电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N5955DUR-1E3

产品描述Zener Diode
产品类别分立半导体    二极管   
文件大小293KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

1N5955DUR-1E3概述

Zener Diode

1N5955DUR-1E3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明O-LELF-R2
Reach Compliance Codecompli
ECCN代码EAR99
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e3
元件数量1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
标称参考电压180 V
表面贴装YES
技术ZENER
端子面层Matte Tin (Sn)
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差1%
工作测试电流2.1 mA
Base Number Matches1

文档预览

下载PDF文档
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
Available
Metallurgically Bonded Glass Surface Mount
1.5 Watt Zener Diodes
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar
in electrical features to the JEDEC registered 1N5913B through 1N5956B axial-leaded
package for 3.3 to 200 V. It is an ideal selection for applications of high density and low
parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced
internal contacts, it may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in
Features below.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-213AB MELF
Package
Also available in:
DO-41 package
(glass axial-leaded)
1N5913BG – 1N5956BG
FEATURES
Surface mount equivalent of JEDEC registered 1N5913B TO 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Voltage tolerances of 10%, 5%, 2% and 1% are available.
Screening in reference to MIL-PRF-19500 is available.
(See
part nomenclature
for all available options.)
RoHS compliant versions are available.
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
APPLICATIONS / BENEFITS
Regulates voltage over a broad ranges of operation current and temperature.
Leadless package ideal for high-density surface mounting.
Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance.
Hermetically sealed glass package.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Specified capacitance (see
figure 2).
Inherently radiation hard as described in Microsemi
MicroNote 050.
o
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
MAXIMUM RATINGS
@ T
A
= 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
(1)
Thermal Resistance Junction-to-Ambient
Steady State Power Dissipation
@ T
EC
≤ 115 ºC
(1)
@ T
A
= 25 ºC
Rated Average Power Dissipation (also see
figure 1)
Forward Voltage
@ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
& T
STG
R
ӨJEC
R
ӨJA
P
D
P
M(AV)
V
F
T
SP
Value
-65 to +175
40
120
1.5
1.25
1.5
1.2
260
Unit
o
C
o
C/W
o
C/W
W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 1 of 5
ad10绘制多层板时,
本帖最后由 hu柏拉图的永恒 于 2015-5-21 15:33 编辑 绘制多层板时,布线时,电源网络接地网络是不是不用布线,而是先把它们隐藏进行内电层设置时通过焊盘过孔连接吗?...
hu柏拉图的永恒 PCB设计
LED电子显示屏驱动芯片问题
 LED驱动芯片可分为通用芯片和专用芯片。通用芯片一般用于LED显示屏的低端产品,如户内的单、双色屏等。最常用的通用芯片是74HC595,具有8位锁存、串一并移位寄存器和三态输出功能。每路最大可 ......
探路者 LED专区
EVC4.0+sp3+ppc2003,在同事机器上都正常,装到我机器上单步调试变得超级慢
EVC4.0+sp3+ppc2003,在同事机器上都正常。装到我机器上编译时间可以接受,单步调试变得超级慢,F11一下要等10多秒,甚至更长。编译的程序并不大,大概也就是1000多行的一个DLL,请问这是怎么回 ......
147802802 嵌入式系统
TMS320c6454和CCS3.3连接失败
如题:CCS为V3.3,仿真器是开发板之家增强型USB仿真器,设置之前保证驱动已安装成功 按照使用说明,CCS setup的时候在C64X+中选择TI 6455 XDS510 emulator(这个跟6454最接近) 使用仿真器提 ......
飞天猪run DSP 与 ARM 处理器
这一次,全车厢的人都感动了......
昨天九点多在城铁上,一个大男孩把书包放在地上,端起了吉他 原本以为,又是惯常地地铁歌者,于是不以为然地坐着 接着他说 “大家好,我是**乐队的主唱,我不是专职做这个的,我只干这 ......
soso 聊聊、笑笑、闹闹

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1712  1992  1587  2747  2587  47  36  21  25  38 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved