(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated V
R
, T
J
= 25°C)
Symbol
V
RRM
V
RWM
V
R
I
O
1.0
I
FRM
2.0
I
FSM
50
T
stg
T
J
dv/dt
−55 to 150
−55 to 125
10,000
°C
°C
V/ms
A
A
Value
20
Unit
V
A
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Lead (Note 2)
Thermal Resistance − Junction−to−Ambient (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm
2
).
Symbol
R
tjl
R
tjl
R
tja
R
tja
Value
26
21
325
82
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3), See Figure 2
(I
F
= 0.1 A)
(I
F
= 1.0 A)
(I
F
= 3.0 A)
Maximum Instantaneous Reverse Current (Note 3), See Figure 4
(V
R
= 20 V)
(V
R
= 10 V)
I
R
Symbol
V
F
T
J
= 25°C
0.34
0.45
0.65
T
J
= 25°C
0.40
0.10
Value
T
J
= 85°C
0.26
0.415
0.67
T
J
= 85°C
25
18
mA
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width
≤
250
ms,
Duty Cycle
≤
2%.
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2
MBR120LSF, NRVB120LSF
i
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
I
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
T
J
= 125°C
10
T
J
= 85°C
1.0
T
J
= 25°C
T
J
= 125°C
1.0
T
J
= 85°C
T
J
= −40°C
0.1
0.1
0.3
0.5
0.7
0.9
v
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
T
J
= 25°C
0.1
0.1
0.3
0.5
0.7
0.9
V
F
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
(VOLTS)
Figure 1. Typical Forward Voltage
I
R
, MAXIMUM REVERSE CURRENT (AMPS)
Figure 2. Maximum Forward Voltage
100E−3
I
R
, REVERSE CURRENT (AMPS)
T
J
= 125°C
1.0E+0
10E−3
100E−3
T
J
= 85°C
1.0E−3
T
J
= 85°C
10E−3
100E−6
T
J
= 25°C
1.0E−3
T
J
= 25°C
10E−6
100E−6
10E−6
0
5.0
10
15
20
V
R
, REVERSE VOLTAGE (VOLTS)
1.0E−6
0
5.0
10
15
20
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
25
45
65
85
105
I
pk
/I
o
= 10
I
pk
/I
o
= 20
dc
P
FO
, AVERAGE POWER DISSIPATION (WATTS)
I
O
, AVERAGE FORWARD CURRENT (AMPS)
freq = 20 kHz
0.7
0.6
0.5
I
pk
/I
o
= 10
0.4
I
pk
/I
o
= 20
0.3
0.2
0.1
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
I
O
, AVERAGE FORWARD CURRENT (AMPS)
I
pk
/I
o
= 5
I
pk
/I
o
=
p
SQUARE
WAVE
SQUARE
WAVE
I
pk
/I
o
=
p
I
pk
/I
o
= 5
dc
125
145
T
L
, LEAD TEMPERATURE (°C)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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3
MBR120LSF, NRVB120LSF
1000
T
J
, DERATED OPERATING
TEMPERATURE (°C)
125
120
115
110
105
100
95
90
85
80
75
70
65
0
2.0
4.0
6.0
324.9°C/W
400°C/W
8.0
10
12
14
16
18
20
R
qJA
= 25.6°C/W
T
J
= 25°C
C, CAPACITANCE (pF)
100
130°C/W
235°C/W
10
0
2.0
4.0
6.0
8.0
10
12
14
16
18
20
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, DC REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
Figure 8. Typical Operating Temperature
Derating*
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of T
J
therefore must include forward and reverse power effects. The allowable operating
T
J
may be calculated from the equation:
T
J
= T
Jmax
− r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable T
J
due to reverse bias under DC conditions only and is calculated as T
J
= T
Jmax
− r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
r(t), TRANSIENT THERMAL RESISTANCE
1000
D = 0.5
100
0.2
0.1
0.05
P
(pk)
0.01
1
SINGLE PULSE
0.1
0.000001 0.00001
0.0001
0.001
0.01
t
1
, TIME (sec)
0.1
1
10
100
1000
Test Type > Min Pad < Die Size 38x38 @ 75% mils
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
qJA
= 321.8
°C/W
10
Figure 9. Thermal Response
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4
MBR120LSF, NRVB120LSF
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
E
q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
MILLIMETERS
NOM
MAX
0.95
0.98
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
−
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
D
1
2
POLARITY INDICATOR
OPTIONAL AS NEEDED
A1
A
END VIEW
TOP VIEW
q
DIM
A
A1
b
c
D
E
L
H
E
q
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
H
E
SIDE VIEW
2X
c
RECOMMENDED
SOLDERING FOOTPRINT*
L
4.20
2X
1.25
2X
b
2X
1.22
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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