPACT Backplane Connector System
Table of Contents
Introduction
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Daughter Card Receptacle Assemblies
6 Pair Daughter Card Receptacle Assemblies
5 Pair Daughter Card Receptacle Assemblies
4 Pair Daughter Card Receptacle Assemblies
3 Pair Daughter Card Receptacle Assemblies
2 Pair Daughter Card Receptacle Assemblies
..................................8
..................................9
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Mezzanine Assemblies
5 Pair Mezzanine Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Backplane Header Assemblies
6 Pair Backplane Header Assemblies
5 Pair Backplane Header Assemblies
4 Pair Backplane Header Assemblies
3 Pair Backplane Header Assemblies
2 Pair Backplane Header Assemblies
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Coplanar Header (RAM) Assemblies
2 Pair Coplanar Header (RAM) Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Orthogonal Receptacle Assemblies
6 Pair Orthogonal Receptacle Assemblies
5 Pair Orthogonal Receptacle Assemblies
4 Pair Orthogonal Receptacle Assemblies
3 Pair Orthogonal Receptacle Assemblies
Orthogonal Header Assemblies
6 Pair Orthogonal Header Assemblies
5 Pair Orthogonal Header Assemblies
4 Pair Orthogonal Header Assemblies
3 Pair Orthogonal Header Assemblies
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimer
While TE has made every reasonable
effort to ensure the accuracy of the
information in this catalog, TE does
not guarantee that it is error-free, nor
does TE make any other representation,
warranty or guarantee that the informa-
tion is accurate, correct, reliable or
current. TE reserves the right to make
any adjustments to the information
contained herein at any time without
notice. TE expressly disclaims all implied
warranties regarding the information
contained herein, including, but not
limited to, any implied warranties of
merchantability or fitness for a particular
purpose. The dimensions in this catalog
are for reference purposes only and
are subject to change without notice.
Specifications are subject to change
without notice. Consult TE for the latest
dimensions and design specifications.
© Copyright 2011 Tyco Electronics
Corporation. All Rights Reserved.
MULTIGIG RT, Z-PACK, Z-PACK HM-Zd,
Z-PACK HS3, Z-PACK Slim UHD,
Z-PACK TinMan,
TE Connectivity,
TE connectivity (logo) and TE (logo) are
trademarks of the TE Connectivity Ltd
family of companies.
IMPACT is a trademark of Molex, Inc.
Other logos, product and Company
names mentioned herein may be
trademarks of their respective owners.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Part Number Index
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Global Contacts
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Visit the IMPACT connector webpage at: www.te.com/products/Impact
Dimensions are in millimeters
unless otherwise specified.
USA: +1 (800) 522-6752
Canada: +1 (905) 475-6222
Mexico/C. Am.: +52 (0) 55-1106-0800
Latin/S. Am.: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
UK: +44 (0) 800-267666
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
2
Catalog 7-1773458-1
Revised 4-11
www.te.com
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
IMPACT Backplane Connector System
Introduction
Product Facts
I
Differential pair density up
to 80 pairs per linear inch
Broad-edge-coupled,
differential-pair system
PCB routing complexity and
costs are reduced by using
1.90 mm by 1.35 mm (.075"
by .053") grid on backplane
and daughter card
Offers flexibility and
advanced mechanical and
electrical performance with
two compliant-pin attach
options
Inline staggered, bifurcated
contact beams in daughter
card interface provides
improved mating
performance
I
I
I
I
Industry Applications
I
Telecommunications
equipment
I
Hubs, routers, switches
Central office, cellular
infrastructure and
multi-platform service
(DSL, Cable Data) systems
Data networking equipment
I
Servers
I
Storage
Test and measurement
equipment
Medical diagnostic
equipment
TE Connectivity offers a
variety of backplane/
midplane solutions to meet
the demand for increased
network bandwidth and
advanced technology.
Each solution is designed
for high performance,
increased density and
compatibility with industry-
standard interfaces.
TE provides a user-friendly
transition between the PCB-
mounted connector and the
backplane/ midplane.
TE has extensive knowledge
and expertise on high-speed
interface design. Your
specific needs can be
customized and transformed
into new manufacturable
designs.
The IMPACT backplane
connector and cable system
from TE pushes the speed
and density envelope to
meet the growing demands
of next-generation telecom-
munication and data net-
working equipment; the
system is available in 2-6
pair configurations with a
complete range of guidance
and power-solution options
plus right-angle cable
assemblies.
The IMPACT system is
available in two compliant-
pin design options on both
daughter card and back-
plane connectors, providing
customers ultimate flexibility
to optimize their designs for
advanced mechanical and
electrical performance.
The IMPACT system’s mating
interface provides in-line
staggered, bifurcated con-
tacts that provide 2 points
of contact for the long-term
reliability performance and
built-in, ground-signal
sequencing. This reduces
the average mating force
per connector to improve
the mechanical mating
performance of the system.
Material and Finish
Signal Contact
— High Performance
Copper (Cu) Alloy
Ground Contact
— High Performance
Copper (Cu) Alloy
Housing
— Liquid Crystal Polymer,
UL 94V-0
I
I
Platings
Contact Area
— 0.76 µm (30 µ") Gold
(Au) min.
Solder Tail Area
— Tin (Sn) or
Tin/Lead (Sn/Pb)
Underplating
— Nickel (Ni)
PCB Thickness
— 1.60 mm (.062")
typical
I
I
Ratings
Temperature Range
— -55˚C to
85˚C max.
Current Rating
— 0.75 A per pin max.
Durability
— 200 cycles
Operating Voltage
— 30 VAC RMS/
DC max.
Mating Force
— 0.30 N (9.066 lb)
max. per pin
Compliant Pin Retention Force to
PCB
— 3.56 N (.80 lb) per compliant
pin average min.
Compliant Pin Insertion Force to
PCB
— 26.7 N (6.0 lb) max. per contact
Technical Documents
Product Specification
108-2351
Application Specification
114-13258
Signal Integrity
Insulation Resistance
— 10,000
Megohms min.
Visit the IMPACT connector webpage at: www.te.com/products/Impact
3
Catalog 7-1773458-1
Revised 4-11
www.te.com
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Dimensions are in millimeters
unless otherwise specified.
USA: +1 (800) 522-6752
Canada: +1 (905) 475-6222
Mexico/C. Am.: +52 (0) 55-1106-0800
Latin/S. Am.: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
UK: +44 (0) 800-267666
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
IMPACT Backplane Connector System
Introduction
(Continued)
IMPACT Connector Family
Standard, Monoblock
Solutions
2 Pair IMPACT (W = 12.65 mm)
Density = 27 Pairs/Inch
10 column = 20 Diff. Pairs
16 column = 32 Diff. Pairs
3 Pair IMPACT (W = 16.7 mm)
Density = 40 Pairs/Inch
10 column = 30 Diff. Pairs
16 column = 48 Diff. Pairs
End-to-End Stackable Example
4 Pair IMPACT (W = 20.75 mm)
Density = 54 Pairs/Inch
10 column = 40 Diff. Pairs
16 column = 64 Diff. Pairs
5 Pair IMPACT (W = 24.80 mm)
Density = 67 Pairs/Inch
10 column = 50 Diff. Pairs
16 column = 80 Diff. Pairs
6 Pair IMPACT (W = 28.85 mm)
Density = 80 Pairs/Inch
10 column = 60 Diff. Pairs
16 column = 96 Diff. Pairs
End Wall Separation Example
Visit the IMPACT connector webpage at: www.te.com/products/Impact
5
Catalog 7-1773458-1
Revised 4-11
www.te.com
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Dimensions are in millimeters
unless otherwise specified.
USA: +1 (800) 522-6752
Canada: +1 (905) 475-6222
Mexico/C. Am.: +52 (0) 55-1106-0800
Latin/S. Am.: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
UK: +44 (0) 800-267666
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
