NUMBER
TYPE
GS-12-1092
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1 of 8
DDR4 288P 0.85mm Pitch Socket
AUTHORIZED BY
DATE
A
25 Nov 15
Nickor Zuo
CLASSIFICATION
UNRESTRICTED
1.0 Objective
This specification defines the performance, test, quality and reliability requirements of the DDR4 288P
0.85mm pitch socket.
2.0Scope
This specification is applicable to DDR4 family DIMM socket of products which provides memory module
card to PCB interconnecting.
3.0 Ratings
3.1
3.2
3.3
Operating Voltage Rating = 29.9 V
AC
(RMS) or V
DC
Max.
Operating Current Rating = 0.75 A/Contact Max.
Operating Temperature Range = -55
~ +85
4.0Applicable Documents
4.1
4.2
4.3
4.4
4.5
4.6
5.0
FCI Engineering drawings 10124632, 10129040, 10130419, 10124677, 10124806, 10129206 etc.
FCI Product Shelf life-Storage-Solderability GS-20-060
FCI Package specification GS-14-2267
Flammability: UL94V-0 or similar applicable specification
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications.
IEC 60512: Connectors for Electronic Equipment – Tests and Measurement
Requirements
5.1 Qualification
Connectors furnished under this specification shall be capable of meeting the qualification test
requirements specified herein.
5.2 Material
Terminal: Copper alloy
Housing: High temperature thermoplastic
Ejector: High temperature thermoplastic
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Jan 08, 2016
NUMBER
TYPE
GS-12-1092
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
2 of 8
DDR4 288P 0.85mm Pitch Socket
AUTHORIZED BY
DATE
A
25 Nov 15
Nickor Zuo
CLASSIFICATION
UNRESTRICTED
5.3
Terminal Plating
•
•
Contact Area:
Performance-base plating, qualified to meet the requirements of this specification
Tails: Tin plated over Nickel Or Tin-lead plated over Nickel
5.4
Design and Construction
Connectors shall be of the design, construction and physical dimensions specified on the
applicable product drawings.
5.5
Visual
Visual examinations shall be performed using 10X magnification. Parts should be free from
blistering, cracks, etc.
6.0
Electrical Characteristics
6.1
Contact Resistance, LLCR
The low level contact resistance shall not exceed 10 mΩ initially. The low level contact resistance
shall also not exceed 10 mΩ increase in resistance (from the initial measurement) after any treatment
and/or environmental exposure.
Measurements shall be in accordance with EIA-364-23.
The following details shall apply:
a. Test Voltage - 20 mV Max.
b. Test Current - 100 mA Max.
6.2
Insulation Resistance
The insulation resistance of unmated connectors shall not be less than 1MΩ initially and after
environmental exposure.
Measurements shall be in accordance with EIA-364-21.
The following details shall apply:
a. Test Voltage – 500V DC.
b. Electrification Time - 2 minutes, unless otherwise specified.
c. Points of Measurement - Between adjacent contacts.
6.3
Dielectric Withstanding Voltage
There shall be no evidence of arc-over, insulation breakdown, or excessive leakage current > 1m
amperes when unmated connectors are tested in accordance with EIA-364-20.
The following details shall apply:
a. Test Voltage - 500V (AC RMS, 60Hz).
b. Test Duration - 60 seconds.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Jan 08, 2016
NUMBER
TYPE
GS-12-1092
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
3 of 8
DDR4 288P 0.85mm Pitch Socket
AUTHORIZED BY
DATE
A
25 Nov 15
Nickor Zuo
CLASSIFICATION
UNRESTRICTED
c. Test Condition - 1 (760 Torr - sea level).
d. Points of Measurement - Between adjacent contacts.
6.4
Temperature Rise
A thermocouple is inserted though holes in the socket housing, as close to the contact
interface as possible. Temperature rise shall not exceed 30°C per contact.
The following details shall apply:
a. Ambient Conditions – Still air at room temperature.
b. Reference – EIA-364-70, method 2.
C. 0.75 amp/pin
7.0 Mechanical Characteristics
7.1
Module Mating/Unmating Force
The force to mate a module with ejectors installed shall not exceed 106.8 N. The force to pull out a
module without ejectors shall not be less than 19.77N.
The following details shall apply:
a. Cross Head Speed for mating- 25.4mm per minute.
b. Cross Head Speed for unmating – 12.7mm per minute.
b. Utilize free floating fixtures.
c. Reference –EIA-364-13.
7.2 Terminal Retention Force
Axially 300gf Min force to pull out a contact from housing, no movement of the contact more than
0.38mm.
The following details shall apply:
a. Cross Head Speed - 25.4 ±1 mm per minute.
b. Reference –EIA-364-29.
7.3
Forklock Retention Force
Axially 13.3N Min force to pull out a forklock from housing, no movement of the forklock more than
0.38mm.
The following details shall apply:
a. Cross Head Speed - 25.4 ±1 mm per minute.
b. Reference –EIA-364-29.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Jan 08, 2016
NUMBER
TYPE
GS-12-1092
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
4 of 8
DDR4 288P 0.85mm Pitch Socket
AUTHORIZED BY
DATE
A
25 Nov 15
Nickor Zuo
CLASSIFICATION
UNRESTRICTED
7.4
Insertion Force –Connector to Board (For Forklock type only)
Axially force to insert the connector to PCB shall be 75N max
The following details shall apply:
a. Cross Head Speed – 12.7 ±1 mm per minute.
b. Reference –EIA-364-05.
7.5 Compliant Pin Insertion Force to PCB (For DDR4 PF only)
The force to insert a compliant pin into PCB hole at a rate of 25.4 ± 1mm/minute shall not exceed
1.5kg.
7.6 Compliant Pin Retention Force to PCB (For DDR4 PF only)
The force to pull out a compliant pin from PCB hole at a rate of 25.4 ± 1mm/minute shall not be less
than 0.20kg.
8.0 Environmental Conditions
After exposure to the following environmental conditions in accordance with the specified test
procedure and/or details, the product shall show no physical damage and shall meet the electrical and
mechanical requirements above as specified in the Table 1 test sequences. Unless specified
otherwise, assemblies shall be mated during exposure.
8.1
Thermal Shock – EIA-364-32, Method A, Table2, Test Condition 1
a. Number of Cycles - perform 5 cycles in mated condition
b. Temperature Range - Between -55 and 85 °C
8.2
Cyclic Temperature and Humidity – EIA-364-31, Method III without conditioning, initial measurements,
cold shock and vibration. Ramp times should be 0.5 hour and dwell times should be 1.0 hour. Dwell
times start when the temperature and humidity have stabilized within specified levels, perform 24
cycles in mated condition.
Temperature Life (Preconditioning) –EIA-364-17, Method A (without electrical load), following shall be
applied in mated connectors,
a. Test Temperature – 105 °C
b. Test Duration – 24 hours to simulate a 3 year life cycle for gold flash plating,36 hours to simulate a
5 year life cycle for 15u” gold or GXT plating,50 hours to simulate a 7 year life cycle for 30u’’ gold or
GXT plating.
8.4
Temperature Life –EIA-364-1000, following shall be applied in mated connectors,
a. Test Temperature – 105 °C
b. Test Duration – 48 hours to simulate a 3 year life cycle for gold flash plating,72 hours to simulate a
5 year life cycle for 15u” gold or GXT plating,91 hours to simulate a 7 year life cycle for 30u’’ gold or
GXT plating
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
8.3
PDS: Rev :A
STATUS:Released
Printed: Jan 08, 2016
NUMBER
TYPE
GS-12-1092
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
5 of 8
DDR4 288P 0.85mm Pitch Socket
AUTHORIZED BY
DATE
A
25 Nov 15
Nickor Zuo
CLASSIFICATION
UNRESTRICTED
8.5 Mixed Flowing Gas– EIA-364-65, Class – 2A, Option 4.
The mated duration and unmated duration Per EIA-364-1000 table 4.1:5 days to simulate a 3 year life
cycle for gold flash plating,7 days to simulate a 5 year life cycle for 15u” gold or GXT plating,10 days to
simulate a 7 year life cycle for 30u” gold or GXT plating.
8.6 Thermal Disturbance
a. Temperature– Between 15±3°C and 85±3°C without humidity control.
b. Ramp should be a minimum of 2°C per minute.
c. Dwell time: 5 minutes, start when the temperature have stabilized.
d. Duration - perform 10 cycles in mated condition.
8.7 Vibration (Random) – EIA-364-28
a. Test Condition –
Random profile:
5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up)
20 Hz to 500 Hz @ 0.02 g2/Hz (flat)
Input acceleration is 3.13 g RMS
10 minutes per axis for all 3 axes on all samples
Random control limit tolerance is ± 3 dB
b. Module weight 40 ± 2 grams. Center of gravity 18-20 mm from the module mating edge (bottom
of the module where gold fingers reside)
c. No physical damage and no discontinuities greater than 1 microseconds.
8.8 Mechanical Shock – EIA-364-27
a. Condition - Trapezoidal shock 50 g ± 10%, duration 11ms, Velocity change 170 inches/sec, ± 10%
Three drops in each of six directions are applied to each of the three samples
b. Module weight 40 ± 2 grams. Center of gravity 18-20 mm from the module mating edge (bottom
of the module where gold fingers reside)
c. No physical damage.
8.9 Durability - EIA-364-09, perform plug/unplug cycles.
a. Number Cycles - 25 cycles
b. Cycling Rate – 10 cycles/min
8.10 Durability (Preconditioning) - EIA-364-09, perform plug/unplug cycles.
a. Number Cycles - 5 cycles
b. Cycling Rate – 10 cycles/min
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :A
STATUS:Released
Printed: Jan 08, 2016
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
