81035032X概述

OT PLD, 45ns, TTL, CQCC20, CC-20

81035032X规格参数

参数名称	属性值
厂商名称	Monolithic Memories
包装说明	CC-20
Reach Compliance Code	unknown
JESD-30 代码	S-CQCC-N20
长度	8.89 mm
专用输入次数	14
I/O 线路数量
端子数量	20
最高工作温度	125 °C
最低工作温度	-55 °C
组织	14 DEDICATED INPUTS, 0 I/O
输出函数	COMBINATORIAL
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装形状	SQUARE
封装形式	CHIP CARRIER
可编程逻辑类型	OT PLD
传播延迟	45 ns
认证状态	Not Qualified
座面最大高度	2.032 mm
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	YES
技术	TTL
温度等级	MILITARY
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	QUAD
宽度	8.89 mm
Base Number Matches	1

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81035032X相似产品对比

	81035032X	8103503SX	8103504RX	8103508RX	8103503RX	8103504SX	81035042X	81035022X	8103502SX
描述	OT PLD, 45ns, TTL, CQCC20, CC-20	OT PLD, 45ns, TTL, CDFP20, FP-20	OT PLD, 45ns, TTL, PDIP20, DIP-20	OT PLD, 45ns, TTL, PDIP20, DIP-20	OT PLD, 45ns, TTL, PDIP20, DIP-20	OT PLD, 45ns, TTL, CDFP20, FP-20	OT PLD, 45ns, TTL, CQCC20, CC-20	OT PLD, 45ns, TTL, CQCC20, CC-20	OT PLD, 45ns, TTL, CDFP20, FP-20
厂商名称	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories
包装说明	CC-20	FP-20	DIP-20	DIP-20	DIP-20	FP-20	CC-20	CC-20	FP-20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	S-CQCC-N20	R-CDFP-F20	R-PDIP-T20	R-PDIP-T20	R-PDIP-T20	R-CDFP-F20	S-CQCC-N20	S-CQCC-N20	R-CDFP-F20
长度	8.89 mm	13.03 mm	25.908 mm	25.908 mm	25.908 mm	13.03 mm	8.89 mm	8.89 mm	13.03 mm
专用输入次数	14	14	16	14	14	16	16	12	12
端子数量	20	20	20	20	20	20	20	20	20
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	14 DEDICATED INPUTS, 0 I/O	14 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O	14 DEDICATED INPUTS, 0 I/O	14 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O	16 DEDICATED INPUTS, 0 I/O	12 DEDICATED INPUTS, 0 I/O	12 DEDICATED INPUTS, 0 I/O
输出函数	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN	DFP	DIP	DIP	DIP	DFP	QCCN	QCCN	DFP
封装形状	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR
封装形式	CHIP CARRIER	FLATPACK	IN-LINE	IN-LINE	IN-LINE	FLATPACK	CHIP CARRIER	CHIP CARRIER	FLATPACK
可编程逻辑类型	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD
传播延迟	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.032 mm	2.286 mm	4.318 mm	4.318 mm	4.318 mm	2.286 mm	2.032 mm	2.032 mm	2.286 mm
最大供电电压	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	NO	NO	YES	YES	YES	YES
技术	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	NO LEAD	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	NO LEAD	NO LEAD	FLAT
端子节距	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL
宽度	8.89 mm	6.883 mm	7.62 mm	7.62 mm	7.62 mm	6.883 mm	8.89 mm	8.89 mm	6.883 mm
Base Number Matches	1	1	1	1	1	1	1	1	-

81035032X

81035032X概述

81035032X规格参数

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