电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N3829CUR-1E3TR

产品描述Zener Diode, 6.8V V(Z), 2%, 1.25W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETIC SEALED, LEADLESS, GLASS, MELF-2
产品类别分立半导体    二极管   
文件大小236KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

1N3829CUR-1E3TR概述

Zener Diode, 6.8V V(Z), 2%, 1.25W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETIC SEALED, LEADLESS, GLASS, MELF-2

1N3829CUR-1E3TR规格参数

参数名称属性值
是否Rohs认证符合
零件包装代码DO-213AB
包装说明O-LELF-R2
针数2
Reach Compliance Codeunknow
ECCN代码EAR99
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e3
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
认证状态Not Qualified
标称参考电压6.8 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差2%
工作测试电流37 mA
Base Number Matches1

文档预览

下载PDF文档
1N3821UR-1 thru 1N3830AUR-1, e3 or
MLL3821 thru MLL3830A, e3
SCOTTSDALE DIVISION
LEADLESS GLASS ZENER DIODES
DESCRIPTION
This surface mountable zener diode series is similar to the lower voltage
1N3821 thru 1N3830 JEDEC registration except it is in a surface mount
DO-213AB package outline. It is an ideal selection for applications of high
density and low parasitic requirements. Due to its glass hermetic qualities
and enhanced metallurgical bonded internal construction, it is also well
suited for high reliability applications. This can be acquired by a source
control drawing (SCD), or simply by ordering device types with a MQ, MX
or MV prefix for equivalent screening to JAN, JANTX or JANTXV
respectively.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
FEATURES
Leadless package for surface mount equivalent to
1N3821 thru 1N3830A.
Ideal for high-density mounting
Lower voltage selections of 3.3 V to 7.5 V
Hermetically sealed, double-slug glass construction
Metallurgically enhanced contact construction
Options for screening in accordance with MIL-PRF-
19500/115 for JAN, JANTX, and JANTXV with MQ, MX
or MV prefixes respectively for part numbers, e.g.
MX1N3821AUR-1, MV1N3828AUR-1, etc.
Axial lead “thru-hole” DO-13 packages per JEDEC
registration available as 1N3821A thru 1N3830A (see
separate data sheet with MIL-PRF-19500/115
qualification)
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Leadless package for surface mounting
Tight voltage tolerances available
Ideal for high-density mounting
Metallurgically enhanced internal contact design
for greater reliability and lower thermal resistance
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in
Microsemi MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see derating
in Figure 1).
º
º
Operating and Storage temperature: -65 C to +175 C
Thermal Resistance: 40
º
C/W junction to end cap, or
120
º
C/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page)
Steady-State Power: 1.50 watts at end-cap
temperature T
EC
< 115
o
C, or 1.25 watts at T
A
= 25
º
C
when mounted on FR4 PC board and recommended
footprint as described for thermal resistance (also see
Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed glass MELF package
TERMINALS: Tin-Lead (SN/Pb) or RoHS
compliant annealed matte-Tin (Sn) plating
solderable per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode
to be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-1-
A with 12 mm tape, 1500 per 7 inch reel or 5000
per 13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N3821UR-1 thru
1N3830AUR-1,e3 or
MLL3821 thru MLL3830A,e3
hru
Copyright
©
2006
3-12-2006 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
wince下数据存储问题
刚接触wince,请高手帮忙,wince的数据(比如电话号码记录)是怎么存储的?通过mircrosoft提供的数据库组件吗?还是自己用写一个类用文件去管理的?如果是通过数据库管理,那么数据库是怎么和外 ......
zhengkuo 嵌入式系统
【那些让人受不了的BUG】这不是BUG,是“新特性”——流氓特性
说好的,我也发一个单独的BUG贴。 前面那个活动说明贴里.......大家都喜欢回复,诶~~看来100芯币和10个芯币的差别还不足以吸引,还是说大家都十分视芯币如粪土?太厉害了......所以 ......
辛昕 编程基础
zigbee通信,给点建议!!!
小弟最近有个想法,利用zigbee组网,具体情况如下: 一个上位机 n个设备 让上位机监视n个设备运行状态,并且可以互相通信。 个人想到的实现方法: 一个 ......
郭芙蓉 无线连接
浅析msp430与51单片机的特点
1 单片机的特点 单片机的发展先后经历了4位、8位、16位和32位等阶段。8位单 片机由于功能强,被广泛用于工业控制、智能接口、仪器仪表等各个 领域,8位单片机在中、小规模应用场合仍占主流地 ......
slfs007 TI技术论坛
喜剧之王
记得高中同桌凯子说过一句话∶每一个放荡不羁的形体里都隐藏着一颗严肃的心。大意这样,原话记不清了,也不知是不是原创。原来一直很信这个理,现在学过辩证法,认为这句话有88%的道理。试想星 ......
仁者无敌528 聊聊、笑笑、闹闹
请问:M88熔丝位设置问题,我想将PORTC6的复位引脚设置成I/O模式,如何设置?
? RESET/PCINT14 – 端口C, 位6 RESET,复位引脚:熔丝位RSTDISBL 被编程时,该引脚作为普通的I/O引脚使用,此时, 芯片内部的上电复位与BOD 复位电路将作为系统的复位源。当RSTDISBL 熔丝 ......
qiyuan775 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 849  1567  633  1289  1910  6  8  9  27  59 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved