Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK20DX256ZVLQ10R

MK20DX256ZVLQ10R: 产品描述ARM Microcontrollers - MCU Kinetis 256Kflex USB; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共75页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MK20DX256ZVLQ10R概述

ARM Microcontrollers - MCU Kinetis 256Kflex USB

MK20DX256ZVLQ10R规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	QFP
包装说明	20 X 20 MM, LQFP-144
针数	144
Reach Compliance Code	unknown
ECCN代码	3A991.A.2
具有ADC	YES
地址总线宽度
位大小	32
CPU系列	CORTEX-M4
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PQFP-G144
JESD-609代码	e3
长度	20 mm
湿度敏感等级	3
I/O 线路数量	100
端子数量	144
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装等效代码	QFP144,.87SQ,20
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
电源	1.8/3.3 V
认证状态	Not Qualified
RAM（字节）	65536
ROM（单词）	262144
ROM可编程性	FLASH
座面最大高度	1.6 mm
速度	100 MHz
最大压摆率	87 mA
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

文档解析

K20 子系列微控制器基于高性能 ARM Cortex-M4 核心，运行频率高达 100MHz，支持 DSP 指令集，提供 1.25 Dhrystone MIPS 每 MHz 的计算效率。该系列具备宽工作电压范围（1.71V 至 3.6V），适用于 -40°C 到 105°C 的工业级温度环境，确保在严苛条件下的可靠运行。核心特性包括丰富的内存接口和低功耗设计，为嵌入式系统提供稳定的处理能力。设备集成高达 512KB 程序闪存和 128KB RAM，支持 EzPort 串行编程接口和 FlexBus 外部总线接口，便于数据存储和扩展。时钟系统涵盖 3-32MHz 晶体振荡器、32kHz 晶体振荡器及多用途时钟生成器，实现灵活的时序控制。系统外设如内存保护单元、16 通道 DMA 控制器（支持 63 个请求源）和多种低功耗模式，优化了电源管理。模拟模块包括两个 16 位 SAR ADC 和可编程增益放大器（PGA），增强信号处理能力。该系列适用于工业自动化、消费电子和汽车控制领域，提供安全特性如硬件 CRC 模块和 128 位唯一芯片 ID。通信接口支持 USB OTG、双 CAN 模块和多达六个 UART，确保多样化的连接需求。封装选项包括 LQFP 和 MAPBGA，满足不同应用场景的集成要求。K20 子系列专注于低功耗与宽电压适应性，工作电压覆盖 1.71V 到 3.6V，闪存写入电压同样范围，适合电池供电和便携设备。在 -40°C 至 105°C 温度范围内保持稳定，核心采用 100MHz ARM Cortex-M4，集成 DSP 指令，提升能效比。低功耗模式包括 VLPS、LLS 和 VLLSx，显著降低静态电流，例如在 3.0V 时 VLPS 模式电流低至 93μA。内存配置高达 512KB 闪存和 128KB RAM，支持数据保留电压低至 1.2V。时钟管理通过多用途时钟生成器和低功耗振荡器实现，优化系统唤醒时间（如 VLLS 到 RUN 模式恢复时间小于 134μs）。模拟部分集成两个 12 位 DAC、三个带 6 位 DAC 的比较器，以及电压参考模块，适用于传感器接口。人机界面包括低功耗硬件触摸传感器（TSI）和通用 GPIO。设计针对节能应用如 IoT 节点和医疗设备，提供 EMC 辐射发射控制（符合 IEC 61967-2 标准）。通信接口丰富，包括 SPI、I2C 和 UART，支持低功耗操作模式。安全特性如唯一 ID 和 CRC 校验增强数据完整性，封装选项确保紧凑设计。

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: K20P144M100SF2

Rev. 7, 02/2013

Supports the following:

MK20DX128ZVLQ10,

MK20DX128ZVMD10,

MK20DX256ZVLQ10,

MK20DX256ZVMD10,

MK20DN512ZVLQ10,

MK20DN512ZVMD10

K20 Sub-Family Data Sheet

K20P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 63

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................11

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 AC electrical characteristics..............................................12

5.2 Nonswitching electrical specifications...............................12

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements......13

LVD and POR operating requirements...............14

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......16

Power consumption operating behaviors............17

EMC radiated emissions operating behaviors....20

Designing with radiated emissions in mind.........21

Capacitance attributes........................................21

6.8.7

6.8.8

6.8.9

6.8.10

6.8.6

5.4.2

Thermal attributes...............................................23

6 Peripheral operating requirements and behaviors....................24

6.1 Core modules....................................................................24

6.1.1

6.1.2

Debug trace timing specifications.......................24

JTAG electricals..................................................25

6.2 System modules................................................................28

6.3 Clock modules...................................................................28

6.3.1

6.3.2

6.3.3

MCG specifications.............................................28

Oscillator electrical specifications.......................30

32 kHz Oscillator Electrical Characteristics........32

6.4 Memories and memory interfaces.....................................33

6.4.1

6.4.2

6.4.3

Flash electrical specifications.............................33

EzPort Switching Specifications.........................35

Flexbus Switching Specifications........................36

6.5 Security and integrity modules..........................................39

6.6 Analog...............................................................................39

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................39

CMP and 6-bit DAC electrical specifications......47

12-bit DAC electrical characteristics...................49

Voltage reference electrical specifications..........52

6.7 Timers................................................................................53

6.8 Communication interfaces.................................................53

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

USB electrical specifications...............................53

USB DCD electrical specifications......................54

USB VREG electrical specifications...................54

CAN switching specifications..............................55

DSPI switching specifications (limited voltage

range).................................................................55

DSPI switching specifications (full voltage

range).................................................................56

Inter-Integrated Circuit Interface (I2C) timing..... 58

UART switching specifications............................59

SDHC specifications...........................................59

I2S switching specifications................................60

5.3 Switching specifications.....................................................21

5.3.1

5.3.2

Device clock specifications.................................21

General switching specifications.........................21

6.9 Human-machine interfaces (HMI)......................................63

6.9.1

TSI electrical specifications................................63

7 Dimensions...............................................................................64

7.1 Obtaining package dimensions.........................................64

8 Pinout........................................................................................64

5.4 Thermal specifications.......................................................22

5.4.1

Thermal operating requirements.........................22

K20 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.

Freescale Semiconductor, Inc.

MK20DX256ZVLQ10R相似产品对比

	MK20DX256ZVLQ10R	PK20N512VLQ100
描述	ARM Microcontrollers - MCU Kinetis 256Kflex USB	ARM Microcontrollers - MCU KINETIS 512K USB (pre-qual sample)

MK20DX256ZVLQ10R