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Information furnished in this publication is preliminary and subject to changes without notice.
1/57
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Datasheet
“ASI for you” IC
Table of Contents
0
0.1
0.2
0.3
1
1.1
1.2
1.3
1.4
2
Page
READ THIS FIRST.......................................................................................................................................... 4
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Information furnished in this publication is preliminary and subject to changes without notice.
3.12.1 AS- i input channel...........................................................................................................................44
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3/57
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Datasheet
“ASI for you” IC
0
Read this First
SAFETY-ADVICE
0.1
Important Notice
Products sold by ZMD are covered exclusively by the warranty, patent indemnification and other provisions ap-
pearing in ZMD standard "Terms of Sale". ZMD makes no warranty (express, statutory, implied and/or by de-
scription), including without limitation any warranties of merchantability and/or fitness for a particular purpose,
regarding the information set forth in the Materials pertaining to ZMD products, or regarding the freedom of any
products described in the Materials from patent and/or other infringement. ZMD reserves the right to discontinue
production and change specifications and prices of its products at any time and without notice. ZMD products
are intended for use in commercial applications. Applications requiring extended temperature range, unusual
environmental requirements, or high reliability applications, such as military, medical life-support or life-
sustaining equipment, are specifically not recommended without additional mutually agreed upon processing by
ZMD for such applications.
ZMD reserves the right to change the detail specifications as may be required to permit improvements in the
design of its products.
0.2
ASI-Safety Applications
The ASI4U is designed to allow replacement of A²SI ICs in existing board layouts and applications. However,
since the ASI4U provides additional data preprocessing functions at the data input channel, the fault reaction
time of an AS-i Safety module could increase by 40ms if some of the new features become activated by inten-
tion, by accident or hardware fault.
ZMD strongly recommends the use of the new ASI4U Safety-Mode, if the ASI4U shall replace the A²SI in exist-
ing ASI-Safety designs. Only then, the same fault reaction times as with the A²SI are guaranteed. For compati-
bility with the modified data input routing in Safety Mode, the user has to adapt the safety code table stored in
the external micro controller. Only such Safety Code Sequences that contain the value
1110
are permitted.
If the IC is operated in Safety Mode, the user must pay special attention that the
Synchronous Data I/O Mode
as
well as the
Data Input Filters
remain disabled by appropriate E²PROM configuration.
Application of the ASI4U in Standard Mode (no Safety Mode enabled) for AS-i Safety products is basically pos-
sible, if an additional Fault Reaction Time of 40ms is taken into account.
The user shall also obey the additional security advice regarding “Production and Repair of AS-i Safety Slaves”
that is available as an additional document form the ZMD web page
www.zmd.biz
.
0.3
Repair of ASI-Safety Modules
If an A²SI based ASI-Safety Module shall be repaired, it is
explicitly prohibited
to replace the A²SI IC with the
newer ASI4U IC. This is to exclude safety relevant deviations of module properties that can result from the dif-
ferent data input paths an the above mentioned possible increase in Fault Reaction Time.
The user shall also obey the additional security advice regarding “Production and Repair of AS-i Safety Slaves”
that is available as an additional document form the ZMD web page
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The
Information furnished in this publication is preliminary and subject to changes without notice.
4/57
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Datasheet
“ASI for you” IC
1
General Device Specification
1.1 Absolute Maximum Ratings (Non Operating)
Table 1: Absolute Maximum Ratings
Symbol
V
0V
, V
GND
V
ASIP-ASIN
V
ASIP-ASIN_P
V
ASIP
V
ASIN
V
UIN
V
UIN_P
V
inputs1
V
inputs2
I
in
H
V
HBM1
V
HBM2
V
EDM
θ
STG
P
tot
R
thj
1
Parameter
Voltage reference
Voltage difference between ASIP and ASIN (V
ASIP
- V
ASIN
)
Pulse voltage between ASIP and ASIN (V
ASIP
- V
ASIN
)
Pulse voltage between ASIP and 0V (V
ASIP
– V
0V
)
Voltage between ASIN and 0V (V
ASIN
– V
0V
)
Power supply input voltage
Pulse voltage at power supply input
Voltage at pins DI3 ... DI0, DO3 ... DO0, P3 ... P0, DSR, PST,
LED1, LED2, FID, IRD, UOUT
Voltage at pins OSC1, OSC2, CAP, U5R
Input current into any pin except supply pins
Humidity non-condensing
Electrostatic discharge – Human Body Model (HBM1)
Electrostatic discharge – Human Body Model (HBM2)
Electrostatic discharge – Equipment Discharge Model (EDM)
Storage temperature
Total power dissipation
Thermal resistance of SSOP 28 package
Min
0
-0.3
-0.3
-0.3
-6.0
-0.3
-0.3
-0.3
-0.3
-50
Max
0
40
50
50
6.0
40
50
V
UIN
+ 0.3
7
50
Unit
V
V
V
V
V
V
V
V
V
mA
Note
1
2
2, 3
3
2
4
5
3500
2000
400
-55
125
0.85
40
80
V
V
V
°C
W
K/W
6
7
8
9
10
reverse polarity protection has to be performed
externally
2
3
4
5
6
7
8
9
pulse with
≤
50µs, repetition rate
≤
0.5 Hz
V
ASIP-ASIN
and V
ASIP-ASIN_P
must not be violated
Latch-up resistance, reference pin is 0V
Level 4 according to JEDEC-020A is guaranteed
0.6
Ptot (2L)
HBM1: C = 100pF charged to V
HBM1
with resistor
0.5
Ptot (1L)
R = 1.5kΩ in series, valid for ASIP-ASIN only.
0.4
HBM2: C = 100pF charged to V
HBM2
with resistor
0.3
R = 1.5kΩ in series, valid for all pins except ASIP-
ASIN
0.2
EDM: C = 200pF charged to V
EDM
with no resistor
-25
0
25
50
75
Ta
100
in series, valid for ASIP-ASIN only
at max. operating temperature, the allowed total
Figure 1: Ptot = f(θ
a
)
power dissipation depends on additional thermal
resistance from package to ambient and on the operation ambient temperature as shown in Figure 1.
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The
Information furnished in this publication is preliminary and subject to changes without notice.
空分复用 (SDM) MIMO 处理可显著提高频谱效率，进而大幅增加无线通信系统的容量。空分复用 MIMO 通信系统作为一种能够大幅提升无线系统容量和连接可靠性的手段，近来吸引了人们的广泛关注。 MIMO 无线系统最佳硬判决检测方式是最大似然 (ML) 检测器。ML 检测因为比特误码率 (BER)性能出众，非常受欢迎。不过，直接实施的复杂性会随着天线和调制方案的增加呈指数级增强，使...[详细]
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